Fuji Polymer Industries Co. has released Sarcon 30HR, a silicone-based thin film that exhibits a 1.7 W/m°K thermal conductivity when placed between a heat source and a nearby heatsink. This thermal interface medium eliminates air…read more
EE confesses he never earned degree in his own obituary
July 23rd, 2012
Val Patterson, 59, an electronic engineer from Salt Lake City, died of throat cancer July 10. He wrote his own obituary last fall, using the piece to confess to some actions he made in life:…read more
Heat Sink Extrusions Meet Space Constraints of LED Light Engines
July 23rd, 2012
Ohmite Wakefield Solutions’ 19000 Series of radial-fin heat sink extrusions for LED light engines helps meet space constraints and operating parameters. The heat sink extrusions are black anodized for maximum thermal performance, and their radial-fin…read more
CPU Cooler Fan for Maximum Cooling Performance
July 23rd, 2012
LEPA introduces its Vortex fan, which uses fluid mechanics to generate a powerful air twirl that concentrates cool air on the hot spots inside a system. At full speed, the Vortex fan achieves a static…read more
Safety Standards for Higher Level Lighting Products
July 23rd, 2012
IEC/TR 62778:2012 provides clarification and guidance for the assessment of blue light hazard of all lighting products that have the main emission in the visible spectrum (380 nm to 780 nm). By optical and spectral…read more
Quantum Computing Uses Diamonds to Eliminate Cooling Needs
July 23rd, 2012
A group of Harvard scientists were able to create quantum bits, or qubits, and store information in them for nearly two seconds – all at room temperature. Previous work with qubits required they be cooled…read more
Research Progresses LEDs Made out of Silicon
July 23rd, 2012
A recent theoretical study by a University of Waterloo doctoral candidate in nanotechnology engineering suggests that manufacturers may one day make lasers and LEDs out of silicon, a cheaper material with greater thermal conductivity. Silicon…read more
Recruitment Agency Offers Tips for Young Engineers
July 20th, 2012
Young engineers can improve prospects by becoming professionally registered, advises recruitment specialist As the employment market for graduate engineers with limited experience becomes increasingly competitive, young engineering candidates need to offer more than a…read more
New QFN socket addresses high performance requirements for 0.5mm pitch devices
July 19th, 2012
Ironwood Electronics recently introduced a new QFN socket addressing high performance requirements for 0.5mm pitch devices – SBT-QFN-4016. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 500,000 insertions.…read more
Flip Chip Micron Scale Thermal Mapping Solution
July 18th, 2012
Microsanj has introduced flip chip micron scale thermal mapping solution, a new high performance product in the Thermoreflectance Nanotherm Series. The NT220A, featured at the IPFA-2012 Conference in Singapore, adds near-infrared capability to support through-the-substrate…read more
New Revolution of SOB Fans with High Fluid Static Pressure and Air Flow
July 12th, 2012
Cooltron offers a variety of specialty fans for some specific applications in varied markets. Its patented Stator Outlet Blade technology helps reduce turbulence caused by fan blades, thereby streamlining the fluid flow and direction. This…read more
Standard Defines Requirements for PE Substrates
July 9th, 2012
IPC, the Association Connecting Electronics Industries, has published standards to promote development in the Printed Electronics industry. IPC-4921, Requirements for Printed Electronics Base Materials (Substrates), defines terms and sets out basic requirements within the industry…read more
Chassis for MITX Applications with Enhanced Cooling
July 5th, 2012
Cooler Master announced the Elite 120 Advanced MITX size chassis with 13-inches of graphics card space. A brushed aluminum front panel shelters a powerful 120mm fan intake, 80mm slim side fan, and additional support for…read more
Liquid Cooling for High Performance Processors
July 5th, 2012
CoolIT’s new Rack Direct Contact Liquid Cooling (Rack DCLC) technology offers cooling for increased density and decreased power usage. DCLC moves the heat generated by high performance processors by circulating liquid directly across the CPU.…read more
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- Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced
- Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology
- IBM Awarded Contract in First Phase of DARPA ICECool Program
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