Toward A Thermal Figure Of Merit For Multi-Chip Packages Bruce M. Guenin, Ph.D., Associate Editor Introduction Last issue’s Calculation Corner dealt with methods for predicting the temperature of each chip in a Multi-Chip Package (MCP)…read more
Thermal Challenges In LED Cooling
November 1st, 2006
Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting…read more
The Seebeck Coefficient
November 1st, 2006
In this issue, we address the Seebeck coefficient, a property that determines the performance of thermocouples and Peltier elements. Basically, the Seebeck coefficient is related to the fact that electrons are both carriers of electricity…read more
Liquid Cooling Of A High-Density Computer Cluster
November 1st, 2006
Introduction Recent advances in computer clusters have resulted in the introduction of higher density server equipment that consumes significant amounts of electrical power and produces an extraordinary amount of heat. Due to this latter attribute,…read more
Effect Of Improved Thermoelectric Zts On Electronic Module Coolability
November 1st, 2006
In recent years there has been a growing interest in the application of thermoelectrics to electronics cooling. Attention has been focused on thermoelectric cooling both as a possible means to enhance module cooling and to…read more
Cooling Options And Challenges Of High Power Semiconductor Modules
November 1st, 2006
Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more
Thermal Conductivity of Solders
August 1st, 2006
Soldering has been a primary method of establishing mechanical and electrical connections in electronics for many years and will likely be used in this fashion in the future. While there are several physical properties and…read more
Solid-State Microrefrigerator on a Chip
August 1st, 2006
Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially. Limiting the maximum die temperature has resulted in an increase of…read more
So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages
August 1st, 2006
Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use…read more
Packaging Challenges For High Heat Flux Devices
August 1st, 2006
Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in…read more
Exploring the Limits of Air Cooling
August 1st, 2006
Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However,…read more
Comparing Liquid Coolants From Both A Thermal And Hydraulic Perspective
August 1st, 2006
In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the…read more
Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon
May 1st, 2006
Earlier issues of ElectronicsCooling showed the thermal conductivity for pure Si (May ’98), SiO2 (Aug ’04) and III-V semiconductors (Feb ’06). This column focuses on doped Si, porous Si and isotopically pure Si. Table 1.…read more
On-Chip Electrowetting Cooling
May 1st, 2006
Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the…read more
Recent Posts
- Thermal Spreading and More Using Open-Source FEA Software
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- Epoxy Meets UL94V-0 Specifications
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- Revisions for CPU Coolers for Intel Xeon
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