Heat Sinks

Apple Reinvents the Ionic Wind Generator Cooling System

January 9th, 2012

Many modern electronic systems generate a large amount of heat, and a variety of different cooling mechanisms may be used to cool these electronic systems. For personal electronic systems, such as computers and other relatively…read more

600-W DC-DC Converter with Integrated Heat Sink

January 9th, 2012

CUI Inc is adding a 600 W device to the company’s line of rugged chassis mount DC-DC converters. The VFK600 series measures 7.8 x 5.0 x 1.5 inch and includes an integrated heat sink for…read more

Heat Sinks Designed for Higher Power Densities

January 9th, 2012

The new R2 Series of heat sinks from Ohmite combines thermal performance with the attachment mechanism of the popular C Series. This heat sink is capable of attaching either a TO-220 or a TO-247 component…read more

ElectronicsCooling December 2011 Issue

December 1st, 2011

Don’t miss out on the December 2011 issue of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization as well as technical briefs. If you would…read more

Thermal Facts and Fairy Tales: Heat Sinks, Heat Exchangers, and History

November 22nd, 2011

As far as history goes, the field of electronics cooling does not have a very long past. A rather quick look through my personal reference material that is strictly geared towards cooling electronics had at…read more

Bristly Particles Could Manage Heat Flow in Electronics

October 25th, 2011

A well-known method of making heat sinks for electronic devices is a process called sintering, in which powdered metal is formed into a desired shape and then heated in a vacuum to bind the particles…read more

Heat Sinks Feature Improved Tower Fin and Heat Pipe Layout

October 11th, 2011

Cooler Master’s Hyper 212 EVO and Hyper TX3 EVO CPU Coolers have an improved tower fin design, heat pipe layout, upgraded fans and fan brackets. All of which provides an even more extreme value for…read more

Solar-Powered Lasers Use Heat Sink for Cooling

October 11th, 2011

A researcher in Uzbekistan has proposed a plan for solar-powered lasers using small parabolic mirrors about 3 feet in diameter, combined with new two-layer ceramic disks to produce laser light. When sunlight hits the ceramic…read more

Optimal Thermal Management Performance Solution

August 22nd, 2011

Newark has established an exclusive stocking agreement for Wakefield Solutions’ new LED heat sink extrusions. Wakefield and Bridgelux engineering teams worked together at Newark’s behest to design an optimal heat sink extrusion line which is…read more

New Heat Sink Series with Push Pin Mounting System

July 11th, 2011

Advanced Thermal Solutions, Inc.’s new series of its maxiFLOW™ heat sinks now include an integral push pin mounting system for fast, safe attachment of the heat sinks onto BGAs and other hot components Each heat…read more

New Air-Cooling Technology Reduces Energy Use

July 11th, 2011

Sandia National Laboratories has developed a proprietary air-cooling invention, the “Sandia Cooler,” also known as the “Air Bearing Heat Exchanger.” The Sandia Cooler technology, which is patent-pending, will significantly reduce the energy needed to cool…read more

Honeycomb Heat Sink Utilizes Science of Real Honey Bees

June 13th, 2011

Utilizing the science of real honey bees, JaroThermal’s newest Honeycomb heat sink directs heat towards the outside, while producing a steady flow of cool air on the inside. A multi-holed design and increased surface area…read more

Forced Convection Heat Sink Thinner than a Credit Card

May 23rd, 2011

Novel Concepts, Inc. has developed and has patents pending for the world’s thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs…read more

Connector/Decoupler Integrated in a Heat Sink

April 11th, 2011

United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from…read more