Thin-film TEC Improves Cooling Performance

June 11th, 2012


Nextreme Thermal Solutions announced the availability of new thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature of 25°C. This new level of performance translates to improved cooling efficiency, lower input power requirements, and greater opportunities for solving thermal issues in electronics, photonics and avionic applications.
The thin-film module can pump up to a maximum power density (Qmax/area) of 120 W/cm² with a response time on the order of milliseconds. The miniature size and heat pumping capability make thin-film thermoelectric modules ideal for cooling laser diodes, photodiodes, LEDs, infrared sensors, pump lasers, crystal oscillators, and optical transceivers.

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