Bruce Guenin is a Principal Hardware Engineer at Oracle. He specializes in the development of advanced packaging technologies and in thermal and mechanical simulation and testing. He is an Associate Technical Editor of ElectronicsCooling Magazine and a past chairman of the JEDEC JC-15 Thermal Standards Committee and the Semi-Therm Conference. His contributions to the thermal sciences have been recognized by receiving the Harvey Rosten Award in 2004 and the Thermi Award in 2010. He received the B.S. degree in Physics from Loyola University, New Orleans, and the Ph.D. in Physics from the University of Virginia.
Maurice J. Marongiu is the co-owner of MJM Engineering Co. and
PCM Thermal Solutions, both engineering consulting firms.
He received his BS, MS and PhD degrees in mechanical engineering
from the U. of Illinois at Urbana. He has taught for over 10 years at
U. of Illinois at Urbana-Champaign, Texas A&M Univ., and IIT.
He has over 35 years’ experience in the thermal management fields
and has published over 30 papers and reports in conferences and publications.
