Heat Sinks

Special Adhesives to Better Medical Equipment

June 21st, 2016

(June 13, 2016) Device manufacturers are making more accurate, compact medical equipment with electronics technology. MedicalPlasticsNews.com reported that they are using “pressure-sensitive adhesives (PSAs)” which were “developed as a heat sink attachment method to eliminate…read more

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How to Choose the Right Solution for Effective Heat Management

June 7th, 2016

(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,”…read more

Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, News, Research, Semiconductor | Comments Off on How to Choose the Right Solution for Effective Heat Management

New Skived-Copper Fan Heat-sink Keeps Intel Servers Cool

May 18th, 2016

JARO has recently released their new low-profile, 1U CPU cooler with a heat-sink and blower, model JCC00066. Specifically designed for use with data storage, high-density, backup, or cloud servers, JARO’s cooler works well for Intel processors…read more

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New Market Entry of Sealed Enclosure Coolers

April 11th, 2016

As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their…read more

Posted in Communications, Consumer, Coolers, Defense, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Medical, New Products | Comments Off on New Market Entry of Sealed Enclosure Coolers

Diamonds May Take Silicon’s Place in Future Smartphones

March 28th, 2016

A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Design, Design, Heat Sinks, News, Power, Research, Semiconductor | Comments Off on Diamonds May Take Silicon’s Place in Future Smartphones

New TIMs That Offer High Thermal Conductivity

March 21st, 2016

Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications,…read more

Posted in Automotive, Communications, Enclosures, Heat Sinks, IT Products, Materials, Compounds, Adhesives, Substrates, New Products, TIMs | Comments Off on New TIMs That Offer High Thermal Conductivity

Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

New High-Performance Thermal Interface Thin Film

March 1st, 2016

Fujipoly recently introduced its new thin film, thermal interface product, Sarcon® YR‐c. The Sarcon® YR‐c effectively eliminates near‐microscopic air gaps that exist between components when placed between a heat source such as a high‐performance semiconductor…read more

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New Smartphone to Use Heat Pipe Cooling

March 1st, 2016

Samsung has declared that the new Galaxy S7 will use heat pipes for its cooling system. Smartphones typically lack ventilation holes and fans, so smartphone companies are moving to adopt heat pipes “because the technology…read more

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Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

Using Thermal Interfaces to Cool Optoelectronic Microprocessors

January 25th, 2016

Recently, Moscow Institute of Physics and Technology researchers Dmitry Fedyanin and Andrey Vyshnevyy have solved and “demonstrated how to efficiently cool optoelectronic microprocessors” by using industry-standard heat sinks, according to Phys.org. Optoelectronic chips’ active plasmonic components…read more

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Redesigned Heat Sinks Using 3D Printers

January 20th, 2016

Plunkett Associates has successfully redesigned heat-sinks to improve convection cooling performance using Direct Metal Laser Sintering (DMLS), or 3D printing. “Each heat-sink was first produced in virtual form and simulated using Computational Fluid Dynamics (CFD)…read more

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New Cooler Can Advance Heat Exchanger Technology

December 21st, 2015

Recently, researchers at the Energy Department’s Sandia National Laboratories have developed an innovative new air-cooling technology called the Sandia Cooler. “The Sandia Cooler combines a fan and a finned metal heat sink into a single…read more

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Heat Sink Optimization through Use of Pin Fins

September 29th, 2015

In a recent blog post, Robert Smith discusses heat sink optimization through the use of pin fins. “Local heat transfer coefficients are highest when the air first begins to form a boundary layer.  The benefit to…read more

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