Cooling solutions provider Noctua has released two new models from the NH-U series of quiet, single tower CPU coolers. Both models reportedly feature a “new, slim design that ensures easy RAM access and maximum compatibility…read more
New Single Tower CPU Cooler Models Feature Slim Design for Easy RAM Access and Compatibility with Tall Memory Modules
April 8th, 2013
Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military Platforms
March 8th, 2013
Authors Johannes van Es and Henk Jan van Gerner, National Aerospace Laboratory NLR, The Netherlands The next generation military platforms will be equipped with more and more powerful sensors and avionics. The increasing power…read more
New High Bay LED Cooler Is Smaller and Lighter Than Passive Cooling Equivalents
February 18th, 2013
Nuventix, Inc. has introduced the LED Cooler R150-170, a new high bay LED cooler that, according to the company, is “33 percent smaller and 60 percent lighter than passive cooling equivalents used in industrial high…read more
Unique Heat Sink Design Incorporates Tower Design with Multiple Heat Pipes and Fans
January 4th, 2013
Electronics cooling specialist Gelid Solutions has released a three-fan “Black Edition” heat sink designed for gamers and computer enthusiasts. According to the company, the new cooler incorporates a thin-fin aluminum tower design and seven independent…read more
Broader Adoption of Vapor Chamber Technology
August 16th, 2012
Cooler Master has announced the broader adoption of Vapor Chamber Technology developed by Cooler Master’s OEM and industrial cooling division in its retail Heatsinks. Cooler Master is expanding the TPC series and will equip selected…read more
First Completely Passively-Cooled Graphics Card Developed
July 5th, 2012
Colorful is the first manufacturer to develope a completely passive cooler for Nvidia’s GeForce GTX 680 graphics card. Called the Colorful iGame GTX 680 Passive Edition, the card uses a completely silent cooling assembly for…read more
Dual Channel Kits for High Capacity and Performance DRAM Modules
May 22nd, 2012
ADATA Technology Co., Ltd. announced a boost to its XPG™ Xtreme Series DDR3 lineup with 2133X 8GB and 16GB dual channel kits. The new ADATA XPG Xtreme Series DDR3 2133X runs at 2133 MHz and…read more
NASA Investigates Use of Heat Pipes on Space Station
June 28th, 2011
Scientists launched an investigation called the Constrained Vapor Bubble, or CVB, to the International Space Station to look into the operation of a heat pipe in space. The Constrained Vapor Bubble is the prototype for…read more
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
December 27th, 2010
Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated…read more
Grapics Card Series Uses Heat Pipes to Cool GPU More Efficiently
October 25th, 2010
The R6850-PM2D1GD5, part of the R6800 series of graphics cards recently launched by mainboard and graphics card manufacturer MSI, uses direct contact heat pipes to more efficiently cool the GPU. A 9cm PWM fan provides…read more
Apple Gets Patent on Method of Cooling Electronic Devices
July 12th, 2010
Apple Inc., maker of the iPhone and the iPad, received a patent on a method of cooling an electronic device by using hinge assemblies that can conduct heat. Patent 7,746,631, which was issued June 29,…read more
Pushing the Boundaries of Heat Pipe Operation
November 1st, 2008
Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the system. Three wick structures…read more
Modeling Air-Cooled Heat Sinks As Heat Exchangers
February 1st, 2008
Introduction The thermal resistance of a heat sink is a convenient way of describing its performance but, unlike its electrical counterpart, the thermal resistance of a heat sink is not a constant: it changes significantly…read more
Advances In High-Performance Cooling For Electronics
November 1st, 2005
Introduction The need for new cooling techniques is driven by the continuing increases in power dissipation of electronic parts and systems. In many instances standard techniques cannot achieve the required cooling performance due to physical…read more
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