Heat Sinks

Comparison of Heatsinks used for the Thermal Management of LEDs

September 13th, 2016

By James Pryde1,2, Weeratunge Malalasekera1, and David Whalley1 1Loughborough University 2Tamlite Lighting Introduction The work of Kraus & Bar-Cohen [1] and Bar-Cohen et al. [2] provide a well-defined foundation for the design and optimisation of conventional…read more

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High-Performance Circuit Materials Exhibited at Upcoming Conference

September 6th, 2016

Rogers Corporation will exhibit its high-performance circuit materials at the PCB West 2016 Conference and Exhibition, booth 201. Designed to dissipate heat in high-power applications, thermally enhanced 92ML laminates and prepregs are halogen-free, flame-retardant, thermally…read more

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Book Review of Electronics Cooling (2016)

September 6th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving…read more

Heat Sinks Improved with 3D Printing

August 2nd, 2016

(July 18, 2016) The complimenting research done by Oak Ridge National Laboratory and the University of Tennessee Knoxville has found a way to improve the heat dissipation in electronics using 3D printing. According to 3DPrint.com,…read more

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Cooling Powerful Electronics with Powerful Sand

July 19th, 2016

(July 13, 2016) Recently, associate professor Baratunde Cola of the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology uncovered the “potential of silicon dioxide nanoparticles coated with a high dielectric constant polymer…read more

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3D Printed Heat Sink Performs as Well as Conventional Heat Sinks with Annealing Process

July 12th, 2016

(July 8, 2016) Recently, Tong Wu, of the University of Tennessee and Oak Ridge National Laboratory, led a team of researchers who have discovered that manufacturers can create 3D printed heat sinks that can perform…read more

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Calculation Corner: Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance

July 8th, 2016

by Bob Simons – Reprinted from ElectronicsCooling, Feb., 2004 [Formatted by B. Guenin, 4/4/16] In past issues of ElectronicsCooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2].…read more

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Pluggable Optics Modules – Thermal Specifications, Part 1

July 7th, 2016

Bonnie Mack and Terence Graham 1. Introduction Pluggable optics modules, (POMs), such as SFP, QSFP, QSFP+, QSFP28, CFP, CFP2, and CFP4 transceivers, are optical interface devices that are connected to a PCB through ports in…read more

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Special Adhesives to Better Medical Equipment

June 21st, 2016

(June 13, 2016) Device manufacturers are making more accurate, compact medical equipment with electronics technology. MedicalPlasticsNews.com reported that they are using “pressure-sensitive adhesives (PSAs)” which were “developed as a heat sink attachment method to eliminate…read more

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How to Choose the Right Solution for Effective Heat Management

June 7th, 2016

(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,”…read more

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New Skived-Copper Fan Heat-sink Keeps Intel Servers Cool

May 18th, 2016

JARO has recently released their new low-profile, 1U CPU cooler with a heat-sink and blower, model JCC00066. Specifically designed for use with data storage, high-density, backup, or cloud servers, JARO’s cooler works well for Intel processors…read more

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New Market Entry of Sealed Enclosure Coolers

April 11th, 2016

As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their…read more

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Diamonds May Take Silicon’s Place in Future Smartphones

March 28th, 2016

A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already…read more

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New TIMs That Offer High Thermal Conductivity

March 21st, 2016

Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications,…read more

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