Heat Sinks

Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

Using Thermal Interfaces to Cool Optoelectronic Microprocessors

January 25th, 2016

Recently, Moscow Institute of Physics and Technology researchers Dmitry Fedyanin and Andrey Vyshnevyy have solved and “demonstrated how to efficiently cool optoelectronic microprocessors” by using industry-standard heat sinks, according to Phys.org. Optoelectronic chips’ active plasmonic components…read more

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Redesigned Heat Sinks Using 3D Printers

January 20th, 2016

Plunkett Associates has successfully redesigned heat-sinks to improve convection cooling performance using Direct Metal Laser Sintering (DMLS), or 3D printing. “Each heat-sink was first produced in virtual form and simulated using Computational Fluid Dynamics (CFD)…read more

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New Cooler Can Advance Heat Exchanger Technology

December 21st, 2015

Recently, researchers at the Energy Department’s Sandia National Laboratories have developed an innovative new air-cooling technology called the Sandia Cooler. “The Sandia Cooler combines a fan and a finned metal heat sink into a single…read more

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Heat Sink Optimization through Use of Pin Fins

September 29th, 2015

In a recent blog post, Robert Smith discusses heat sink optimization through the use of pin fins. “Local heat transfer coefficients are highest when the air first begins to form a boundary layer.  The benefit to…read more

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Thermal Invisibility Cloak Improves Heat Distribution in Electronics

September 22nd, 2015

A team of researchers from the Nanyang Technological University (NTU) in Singapore has developed a thermal invisibility cloak that would improve heat distribution in electronic devices by redirecting incoming heat. The cloaks are capable of…read more

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Interactive 3D Thermal Heatsink Modeling Simulation Software

September 21st, 2015

Yesterday, during the 2015 IEEE ECCE conference and exposition in Montréal, Canada, Mersen presented the R-Tools GEN III. Mersen will show the redesigned interactive 3D Thermal Heatsink Modeling simulation software today, Sept. 22, as well.…read more

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An Additive Design Methodology for Heatsink Geometry Topology Identification

September 15th, 2015

Introduction Established heatsink manufacturing processes such as extrusion, casting and milling constrain the achievable topology and geometry of the heatsink. The advent of metallic 3D printing (additive manufacture) processes such as selective laser melting (SLM)…read more

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Solid-state CPU Cooler Offers Advanced Cooling

August 24th, 2015

Phononic unveils a new solid-state CPU cooler, the Phononic model HEX 1.0. The small package, with dimensions of 4.3″ x 3.5″ x 3.5″, offers an advanced cooling performance despite its tiny size. “Unlike traditional heatsink/fan…read more

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Air Force Inquires About New Thermal Management Solutions for Future Aircraft

August 11th, 2015

The U.S. Air Force is looking into new thermal management techniques to cool the electronics in future fighter aircraft. “Officials of the Air Force Research Laboratory at Wright-Patterson Air Force Base, Ohio, issued a broad…read more

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Heat Sink Attachment Improves Heat Transfers and TIM Performance by 20 Percent

June 1st, 2015

Advanced Thermal Solutions, Inc. introduces the clipKIT – a heat sink attachment system available from Digi-Key. The clipKIT can be used with mostly any industry standard heat sink, such as straight fin, pin fin, cross…read more

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New Technology Improves Heat Dissipation Performance

May 26th, 2015

OKI Circuit Technology in Japan has developed a mass-production technology for multi-layer copper-coin printed circuit boards that supports high speeds and high frequencies. The technology is a T-Coin (Technology of copper coin insert) structure that…read more

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Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

May 26th, 2015

Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center…read more

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Report: Images on Forum Show How Liquid Cooling is Incorporated into New Products

May 12th, 2015

Three images have appeared on an Asian video card forum named Chiphell of new AMD Fiji GPUs, showcasing compact PCBs pre-fitted with a liquid-cooling heatsink and loop connectors. It has not yet been determined if…read more

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