What do you call someone who doesn’t believe in Father Christmas? A rebel without a Claus. Right, that’s that out of the way. This week Facebook announced that it plans to build a 3x 300,000…read more
Company Patents Improved Design for Cooling Electronic Modules
October 25th, 2011
Northrop Grumman Corporation has received a patent for a new design to improve the cooling efficiency of a removable electronic module through enhancements to its physical design, and has begun to license it to other…read more
New 4-Foot-Long Vapor-Proof LED Light
October 25th, 2011
Larson Electronics’ Magnalight’s new vapor proof LED light fixture has a 50,000 hour service life rating and multi-voltage capability. The GVP-48-2L-LED, four foot long, two lamp LED light fixture is designed for those who wish…read more
High Speed Thermal Imaging Cameras
October 25th, 2011
Wahl Instruments, Inc.’s new generation of Wahl Heat Spy high speed 30 hertz, 160×120 pixels, Thermal Imaging Cameras are available in two series with 16 different configurations to suit a variety of applications. The z30…read more
Transformers for LED Tube Lighting
October 25th, 2011
Wurth Electronics Midcom’s new T8 transformer series is specifically designed for T8 sized tube LED applications. The patent-pending designs feature half-rounded cores to maximize core cross-sectional area. Up to 30W power is available on the…read more
LED LightBAR System Delivers Improved Lumen Output
October 25th, 2011
Cooper Lighting has upgraded its outdoor LED LightBAR™ technology. The new system’s optical performance delivers improved lumen output and efficiency, while continuing to offer up to 75% in energy savings over traditional High Intensity Discharge…read more
Electrical Insulation Systems Standard
October 25th, 2011
IEC/TS 62332-1:2011(E) is applicable to EIS containing solid and liquid components where the thermal stress is the dominant ageing factor, without restriction to voltage class. This part specifies a dual-temperature test procedure for the thermal…read more
New Superconductor Fibers Carry 40 Times More Electricity
October 25th, 2011
Researchers at Tel Aviv University have developed superconducting wires using fibers made of single crystals of sapphire to be used in high powered cables. Factoring in temperature requirements, each tiny wire can carry approximately 40…read more
Bristly Particles Could Manage Heat Flow in Electronics
October 25th, 2011
A well-known method of making heat sinks for electronic devices is a process called sintering, in which powdered metal is formed into a desired shape and then heated in a vacuum to bind the particles…read more
LED Driver IC Market Buoyed by Growth in Backlights
October 25th, 2011
A new report from Strategies Unlimited finds that the market for LED driver ICs is sizeable at $2 billion in 2010, buoyed by strong growth in LED backlights in mobile phones, TVs, and monitors. Innovations…read more
6SigmaDC Datacenter Conference and User Group
October 24th, 2011
Nov. 15, San Francisco, Calif. The 2011 6SigmaDC event will host an extended agenda, with an open day of presentations and talks from 6SigmaDC users Facebook, Intel and other industry heavyweights. Attendees will be educated…read more
25th European Workshop on Thermal and ECLS Software
October 24th, 2011
Nov. 8-9, Noordwijk, The Netherlands The 25th annual European Workshop on Thermal and ECLS Software, organised by the Analysis and Verification Section of the Thermal Division, ESTEC, will be held on: Tuesday 8th and Wednesday…read more
All Detailed Thermal IC Package Models are Wrong… Probably
October 20th, 2011
‘Rubbish In -> Rubbish Out’ is a well accepted fact in the world of simulation. Regardless of the technical capabilities of your thermal simulation tool, the accuracy of prediction will always be tightly coupled to…read more
Underfloor Electric Heating. Part III – Penny wise, pound foolish.
October 18th, 2011
It would only have cost me an extra £170, a small extra compared to the cost of the rest of the build, but I decided against laying thermal insulation boards directly under the underfloor electric…read more
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- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
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- Nanoscale Heat Transfer Research Awarded Air Force Grant
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- Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced
- Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology
- IBM Awarded Contract in First Phase of DARPA ICECool Program
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