March, 2012

Range of Diamond Materials Used in Thermal Management Applications

March 21st, 2012

Element Six has developed a range of polycrystalline diamond and synthetic diamond composite materials that can be used in a wide range of thermal management applications. Synthetic diamond is an ideal material for a range…read more

Non-Silicone Thermal Interface Products

March 20th, 2012

AOS Thermal Compounds showcased its thermally conductive interface material, thermal grease and gap filler at SEMI-THERM 28 in San Jose, California. The company’s Micro-Faze®A is a dry-to-touch thermal interface pad formulated with non-silicone thermal grease.…read more

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Thermal Interface Materials Improve Heat Management

March 19th, 2012

Intermark offers thermal interface materials (silicone based, silicone free, EMC and Thermal management dual function types), heat spreader sheets, thin thermal tape, and other solutions to improve the heat management of any application including LED Lighting, laptops,…read more

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SEMI-THERM Awards Professor of Energy Technology

March 19th, 2012

SEMI-THERM is pleased to announce Alfonso Ortega, Ph.D. as the recipient for the Harvey Rosten Award for his paper “An Investigation of Multi-Layer Mini-Channel Heat Sinks with Channel Geometric Sponsored by Mentor Graphics, Mechanical Analysis…read more

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SEMI-THERM Honors Contributor to Semiconductor Thermal Management

March 19th, 2012

The THERMI award is intended to recognize a recipient’s history of contributions to crucial thermal issues affecting the performance of semiconductor devices and systems. The voting body of past THERMI winners and the current year…read more

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Interview with SEMI-THERM 28 General Chair

March 19th, 2012

Listen to an interview with SEMI-THERM’s General Chair Herman Chu, Principal Chair at Cisco, by Graham Bell of SEMI-THERM Media Sponsor PCBCafe.com. Herman talks about the inflection point we are undergoing right now with thermal…read more

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Gap Fillers and Thermal Greases on Display at SEMI-THERM

March 19th, 2012

Fujipoly will be at SEMI-THERM showcasing its Sarcon® 50G-Hm high performance, low resistance gap filler pad, Sarcon® GR-SL low compression thermal gap filler material, and Sarcon® SG-26SL silicone-based thermal grease. The Sarcon® 50G-Hm is manufactured…read more

Electronics Cooling Buyers’ Guide Issue Now Online

March 15th, 2012

Don’t miss out on the March 2012  issue of Electronics Cooling, which includes the 2012 Buyers’ Guide, feature articles on Iconic Winds: A New Frontier for Air Cooling, Thermal Ground Plane Technology Impacts Electronics Packaging,…read more

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Enhancement of Microchannel Cooling with Oblique Technology

March 14th, 2012

Microchannel cooling has emerged as an effective method to enhance cooling for electronics devices [1]. However, the problem of boundary layer development, as liquid coolant travels downstream, persists in conventional microchannel heatsinks. Consequently, convective heat…read more

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Thermal Ground Plane Vapor Chamber Heat Spreaders for High Power and Packaging Density Electronic Systems

March 14th, 2012

SINCE 2008, collaborative research conducted at Raytheon Company, Thermacore Incorporated, Purdue University and Georgia Tech Research Institute has pursued the development of Thermal Ground Plane (TGP) technology. The DARPA-sponsored Radio Frequency Thermal Ground Plane (RFTGP)…read more

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Calculation Corner: Transient Modeling of a High Power IC Package, Part 2

March 13th, 2012

Part 1 can be found here. Part 1 of this article provided the groundwork for the present discussion [1]. It demonstrated the use of three different methodologies for performing a transient thermal analysis of a…read more

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Ionic Winds: A New Frontier for Air Cooling

March 13th, 2012

AIR-COOLING IS THE oldest and, in many ways, the easiest method of cooling electronics, whether it be through fan-driven forced convection or simply natural convection. However, with the increasing speed of processors, shrinking of form…read more

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Thermal Facts & Fairy Tales: Heat Spreading Revisited

March 13th, 2012

AS PROMISED IN MY editorial of the 2011 Fall issue, I will devote this issue’s column on the topic of heat spreading. The reason is that I, while writing a white paper on basic thermal…read more

Editorial: Forward Looking

March 13th, 2012

IN THE LAST WINTER ISSUE OF ELECTRONICS COOLING, our friend and colleague Bob Simons used his editorial column to inform us that he was resigning his position as an associate technical editor and this issue…read more

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