Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices, such as a laptop, twice as well as copper. The development of GE’s prototype substrate, which utilizes phase-change-based heat transfer, is part of a four-year, $6 million program funded by the Defense Advanced Research Program Agency (DARPA).
Breakthrough Thermal Material System to Enable Faster Computing
Get our newsletter delivered to your email inbox.
- Underwater Data Center Test Proves Successful
- New High-Performance, Conforming TIM
- New Lithium-Ion Battery Prevents Itself from Overheating
- Electronics Cooling Tech Adapted for Organ Transport by Drones
- Keysight Test-Drive 2016 Seminar
- SEMI-THERM 2016
- Guarantee Reliability with Thermal Cycling Webinar
- ASD Days UK 2016
"Electronics Cooling” Seeks Technical Editor
As part of our continued growth, Electronics Cooling is searching for an additional Technical Editor to support the sourcing and production of content.
- Home 122,349 views
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 49,343 views
- The Seebeck Coefficient 35,321 views
- Advances In High-Performance Cooling For Electronics 32,555 views
- How to Select a Heat Sink 28,697 views
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 26,265 views
- The Temperature Ratings Of Electronic Parts 24,974 views
- The thermal conductivity of rubbers/elastomers 24,370 views