2006

Toward A Thermal Figure Of Merit For Multi-Chip Packages

November 1st, 2006

Toward A Thermal Figure Of Merit For Multi-Chip Packages Bruce M. Guenin, Ph.D., Associate Editor Introduction Last issue’s Calculation Corner dealt with methods for predicting the temperature of each chip in a Multi-Chip Package (MCP)…read more

Thermal Challenges In LED Cooling

November 1st, 2006

Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting…read more

The Seebeck Coefficient

November 1st, 2006

In this issue, we address the Seebeck coefficient, a property that determines the performance of thermocouples and Peltier elements. Basically, the Seebeck coefficient is related to the fact that electrons are both carriers of electricity…read more

Liquid Cooling Of A High-Density Computer Cluster

November 1st, 2006

Introduction Recent advances in computer clusters have resulted in the introduction of higher density server equipment that consumes significant amounts of electrical power and produces an extraordinary amount of heat. Due to this latter attribute,…read more

Effect Of Improved Thermoelectric Zts On Electronic Module Coolability

November 1st, 2006

In recent years there has been a growing interest in the application of thermoelectrics to electronics cooling. Attention has been focused on thermoelectric cooling both as a possible means to enhance module cooling and to…read more

Cooling Options And Challenges Of High Power Semiconductor Modules

November 1st, 2006

Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more

Thermal Conductivity of Solders

August 1st, 2006

Soldering has been a primary method of establishing mechanical and electrical connections in electronics for many years and will likely be used in this fashion in the future. While there are several physical properties and…read more

Solid-State Microrefrigerator on a Chip

August 1st, 2006

Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially. Limiting the maximum die temperature has resulted in an increase of…read more

So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages

August 1st, 2006

Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use…read more

Packaging Challenges For High Heat Flux Devices

August 1st, 2006

Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in…read more

Exploring the Limits of Air Cooling

August 1st, 2006

Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However,…read more

Comparing Liquid Coolants From Both A Thermal And Hydraulic Perspective

August 1st, 2006

In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the…read more

Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon

May 1st, 2006

Earlier issues of ElectronicsCooling showed the thermal conductivity for pure Si (May ’98), SiO2 (Aug ’04) and III-V semiconductors (Feb ’06). This column focuses on doped Si, porous Si and isotopically pure Si. Table 1.…read more

On-Chip Electrowetting Cooling

May 1st, 2006

Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the…read more