IEC/TS 62332-1:2011(E) is applicable to EIS containing solid and liquid components where the thermal stress is the dominant ageing factor, without restriction to voltage class. This part specifies a dual-temperature test procedure for the thermal evaluation and qualification of electrical insulation systems (EIS). The following significant technical changes with respect to the previous edition have been made – Modifications have been made based on an extensive test series conducted using this methodology given in the first edition. This included updating expected times and tempertatures to use in order to obtain useful results, as well as making the range of equipment covered broader. The method can now cover electrotechnical devices using different sealing systems, as well as devices using enamel covered wires.
Electrical Insulation Systems Standard
Get our newsletter delivered to your email inbox.
- Extreme-Temperature Probing Solutions Offered
- New Synthetic ‘Water Adhesive’ Stronger than Natural Adhesives
- Viable Energy Storing Solution Combines Metal Nitrides and Graphene
- Researchers Use Infrared Laser to Refrigerate Liquids
- New Soft TIM with Low Thermal Resistance
- High Temperature Resistant, Thermal Conductive System Meets ASTM E595 Specifications
- Graphene Can Now Be Applied to Thermal Imaging Devices
- Compact PC with Liquid Cooling System
Toyota (TRINA) invites proposals for Advanced Thermal Management Research collaboration in bonding and heat spreading technologies.
Deadline: December 13, 2015
- Home 122,349 views
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 46,127 views
- The Seebeck Coefficient 33,484 views
- Advances In High-Performance Cooling For Electronics 30,652 views
- How to Select a Heat Sink 26,271 views
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 24,387 views
- The Temperature Ratings Of Electronic Parts 22,594 views
- The Thermal Conductivity of Moist Air 22,132 views