ElectronicsCooling Business Bulletin Volume 5 | December 2011 According to a recent study by BBC Research, the global market for thermal management products, which currently stands at approximately $8 billion, is expected to grow over…read more
Editorial: Looking Back
November 22nd, 2011
In the editorial in the fall issue of ElectronicsCooling, my good friend and colleague Clemens Lasance wrote, “It is the privilege of an editor to discuss any subject that comes to mind, as long as…read more
Thermal Facts and Fairy Tales: Heat Sinks, Heat Exchangers and History
November 22nd, 2011
As far as history goes, the field of electronics cooling does not have a very long past. A rather quick look through my personal reference material that is strictly geared towards cooling electronics had at…read more
Technical Brief: Design Considerations for High Performance Processor Liquid Cooled Cold Plates
November 22nd, 2011
The meteoric rise in cooling requirements of commercial computer products has been driven by an exponential increase in microprocessor performance over the last decade. The conventional way to cool microprocessors has been to utilize air…read more
Focus on Fans Delivers Cost Savings on Cooling
November 22nd, 2011
Data center managers who are under pressure to cut costs may find that pressure is their ally – air pressure, that is. Experts in data center cooling said that minor adjustments to fan speed in…read more
Calculation Corner: Transient Modeling of a High-Power IC Package, Part 1
November 22nd, 2011
There is an increasing need for calculating integrated circuit temperatures during conditions of changing chip power. Varying computer workloads and the implementation of power-saving strategies are leading to greater variability in chip power levels than…read more
Efficient Electro-Thermal Simulation of Power Semiconductor Devices via Model Order Reduction
November 22nd, 2011
Thermal management is an increasingly important consideration in the development of power electronic systems. Electro-thermal simulation is required at the system level in order to ensure under realistic loads the fulfillment of thermal requirements, which…read more
The Increasing Challenge of Data Center Design and Management: Is CFD a Must?
November 22nd, 2011
Data centers have been cooled for many years by delivering cool air to the IT equipment via the room. One of the key advantages of this approach is the flexibility that it provides the owner/operator…read more
Energy Reduction and Performance Maximization through Improved Cooling
November 22nd, 2011
The International Technology Roadmap for Semiconductors [1] predicts high performance processor power density to more than double by the year 2024, while during the same time allowable junction temperature will decrease from 90oC to 70oC,…read more
Variable Speed EC Fans Make Data Center Condenser More Efficient
November 22nd, 2011
When a major UK financial institution for retail and commercial banking underwent a major refurbishment program earlier this year, it replaced the IT and computer server systems in one of the two data center’s data…read more
Guidelines for Reporting and Using Electronic Package Thermal Information
November 22nd, 2011
This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between…read more
Researchers Create Cheap Thermoelectric Materials
November 22nd, 2011
A team led by Dr Ole Martin Løvvik of Oslo University’s Centre for Materials Science and Nanotechnology in Norway has found a way of making cheap thermoelectric materials that could harvest waste heat from a…read more
Thermal and Power Management in Airborne Platforms
November 22nd, 2011
Avionics systems designers and systems integrators are faced with the challenge of size, weight, and power (SWaP) constraints. Commercial, business, and military aviation customers increasingly desire modern avionics—whether installing in new aircraft platforms, or retrofitting…read more
Companies Announce Partnership for Global Distribution
November 21st, 2011
Mouser Electronics, Inc. and The Bergquist Company have signed a global distribution agreement. Under the new agreement, Mouser will distribute Bergquist’s portfolio of thermal management materials, which includes Sil-Pad®, thermally conductive insulators and various specialty…read more
Recent Posts
- Heatsink System with Modular Cooling Benefits Released
- Rand Worldwide Acquires Thermal Simulation Services Provider
- Counter-Rotating Fans for High-Density Electronic Enclosures
- “Transverse” Thermoelectric Effect May Lead to Better Cooling Devices
- Effectively Leveraging CAD Data in Electronics Thermal Simulation
- Beware… When Cooling Practices Fail! Webinar Part II
- Not Needing to Adjust Hot-Wire Anemometer Reading for Elevated Temperatures. Why Not?
- ‘Normalized Transient Thermal Response’ Curves – Can You be More Clear?
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