Surface flatness is an important issue for thermal designers as it is directly related to thermal contact resistance between surfaces. In this column, the definitions of surface flatness related parameters are discussed. These definitions are…read more
E missivity in Practical Temperature Measurements
August 1st, 2003
When making temperature measurements with infrared cameras and point detectors, we are always facing the question of the emissivity of our sample. In practice we would like to have a single number set in the…read more
Glass: A Group Of Familiar Materials With Varying Properties
February 1st, 2003
The knowledge to manufacture glass products is already 4500 – 5000 years old, and glass in its different compounds is one of the most commonly used man-made materials. The material technical definition of glass is…read more
Pyrolytic graphite – thermal performance by structure
August 1st, 2002
Continuing our discussion of different forms of carbon, this column addresses the topic of pyrolytic graphite, a material that opens up many interesting applications not only for cooling but also for scientific measurement equipment. Pyrolytic…read more
Diamonds are a Thermal Designer’s Best Friends
February 1st, 2002
Different forms of carbon, such as processed natural graphite, pyrolytic graphite, diamond-like carbon, and synthetic diamond, offer lots of possibilities for maximizing conductive heat transfer.Synthetic diamond has already found its place as a common solution…read more
Temperature and reliability in electronics systems – the missing link
November 1st, 2001
To introduce the reliability requirements we face for the future, we focus on telecommunication as an example. Personal telecommunication is becoming increasingly integrated into our daily lives. However, we cannot take full advantage of the…read more
The Anisotropic Thermal Conductivity of Plastics
August 1st, 2001
The easiest way to tailor thermal conductivity of plastics is to incorporate some highly thermal conductive filler material into the plastic molding compound. Here the filler particles act as heat carriers in the thermally isolating…read more
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