Heat Sinks

THERMAL LIVE 2015

November 25th, 2014

THERMAL LIVE 2015 October 6 – 8, 2015 Online Event Featuring practical thermal management techniques and topics, this event includes roundtables, webinars and videos; and there’s no cost to attend. Program Highlights: LED Design Data…read more

New Heat Sink Lid Socket Produced

October 27th, 2014

Ironwood Electronics has announced its new BGA socket design, the GT-BGA-6008, which uses elastomer that has a very high performance of 75 GHz. “The socket is designed to dissipate 4.5 watts using compression screw with…read more

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New Heat Sink Announced

October 9th, 2014

GlacialTech Inc. announced its new Igloo FS127, a Square Cold Forged Heatsink that suits 60W LED applications. It’s a one-piece unit that yields strong thermal conductivity. Features of the Igloo FS127 include low thermal resistance…read more

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Cold Forged Heat Sinks Boost Thermal Management of LEDs

August 19th, 2014

GlacialTech Inc. has introduced Igloo FR210 and Igloo FR210HP, two new cold forging thermal modules designed for 80W LED thermal management applications. The Igloo FR210HP differs from the Igloo FR210 in that it optimized for…read more

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Cooling Enhancement Boosts Operation of Laser Power Amplifier

August 5th, 2014

By enhancing the cooling system of a thin disk laser power amplifier with an optically-transparent heat sink, researchers at the U.S. Army Research Laboratory have successfully extended the device’s power scaling up to two and…read more

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Syringe-Packaged Greases Satisfy Electrical and Thermal Conductivity Needs

June 9th, 2014

Intertronics now offers CircuitWorks’ syringe-packaged conductive greases, which provide electric and/or thermal conductivity for a range of applications. CircuitWorks’ new silicone-free heat sink grease will not harden or dry out while offering excellent thermal conductivity…read more

Thermally Conductive Plastic for LED Heat Sinks Reduces Lighting Costs

June 4th, 2014

Bayer Material Science has announced Makrolon® polycarbonate as the latest addition to its family of heat-resistant plastics designed specifically for LED heat sink applications. Compared with aluminum, this grade of Makrolon polycarbonate conduct similar thermal performance…read more

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Built-in Heat Spreading for Efficient Thermoelectric Cooling of Concentrated Heat Loads

May 29th, 2014

Jeff Hershberger, Robert Smythe, Xiaoyi Gu and Richard F. Hill Laird Technologies, Inc. INTRODUCTION Thermoelectric cooling is an active thermal management technique.  A thermoelectric cooler (TEC) has two circuit boards which are typically Al2O3 plates…read more

High Power Thermoelectric Cold Plate for 19-Inch Racks

May 12th, 2014

Elite Thermal Engineering, a developer of high power, high performance thermoelectric cooling devices, has released a 19-inch version of its thermoelectric cooling plate OCP-300 and high power heat sink HS-004 created for use with 19-inch…read more

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Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation

March 10th, 2014

Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and…read more

Use of JEDEC Thermal Metrics in Calculating Chip Temperatures in Packages with Attached Heat Sinks

February 27th, 2014

Bruce Guenin Associate Technical Editor, Electronics Cooling   INTRODUCTION The previous column, “Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)” dealt with the application of JEDEC thermal metrics to IC…read more

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Heat Sink Series Provides Modular Cooling Options for Electrical Components

February 20th, 2014

Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection.…read more

Fansinks for High Temperature Applications

February 6th, 2014

CTS Corporation has announced the release of new fansinks for high temperature applications. Designed to absorb and disperse heat away from high temperature devices, the FHS series features an operating temperature range of -10°C to…read more

Carbon Nanotubes Boost Microprocessor Cooling

February 4th, 2014

Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to…read more

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