Heat Pipes

New Website for Unique Product Line

April 18th, 2016

Developer of cooling solutions for high-powered electronics, QuantaCool,  has selected Schubert b2b to design a new website to support the company as it goes to market with its PolarBox™, PolarRak™ and PolarMax™ product lines. “QuantaCool’s…read more

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Metal Inverse Opals Could Better Cool Electronics

April 18th, 2016

(April 7th, 2016) New work by researchers at Stanford University and the University of Illinois at Urbana-Champaign, suggest that “metal inverse opals” could be used to cool down electronic devices as well as other thermal…read more

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iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT

April 14th, 2016

iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT   PREFACE The International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium of approximately 100 leading electronics manufacturers, suppliers, associations, government agencies and universities. One of iNEMI’s…read more

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New Market Entry of Sealed Enclosure Coolers

April 11th, 2016

As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their…read more

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World’s Thinnest Laptop Runs on ‘Hyperbaric’ Cooling

April 11th, 2016

HP has recently released the world’s thinnest laptop – the Spectre 13.3” notebook, which cools its CPUs with what HP calls ‘hyperbaric cooling technology’. This system features two ultra-thin fans, a heat-pipe, and a special…read more

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Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

New Smartphone to Use Heat Pipe Cooling

March 1st, 2016

Samsung has declared that the new Galaxy S7 will use heat pipes for its cooling system. Smartphones typically lack ventilation holes and fans, so smartphone companies are moving to adopt heat pipes “because the technology…read more

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Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

“Breakthrough Products of the Year” Award Winner

January 18th, 2016

Enclosure manufacturer, Rittal Corporation, has won Processing magazine’s 2015 Breakthrough Products of the Year award for their Blue e+ Cooling Unit Series for enclosures. “The award recognizes products, technologies and services that have made significant contributions…read more

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Heat-pipes May be a Solution for Heat Dissipation in New Smartphone

December 8th, 2015

According to Chinese site UDN, Samsung is looking for a heat-pipe supplier to dissipate heat from the Galaxy S7 smartphone’s processor. “Tiny pipes inside the phone are filled with a liquid coolant, which circulates around…read more

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Thermal Invisibility Cloak Improves Heat Distribution in Electronics

September 22nd, 2015

A team of researchers from the Nanyang Technological University (NTU) in Singapore has developed a thermal invisibility cloak that would improve heat distribution in electronic devices by redirecting incoming heat. The cloaks are capable of…read more

Posted in Consumer, Coolers, Design, Enclosures, Heat Exchanger, Heat Pipes, Heat Sinks, News, Semiconductor, TECs | Comments Off on Thermal Invisibility Cloak Improves Heat Distribution in Electronics

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

May 26th, 2015

Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center…read more

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Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

May 21st, 2015

By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data…read more

Posted in Articles, Coolers, Data Centers, Design, Enclosures, Heat Exchanger, Heat Pipes | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

Company Brings Liquid Cooling Technology to Smartphones

April 27th, 2015

Reducing size of liquid cooling systems has been a challenge for companies in the electronics cooling industry for many years.  Fujitsu introduces a 1mm thick liquid cooling heat pipe for compact electronic devices such as…read more

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