Due to the flexible manufacturing processes for producing BGA packages, there has been an explosion of new package designs, many of which contain more than one integrated circuit chip [1]. Existing industry standards for IC…read more
The Thermal Conductivity of Air at Reduced Pressures and Length Scales
November 1st, 2002
In several earlier issues of ElectronicsCooling, I discussed the thermal conductivity of air as a function of temperature and pressure. Therein, it was stated that the temperature dependence cannot be neglected, but that the pressure…read more
Selective Surfaces
November 1st, 2002
“Who’s that guy with the gigantic novelty scissors?” I asked. “That’s Percy,” Herbie said, “VP of the Biological Intercommunications Group, BIG for short. The Lost Pet Tracking System has been his baby since Day One.”…read more
Numerical Modeling and Experimental Verification of High-density Servers
November 1st, 2002
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a…read more
EMC and Thermal Design Conflicts in a PC
November 1st, 2002
Thermal and EMC design in high-speed digital electronics systems has become a battle of conflicting requirements. Faster switching has led to increased electromagnetic (EM) emissions due to the extended bandwidth of signals. Higher-density components are…read more
Electroosmotic Microchannel Cooling System for Microprocessors
November 1st, 2002
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and…read more
Electronic Information Exchange
November 1st, 2002
Electronic data exchange represents a very important link for integrating PCB electrical layout, analysis and mechanical design. It has become, in fact, the basis for enhanced economic and industrial growth. The Intermediate Data Format (IDF)…read more
Thermal joint conductance for graphite materials
August 1st, 2002
The heat flow across a metal/interstitial elastic-layer/metal joint is a very important problem in many microelectronic applications. It is generally known that when two surfaces are brought together, intimate solid-to-solid contact occurs only at discrete…read more
There’s something for everybody on talk radio
August 1st, 2002
I was doing my Sunday morning (2 a.m.) radio call-in show about electronics cooling (Hot Air on the Air with Tony K), when I heard a familiar voice on the line. “Herbie in Hereford,” I…read more
Simplified transient model for IC packages
August 1st, 2002
Previous installments of this column have all dealt with situations in which the die temperature was assumed to be at a constant temperature after the system had achieved the steady state. However, there are many…read more
Quick and easy fan/sink characterization
August 1st, 2002
It is often necessary to generate in-house pressure-drop and base-to-ambient thermal resistance data for ducted fan/heat sink assemblies. For reliable applicability of the performance data, the configuration of the test article should closely match the…read more
Pyrolytic graphite – thermal performance by structure
August 1st, 2002
Continuing our discussion of different forms of carbon, this column addresses the topic of pyrolytic graphite, a material that opens up many interesting applications not only for cooling but also for scientific measurement equipment. Pyrolytic…read more
Optical instrumentation for the thermal characterization of electronic devices
August 1st, 2002
What information does light, reflected from a running electronic device, carry? Our research team has been working upon this key question for almost a decade. As this magazine is dedicated to thermal issues, we will…read more
Effects of electrical noise on thermocouple measurements
August 1st, 2002
Measurements of temperature in electronic equipment and in thermal characterization apparatus are most often made with thermocouples. As with any sensor, the goal is to gather information about the environment in the vicinity of the…read more
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