IEC/TS 62332-1:2011(E) is applicable to EIS containing solid and liquid components where the thermal stress is the dominant ageing factor, without restriction to voltage class. This part specifies a dual-temperature test procedure for the thermal evaluation and qualification of electrical insulation systems (EIS). The following significant technical changes with respect to the previous edition have been made – Modifications have been made based on an extensive test series conducted using this methodology given in the first edition. This included updating expected times and tempertatures to use in order to obtain useful results, as well as making the range of equipment covered broader. The method can now cover electrotechnical devices using different sealing systems, as well as devices using enamel covered wires.
Electrical Insulation Systems Standard
Get our newsletter delivered to your email inbox.
- New Business Development Specialist Seeks Position
- ‘Advanced Composite Thermal Management Materials and Applications’ Webinar to Take Place
- Preventing Thermal & Vibration Failures in Electronic Equipment
- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
- The Seebeck Coefficient 3 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 15 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
- No public Twitter messages.