Scientists in GE’s Global Research Center have demonstrated an advanced thermal material system that could lead to faster computing and higher performing electronic systems. They have fabricated a prototype substrate that can cool electronic devices, such as a laptop, twice as well as copper. The development of GE’s prototype substrate, which utilizes phase-change-based heat transfer, is part of a four-year, $6 million program funded by the Defense Advanced Research Program Agency (DARPA).
Breakthrough Thermal Material System to Enable Faster Computing
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the December 2014 issue
of Electronics Cooling, which includes feature articles on Carbon-Based Thermal Interface Material; Leakage Power; Thermal Considerations in LED System Modeling; and more!
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