Military programs continue to push the limits of computing system requirements necessitating rugged computer systems to continue to evolve to endure the toughest conditions. To meet these requirements, rugged subsystems suppliers have to produce innovative thermal management technologies that can withstand situations that may threaten a computer’s durability. Due to ever-increasing processor speeds, advances in thermal management will continue to rank as one of the most important trends in rugged computing design.
Military Demands Propel Thermal Management Solutions
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the June 2014 issue
of Electronics Cooling, which includes articles on Solder Joint Lifetime of Rapidly Cycled LED Components; Advances in Vapor Compression Electronics Cooling; and more.
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- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Seebeck Coefficient 5 comment(s)
- Advances In High-Performance Cooling For Electronics 13 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Heat Pipes for Electronics Cooling Applications 9 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 20 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
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