TECs

Research Program Attempts Embedded Cooling

June 11th, 2012

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DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program seeks to explore embedded thermal management by bringing microfluidic cooling inside the substrate, chip or package by including thermal management in the earliest stages of electronics design.

This embedded cooling comes in the form of microchannels designed and built directly into chips, substrates and packages. ICECool Fundamentals is seeking proposals for new research into the microfabrication and evaporative cooling techniques needed to implement embedded cooling. The program is also seeking intrachip/interchip solutions that bring microchannel and micropores into the design and fabrication of chips.

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