2010

Electromagnetic, Thermal, Stress and Deformation Analysis of a Space-Based Satellite Dish Antenna

December 28th, 2010

This paper presents a multiphysics analysis of a space-based communication satellite antenna. Electromagnetic losses due to induced high-frequency surface currents lead to partial, asymmetric heating of the structure, causing stress and deformation. A final electromagnetic…read more

20 MW Flywheel Frequency Regulation Plant Nears Completion

December 27th, 2010

Beacon Power Corporation has made substantial progress toward completion and partial start-up of the 20-megawatt (MW) flywheel frequency regulation plant the company is building in Stephentown, N.Y. More than 10 MW of energy storage capacity…read more

LED Chip Manufacturing Facility Opens in Huizhou, China

December 27th, 2010

Cree Huizhou Solid State Lighting Co., Ltd. marked the opening on Dec. 8 of its LED chip manufacturing facility at the Huizhou Zhongkai High-tech Industrial Development Zone in Huizhou City, Guangdong Province, China. Cree signed…read more

Computers that Recycle Energy among Top IT Innovations

December 27th, 2010

Computers that can recycle energy are among the scenarios IBM Corp. predicts over the next five years as part of its annual “Next Five in Five” year-end innovations report based on technologies being developed in…read more

New Snap-in Aluminum Electrolytic Capacitors

December 27th, 2010

TDK-EPC, a group company of TDK Corporation, has developed snap-in aluminum electrolytic capacitors from EPCOS that enable optimal contact to heat sinks. This permits link circuit capacitors to be efficiently cooled, significantly increasing their ripple current…read more

Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling

December 27th, 2010

Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated…read more

Resettable Thermal-Magnetic Circuit Breakers with Push-in Bridging

December 27th, 2010

Phoenix Contact’s UT 6-TMC M thermal-magnetic circuit breakers protect electrical circuits from overload or short circuit damage, make wiring easier and eliminate time-consuming troubleshooting. One wire powers all the breakers, which means each circuit breaker…read more

Beer Fridge – A Case Study in Thermal Design. Part 2 – TEC Effect

December 21st, 2010

Beer drinkers are notoriously quiet people and as such would not want to be disturbed by the continuous hissing and whirring of a classic compression/expansion refrigeration cycle type beer fridge. They would argue that’s why both kids and kitchens were invented. Kitchens to put the noisy fridge in, kids to go get the next beer. [...]

Taking the Enterprise Data Center into the Cloud: Achieving a Flexible, High-Availability Cloud Computing Infrastructure

December 14th, 2010

This white paper provides a detailed overview of cloud computing technology, including a standard definition of cloud computing, common types of cloud architectures and services, and driving factors and perceived risks impacting widespread adoption. It…read more

Lowest Resistance, Zero Pump-Out Thermal Pad

December 14th, 2010

AOS Thermal Compound’s Micro-Faze® 3 A-4 is a non-silicone thermal pad that exhibits extremely low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease. The pad is composed of…read more

TECs for Larger Heat Pumping Applications

December 14th, 2010

Nextreme Thermal Solutions recently introduced the eTEC HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements. At 85°C,…read more

New Small Form Factor Conduction Cooled Chassis

December 14th, 2010

Curtiss-Wright Controls Electronic Systems has introduced a new, rugged 6-slot 3U OpenVPX (or 7-slot 3U CompactPCI) conduction cooled chassis for harsh military environments. The SFF-6 Small Form Factor Chassis is the newest member of Electronic…read more

New PCB Heater Assemblies for Low Temperature Applications

December 14th, 2010

Spectrum Sensors & Controls has developed a new series of printed circuit board (PCB) heater assemblies for use in applications where sensitive electronics need to operate at very cold temperatures, or where electronics need a…read more

IMAPS Honors Member with President’s Award

December 14th, 2010

Steven J. Adamson, Nordson ASYMTEK marketing specialist, was honored with IMAPS’ 2010 President’s Award for dedicated efforts in ensuring a successful reorganization of the IMAPS Microelectronics Foundation and increasing its financial resources. IMAPS (International Microelectronics…read more