Heat Pipes

Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

“Breakthrough Products of the Year” Award Winner

January 18th, 2016

Enclosure manufacturer, Rittal Corporation, has won Processing magazine’s 2015 Breakthrough Products of the Year award for their Blue e+ Cooling Unit Series for enclosures. “The award recognizes products, technologies and services that have made significant contributions…read more

Posted in Coolers, Data Centers, Enclosures, Heat Pipes, News | Comments Off on “Breakthrough Products of the Year” Award Winner

Heat-pipes May be a Solution for Heat Dissipation in New Smartphone

December 8th, 2015

According to Chinese site UDN, Samsung is looking for a heat-pipe supplier to dissipate heat from the Galaxy S7 smartphone’s processor. “Tiny pipes inside the phone are filled with a liquid coolant, which circulates around…read more

Posted in Design, Heat Pipes, Liquid Cooling | Comments Off on Heat-pipes May be a Solution for Heat Dissipation in New Smartphone

Thermal Invisibility Cloak Improves Heat Distribution in Electronics

September 22nd, 2015

A team of researchers from the Nanyang Technological University (NTU) in Singapore has developed a thermal invisibility cloak that would improve heat distribution in electronic devices by redirecting incoming heat. The cloaks are capable of…read more

Posted in Consumer, Coolers, Design, Enclosures, Heat Exchanger, Heat Pipes, Heat Sinks, News, Semiconductor, TECs | Comments Off on Thermal Invisibility Cloak Improves Heat Distribution in Electronics

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

May 26th, 2015

Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center…read more

Posted in Articles, Blowers / Fans / Filters, CFD Software, Coolers, Data Centers, Design, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, Refrigeration | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

May 21st, 2015

By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data…read more

Posted in Articles, Coolers, Data Centers, Design, Enclosures, Heat Exchanger, Heat Pipes | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

Company Brings Liquid Cooling Technology to Smartphones

April 27th, 2015

Reducing size of liquid cooling systems has been a challenge for companies in the electronics cooling industry for many years.  Fujitsu introduces a 1mm thick liquid cooling heat pipe for compact electronic devices such as…read more

Posted in Consumer, Design, Heat Pipes, Liquid Cooling, News | Comments Off on Company Brings Liquid Cooling Technology to Smartphones

Circuit Card Assembly Heat Sinks Embedded With Oscillating Heat Pipes

March 20th, 2015

Joe Boswell, Chris Smoot, Elliot Short, Nate Francis Introduction In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies…read more

Posted in Articles, Design, Heat Exchanger, Heat Pipes, Heat Sinks | Comments Off on Circuit Card Assembly Heat Sinks Embedded With Oscillating Heat Pipes

ACT Assists German Government Lab

March 9th, 2015

Advanced Cooling Technologies (ACT) announced it has recently delivered a pressure controlled heat pipe (PCHP) calibrator to a German government lab. ACT is known for supplying companies in the industry with its heat pipes and…read more

Posted in Heat Pipes, New Products | Comments Off on ACT Assists German Government Lab

Bendable Heat Pipes Ideal for Space-limited Applications

February 19th, 2015

Jaro Thermal announces its new ultra-slim, maintenance free, “Capillary” heatpipes that allow cooling from 5W to 35W. These heatpipes use water as working fluid “that continually alternates between evaporation and condensation. This constant cycling of water to…read more

Posted in Coolers, Heat Pipes, New Products | Comments Off on Bendable Heat Pipes Ideal for Space-limited Applications

Heat Pipe Assembly for Spacecraft and Hypersonic Vehicles Passes NASA Hypersonic Tests

May 2nd, 2014

Advanced thermal solutions provider Thermacore has announced that its heat pipe assembly recently completed testing at the NASA Ames Arc Jet Complex operating at very high temperatures in a hypersonic leading edge simulation, making it…read more

Posted in Aerospace, Defense, Heat Pipes | Comments Off on Heat Pipe Assembly for Spacecraft and Hypersonic Vehicles Passes NASA Hypersonic Tests

SEMI-THERM 30 Media

March 11th, 2014

Photos Videos Colder Products Company Discusses New Products at SEMI-THERM 30. The Bergquist Company Discusses Products at SEMI-THERM 30.

Researchers Eye Passive Cooling System for Microelectronics

March 6th, 2014

Researchers at San Diego State University in California are examining an alternative to traditional heat pipes they say could help increase cooling efficiency in laptops and other portable electronic devices. Known as pulsating or oscillating…read more

Posted in Computer, Consumer, Heat Pipes, Research | Comments Off on Researchers Eye Passive Cooling System for Microelectronics

Ultra-Thin Titanium Based Thermal Solution for Electronic Applications

February 28th, 2014

Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design…read more

Posted in Computer, Design, Design, Heat Pipes, IT Products, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | Comments Off on Ultra-Thin Titanium Based Thermal Solution for Electronic Applications