This paper presents a multiphysics analysis of a space-based communication satellite antenna. Electromagnetic losses due to induced high-frequency surface currents lead to partial, asymmetric heating of the structure, causing stress and deformation. A final electromagnetic…read more
Electromagnetic, Thermal, Stress and Deformation Analysis of a Space-Based Satellite Dish Antenna
December 28th, 2010
20 MW Flywheel Frequency Regulation Plant Nears Completion
December 27th, 2010
Beacon Power Corporation has made substantial progress toward completion and partial start-up of the 20-megawatt (MW) flywheel frequency regulation plant the company is building in Stephentown, N.Y. More than 10 MW of energy storage capacity…read more
LED Chip Manufacturing Facility Opens in Huizhou, China
December 27th, 2010
Cree Huizhou Solid State Lighting Co., Ltd. marked the opening on Dec. 8 of its LED chip manufacturing facility at the Huizhou Zhongkai High-tech Industrial Development Zone in Huizhou City, Guangdong Province, China. Cree signed…read more
Computers that Recycle Energy among Top IT Innovations
December 27th, 2010
Computers that can recycle energy are among the scenarios IBM Corp. predicts over the next five years as part of its annual “Next Five in Five” year-end innovations report based on technologies being developed in…read more
New Snap-in Aluminum Electrolytic Capacitors
December 27th, 2010
TDK-EPC, a group company of TDK Corporation, has developed snap-in aluminum electrolytic capacitors from EPCOS that enable optimal contact to heat sinks. This permits link circuit capacitors to be efficiently cooled, significantly increasing their ripple current…read more
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
December 27th, 2010
Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated…read more
Resettable Thermal-Magnetic Circuit Breakers with Push-in Bridging
December 27th, 2010
Phoenix Contact’s UT 6-TMC M thermal-magnetic circuit breakers protect electrical circuits from overload or short circuit damage, make wiring easier and eliminate time-consuming troubleshooting. One wire powers all the breakers, which means each circuit breaker…read more
Beer Fridge – A Case Study in Thermal Design. Part 2 – TEC Effect
December 21st, 2010
Beer drinkers are notoriously quiet people and as such would not want to be disturbed by the continuous hissing and whirring of a classic compression/expansion refrigeration cycle type beer fridge. They would argue that’s why both kids and kitchens were invented. Kitchens to put the noisy fridge in, kids to go get the next beer. [...]
Taking the Enterprise Data Center into the Cloud: Achieving a Flexible, High-Availability Cloud Computing Infrastructure
December 14th, 2010
This white paper provides a detailed overview of cloud computing technology, including a standard definition of cloud computing, common types of cloud architectures and services, and driving factors and perceived risks impacting widespread adoption. It…read more
Lowest Resistance, Zero Pump-Out Thermal Pad
December 14th, 2010
AOS Thermal Compound’s Micro-Faze® 3 A-4 is a non-silicone thermal pad that exhibits extremely low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease. The pad is composed of…read more
TECs for Larger Heat Pumping Applications
December 14th, 2010
Nextreme Thermal Solutions recently introduced the eTEC HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements. At 85°C,…read more
New Small Form Factor Conduction Cooled Chassis
December 14th, 2010
Curtiss-Wright Controls Electronic Systems has introduced a new, rugged 6-slot 3U OpenVPX (or 7-slot 3U CompactPCI) conduction cooled chassis for harsh military environments. The SFF-6 Small Form Factor Chassis is the newest member of Electronic…read more
New PCB Heater Assemblies for Low Temperature Applications
December 14th, 2010
Spectrum Sensors & Controls has developed a new series of printed circuit board (PCB) heater assemblies for use in applications where sensitive electronics need to operate at very cold temperatures, or where electronics need a…read more
IMAPS Honors Member with President’s Award
December 14th, 2010
Steven J. Adamson, Nordson ASYMTEK marketing specialist, was honored with IMAPS’ 2010 President’s Award for dedicated efforts in ensuring a successful reorganization of the IMAPS Microelectronics Foundation and increasing its financial resources. IMAPS (International Microelectronics…read more
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