Heat Pipes

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

May 26th, 2015

Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center…read more

Posted in Articles, CFD Software, Coolers, Data Centers, Design, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, Refrigeration | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

May 21st, 2015

By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data…read more

Posted in Articles, Coolers, Data Centers, Design, Enclosures, Heat Exchanger, Heat Pipes | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

Company Brings Liquid Cooling Technology to Smartphones

April 27th, 2015

Reducing size of liquid cooling systems has been a challenge for companies in the electronics cooling industry for many years.  Fujitsu introduces a 1mm thick liquid cooling heat pipe for compact electronic devices such as…read more

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Circuit Card Assembly Heat Sinks Embedded With Oscillating Heat Pipes

March 20th, 2015

Joe Boswell, Chris Smoot, Elliot Short, Nate Francis Introduction In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies…read more

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ACT Assists German Government Lab

March 9th, 2015

Advanced Cooling Technologies (ACT) announced it has recently delivered a pressure controlled heat pipe (PCHP) calibrator to a German government lab. ACT is known for supplying companies in the industry with its heat pipes and…read more

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Bendable Heat Pipes Ideal for Space-limited Applications

February 19th, 2015

Jaro Thermal announces its new ultra-slim, maintenance free, “Capillary” heatpipes that allow cooling from 5W to 35W. These heatpipes use water as working fluid “that continually alternates between evaporation and condensation. This constant cycling of water to…read more

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Heat Pipe Assembly for Spacecraft and Hypersonic Vehicles Passes NASA Hypersonic Tests

May 2nd, 2014

Advanced thermal solutions provider Thermacore has announced that its heat pipe assembly recently completed testing at the NASA Ames Arc Jet Complex operating at very high temperatures in a hypersonic leading edge simulation, making it…read more

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SEMI-THERM 30 Media

March 11th, 2014

Photos Videos Colder Products Company Discusses New Products at SEMI-THERM 30. The Bergquist Company Discusses Products at SEMI-THERM 30.

Researchers Eye Passive Cooling System for Microelectronics

March 6th, 2014

Researchers at San Diego State University in California are examining an alternative to traditional heat pipes they say could help increase cooling efficiency in laptops and other portable electronic devices. Known as pulsating or oscillating…read more

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Ultra-Thin Titanium Based Thermal Solution for Electronic Applications

February 28th, 2014

Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design…read more

Posted in Computer, Design, Design, Heat Pipes, IT Products, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | Comments Off on Ultra-Thin Titanium Based Thermal Solution for Electronic Applications

Waterproof Tablet Computer Features Cooling Fan

November 8th, 2013

Electronics manufacturer Fujitsu has released a unique new tablet computer capable of operating underwater while using a cooling fan to pump heat away from sensitive internal circuitry. The Arrows Tab QH77/M is 2-in-1 computer that…read more

Posted in Blowers / Fans / Filters, Computer, Consumer, Design, Heat Pipes, Heat Sinks, Liquid Cooling, New Products, News | Comments Off on Waterproof Tablet Computer Features Cooling Fan

Thermal Connectors Improve PCB Assembly Heat Dissipation

November 7th, 2013

TEM Products Inc., a manufacturer of mechanical components for electro-mechanical assembly, has released its new patent-pending PowerPeg thermal connectors. Designed for attachment to an external dissipater, the new PowerPeg thermal connectors offer significantly improved thermal…read more

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Heat Pipe Integration Strategies for LED Applications

September 12th, 2013

Dr. Richard Bonner, Anqi (Angie) Fan, Daniel Pounds and Dr. Ehsan Yakhshi-Tafti; Advanced Cooling Technologies, Inc. INTRODUCTION In light-emitting diodes (LEDs), 70 percent to 80 percent of the applied electrical power is converted to waste…read more

NASA Selects Proposals for Future Spacecraft Thermal Control Systems

September 9th, 2013

NASA has selected eight proposals to develop advanced thermal control system technologies for future spacecraft as part of its Game Changing Development Program (GCD). The program was created to investigate novel ideals and approaches to…read more

Posted in Aerospace, Heat Pipes, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, News, Research | Comments Off on NASA Selects Proposals for Future Spacecraft Thermal Control Systems