It doesn’t take long for an electronics assembler to realize that a thermal interface material (TIM) is essential when two or more solid surfaces are in the heat path. Standard machined surfaces are rough and…read more
The Thermal Conductivity of Moist Air
November 1st, 2003
In the Tech Data series on thermal conductivity, gases – especially air – have been the subject of a few contributions. So far, the influence of two important parameters has been covered: temperature and pressure.…read more
The 45° Heat Spreading Angle – An Urban Legend?
November 1st, 2003
Ever hear about the 45° heat spreading angle? Most of us have. However, no one I’ve talked to seems to know where it came from. Is it an urban legend, such as alligators in the…read more
Problems with Thermal Interface Material Measurements: Suggestions for Improvement
November 1st, 2003
Preface Increasingly it is apparent that measuring the thermal properties of Thermal Interface Materials (TIMs) causes much irritation for vendors and users alike. This article focuses on various measurement and standardization aspects and offers a…read more
Prediction of Thermal Contact Resistance
November 1st, 2003
All engineering surfaces exhibit some level of microscopic roughness. The resistance to heat flow through a contact interface occurs because only a small portion (usually 1-2%) [1] of the nominal surface area is actually in…read more
Cooling Technology Options, Part 2
November 1st, 2003
(Editor’s Note: Part 1 of this article appeared in the August 2003 issue of ElectronicsCooling. Illustration references in this part begin with Figure 5.) Cooling electronic systems is one of the major focal points of…read more
Recognizing the Limits of Conventional Axial Hub-Motor AHS Devices
August 1st, 2003
Conventional axial hub-motor AHS (Active Heatsink) devices (Figure 1) have reached their functional and cost limits and may not be improved significantly. These devices have a number of inherent, severe contradictions (design limitations) that determine…read more
Hot Spots in Data Centers
August 1st, 2003
Heat loads of data processing equipment continue to increase at a rapid rate. This increasing heat load has been documented by a Thermal Management Consortium of 17 companies [1] as shown in Figure 1. Also…read more
E missivity in Practical Temperature Measurements
August 1st, 2003
When making temperature measurements with infrared cameras and point detectors, we are always facing the question of the emissivity of our sample. In practice we would like to have a single number set in the…read more
Cooling Technology Options
August 1st, 2003
(Editor’s Note: Part 2 of this article will appear in the November 2003 issue of ElectronicsCooling.) Cooling electronic systems is one of the major focal points of the design process and the key to a…read more
Cooling Issues for Automotive Electronics
August 1st, 2003
Electronic content in cars and trucks has significantly increased in the last 30 years. Much of the functional content of these vehicles is now generated or controlled by electronic systems. This trend will continue in…read more
Calculations for Thermal Interface Materials
August 1st, 2003
It’s no news to any of the readers of this publication that the increased power dissipation of integrated circuits has led to continuous refinement of package designs and component materials. This trend has increased the…read more
Thermal Capacitance
May 1st, 2003
When time enters the equations, the ability of a material to store or release heat becomes a crucial parameter. This issue’s technical data column is devoted to a basic understanding of thermal capacitance. Thermal capacity…read more
The Weakest Link in Air Cooling
May 1st, 2003
So far, this 21st Century has been a big disappointment. I grew up on the science fiction of the 1950′s and 60′s. Plus I knew that the stories of Jules Verne and H. G. Wells…read more
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