In the May 2006 issue the Calculation Corner focused on the comparison of liquid coolants using the Mouromtseff number [1]. For single phase forced convection, Mouromtseff found this figure of merit, Mo, to follow the…read more
High Powered Chip Cooling — Air and Beyond
August 1st, 2005
Introduction Over the past few years many people in the electronics industry have become concerned with the increases in heat density at both the chip and module level of packaging. This trend is not new…read more
The Challenge of Operating Computers at Ultra-low Temperatures
August 1st, 2001
Although the potential for low temperature enhancement of CMOS circuit performance has been recognized for some time, circuit scaling (proportionally reducing the size of the circuit) has been the preferred method of achieving higher performance.…read more
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- SEMI-THERM Presents Executive Briefing
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- APEC 2013: Applied Power Electronics Conference and Exhibition
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