Heat Sinks

Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation

March 10th, 2014

Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and…read more

Use of JEDEC Thermal Metrics in Calculating Chip Temperatures in Packages with Attached Heat Sinks

February 27th, 2014

Bruce Guenin Associate Technical Editor, Electronics Cooling   INTRODUCTION The previous column, “Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)” dealt with the application of JEDEC thermal metrics to IC…read more

Heat Sink Series Provides Modular Cooling Options for Electrical Components

February 20th, 2014

Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection.…read more

Fansinks for High Temperature Applications

February 6th, 2014

CTS Corporation has announced the release of new fansinks for high temperature applications. Designed to absorb and disperse heat away from high temperature devices, the FHS series features an operating temperature range of -10°C to…read more

Carbon Nanotubes Boost Microprocessor Cooling

February 4th, 2014

Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to…read more

Hybrid Liquid-Air-Cooled Heat Sink for Extreme Environments

December 16th, 2013

CoolClouds, Inc. has announced the availability of a new class of heat sinks for use in high performance computers or extreme environments starting mid-Q1 2014. According to the company, SuprCool-PC is the first “in-chassis” heat…read more

Thermal Facts & Fairy Tales: How Useful Are Heat Sink Correlations for Design Purposes?

December 3rd, 2013

Clemens J.M. Lasance Guest Editor, Philips Research Emeritus, Consultant at SomelikeitCool I assume everybody agrees with the fact that it is pointless to devote precious space in this magazine to highlight again all problems related…read more

Patent for Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader

November 22nd, 2013

The U.S Patent and Trademark Office has awarded patent No. 8, 587,947, “Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader” to Shinko Electric Industries Co., Ltd. of Japan. According to…read more

Technique Combines Heat Sinks for More Effective Cooling

November 22nd, 2013

Researchers at the National University of Singapore have developed a new two-phase technique they say is up to 50 percent more effective in cooling electronic systems compared to current cooling technology. Led by Lee Poh…read more

Heat Sink Watch Helps Wearer Manage Body Temperature

November 11th, 2013

Four engineering students at MIT have developed a thermoelectric bracelet designed to help wearers maintain a comfortable body temperature. Resembling a wristwatch, the invention, known as Wristify, monitors air and skin temperature and sends pulses…read more

Waterproof Tablet Computer Features Cooling Fan

November 8th, 2013

Electronics manufacturer Fujitsu has released a unique new tablet computer capable of operating underwater while using a cooling fan to pump heat away from sensitive internal circuitry. The Arrows Tab QH77/M is 2-in-1 computer that…read more

Thermal Connectors Improve PCB Assembly Heat Dissipation

November 7th, 2013

TEM Products Inc., a manufacturer of mechanical components for electro-mechanical assembly, has released its new patent-pending PowerPeg thermal connectors. Designed for attachment to an external dissipater, the new PowerPeg thermal connectors offer significantly improved thermal…read more

New Patent Covers System for Clamping Heat Sink

October 7th, 2013

The U.S. Patent and Trademark Office has assigned patent No. 8,546,192, “System for Clamping Heat Sink,” to Harman International Industries, Inc. in Stamford, Conn. According to the background information provided by the inventor, the patent…read more

‘On-Demand’ Nano-sized Heat Sinks Lower IC Temperatures

October 3rd, 2013

Scientists at RMIT University in Australia have released research that demonstrates a new method of heat dissipation on the nanoscale level. In a paper published in the online journal Advanced Energy Materials, Kourosh Kalantar-zadeh, a…read more