Scientists launched an investigation called the Constrained Vapor Bubble, or CVB, to the International Space Station to look into the operation of a heat pipe in space. The Constrained Vapor Bubble is the prototype for…read more
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
December 27th, 2010
Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated…read more
Grapics Card Series Uses Heat Pipes to Cool GPU More Efficiently
October 25th, 2010
The R6850-PM2D1GD5, part of the R6800 series of graphics cards recently launched by mainboard and graphics card manufacturer MSI, uses direct contact heat pipes to more efficiently cool the GPU. A 9cm PWM fan provides…read more
Apple Gets Patent on Method of Cooling Electronic Devices
July 12th, 2010
Apple Inc., maker of the iPhone and the iPad, received a patent on a method of cooling an electronic device by using hinge assemblies that can conduct heat. Patent 7,746,631, which was issued June 29,…read more
Pushing the Boundaries of Heat Pipe Operation
November 1st, 2008
Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the system. Three wick structures…read more
Modeling Air-Cooled Heat Sinks As Heat Exchangers
February 1st, 2008
Introduction The thermal resistance of a heat sink is a convenient way of describing its performance but, unlike its electrical counterpart, the thermal resistance of a heat sink is not a constant: it changes significantly…read more
Advances In High-Performance Cooling For Electronics
November 1st, 2005
Introduction The need for new cooling techniques is driven by the continuing increases in power dissipation of electronic parts and systems. In many instances standard techniques cannot achieve the required cooling performance due to physical…read more
Cooling Solutions In The Past Decade
November 1st, 2005
Introduction In 1995, a typical thermal design engineer was aware that removing heat was not going to get any easier in the next few years. A look back at the past ten years reveals that…read more
Threatened With a Pipe
May 1st, 2005
I have become a Heel Dragger. When natural convection was all the rage, I was touting fans. Once fan cooling became the status quo, I started dropping hints about heat pipes and thermoelectric coolers. The…read more
Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs
February 1st, 2005
Introduction The electronic industry requires increased forced-air cooling limits to cool high-end server CPUs adequately. Improving air-cooled heat sink thermal performance is one of the critical areas for increasing the overall air-cooling limit. One of…read more
Use Of Heat Pipe Cooling Systems In The Electronics Industry
November 1st, 2004
Introduction Thermal management of electronic components must solve problems connected with the limitations on the maximum chip temperature and with the requirements on the level of temperature uniformity. To cool electronic components, one can use…read more
An Introduction to Pulsating Heat Pipes
May 1st, 2003
Modern electronics thermal management faces considerable challenges in the wake of component miniaturization, which has led to higher demands on net heat flux dissipation. With the industry closely following Moore’s Law, the future demands are…read more
Electroosmotic Microchannel Cooling System for Microprocessors
November 1st, 2002
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and…read more
Thermal management of highly integrated electronic packages in avionics applications
November 1st, 2001
The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic…read more
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