IEEE ITherm Conference

Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2024 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

ITherm 2024 will be held along with the 74^th Electronic Components and Technology Conference (ECTC 2024 – http://www.ectc.net), a premier electronics packaging conference at he Gaylord Rockies Resort & Convention Center in Denver, Colorado, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2024 will include panel discussions, keynote lectures by prominent speakers, invited technology talks, ECTC/ITherm joint networking events and short courses, and a student design competition.