Military programs continue to push the limits of computing system requirements necessitating rugged computer systems to continue to evolve to endure the toughest conditions. To meet these requirements, rugged subsystems suppliers have to produce innovative thermal management technologies that can withstand situations that may threaten a computer’s durability. Due to ever-increasing processor speeds, advances in thermal management will continue to rank as one of the most important trends in rugged computing design.
Military Demands Propel Thermal Management Solutions
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- Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat Rejection
- Quiet CPU Coolers for Intel Xeon Workstations and Servers
- Temperature Controller for Thermoelectric Modules and Supplemental Resistive Heaters
- Fans for Low-Noise, Low-Airflow Applications
- Programmable Digital Temperature Control for Electronic Enclosures
- U.S. Patent for Two-Stage Enclosure Coolers Awarded
- Company Acquires Thermal and Vacuum Product Manufacturer
- Thermal Spreading and More Using Open-Source FEA Software
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
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- The Seebeck Coefficient 3 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 18 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
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