New Family of Highly Thermally-Conductive Bonding Materials

Applied Nanotech Holdings, Inc. has unveiled a new family of highly thermally-conductive bonding and printed materials called THERCOBOND™ for power electronics and photonics applications.

THERCOBOND™ materials are specially designed for power electronic device packaging and dielectric coating, with an optimal combination of thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wettability, and printability.

THERCOBOND™ materials can easily be applied on various substrates by conventional screen printing, drawdown, and even inkjet and other printing approaches to form thermally conductive dielectric layers for printed circuit board (PCB) applications as well as other electronic packaging needs.

Learn more from Applied Nanotech.