January, 2012

Bottlenecks and Interface Materials; Part 2 – When TIMs Go Bad

January 30th, 2012

‘Bits stuck onto other bits’, a succinct definition of an electronic product, if not a product that contains electronics. Soldering is the method of choice for getting the components to attach to the pcb, the…read more

Has Your Brand Image Been Hijacked?

January 25th, 2012

Electronics Cooling Business Bulletin Volume 6 | January 2012 In a recent article entitled “Who is Managing Your Brand Image?” my colleague, Graham Kilshaw, explained how customer behavior has effected a significant shift in marketing,…read more

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Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point

January 22nd, 2012

By far and away the most common enquiry by someone using FloTHERM, especially at the start of their adoption, is “How do I model my components?”. This is hardly surprising as the mainstay of electronics…read more

Bottlenecks and Interface Materials; Part 1 – Great Thermal Bedfellows

January 18th, 2012

Probably due to the beer fridge, I now seem to be becoming the repository of broken electronic products with an expectation that the cause of their demise can be identified, retrospectively, using thermal simulation. This…read more

Mersen Acquires Laminated Busbar Company

January 17th, 2012

Mersen has completed the acquisition of Eldre as part of Mersen’s strategy to support its partners in the development of the power electronic application market with the critical components that improve system reliability and safety.…read more

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Coolers Utilize Aerospace Fluid-Bearing Technology

January 17th, 2012

Inspired by expertise from the Aerospace Industry, Jaro’s new MR-16 LED coolers optimize longevity and temperature with a highly-efficient fluid-bearing structure.  At speeds of up to 4200RPM±15%, these very quiet DC coolers provide a chilly,…read more

Company Launches YouTube Channel for Engineers

January 17th, 2012

Today Fujipoly America announced the launch of a YouTube channel that will provide engineers with 24/7 access to useful technical information on Thermal Interface Materials and Elastomeric Connectors. The company’s first video post includes a…read more

40 GHz Bandwidth Socket for 16x16mm, 0.8mm Pitch BGA Packages

January 17th, 2012

Ironwood Electronics’ new high performance BGA socket product line uses elastomer capable of high speed, low inductance, high endurance and wide temperature applications. The SM-BGA-9006 socket is designed for 16X16 mm package size and operates at…read more

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Company Launches New Energy Efficiency Center

January 17th, 2012

TÜV SÜD America Inc. has opened a new 30,000 square foot Energy Efficiency Center of Excellence located just north of Atlanta, Ga. The new NVLAP* 17025-accredited laboratory allows TÜV SÜD to test and certify products…read more

Molten Metal Ceramic Sheath Thermocouple

January 17th, 2012

Omega’s new NEP-TX series of molten metal ceramic sheath thermocouples features a 1250 degrees Celsius (2282 degrees Fahrenheit) temperature rating, connection head with terminal block and corrosion resistance. Standard construction includes cast iron NEP-TX connection…read more

New Liquid-Cooled LED as Bright as 100W Bulb

January 17th, 2012

SWITCH Lighting’s™ SWITCH bulbs have a ring of metal prongs, each with a computer chip on it to emit light, which is immersed in liquid that fills each bulb. The liquid cools the chips while…read more

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Lighting-Class LEDs Deliver Twice the Lumens-Per-Dollar

January 17th, 2012

Cree, Inc.’s new XLamp® XB-D LED delivers twice the lumens-per-dollar of other LEDs, in a small lighting-class footprint of 2.45 mm x 2.45 mm. The XB-D LED is 48 percent smaller than the XLamp XP…read more

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Wireless Shortcut to Avoid Data Center Traffic Jams

January 17th, 2012

To better handle data center congestion, researchers are testing a shortcut that doesn’t involve costly rewiring. They are experimenting with wireless links, mounted atop the server racks, to supply extra bandwidth for moving data along…read more

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New Graphene Material Conducts Heat Faster than Silicon

January 17th, 2012

A new graphene material capable of conducting heat 20 times faster than silicon could make the next generation of electronic devices quieter and longer-lasting. The experimental graphene made by U.S. and Chinese researchers has also…read more

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