Phil Tuma 3M Company, St. Paul, Minnesota The inefficiencies of legacy datacenter air cooling schemes are by now well known. New “Free Air” cooling technologies in which air is introduced to the racks in a…read more
Indirect Thermosyphons For Cooling Electronic Devices
February 1st, 2006
Nomenclature Variables R Thermal Resistance [°C/W] or [°C-mm2/W] Q Power [W] Q” Heat Flux [W/cm2] T Temperature [°C] or [K] h Heat Transfer Coefficient [W/cm2-K] Subscripts sat saturation tc thermocouple s sink or boiler w…read more
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