Penn Engineering has released the new patent-pending PEM heat sink mounting system for secure attachment of heat sinks to circuit boards. According to the company, the new heat sink mounting system consists of “Type HSCB…read more
New Customizable Heat Sinks for Use in High Power Environments and Resistors
March 11th, 2013
Ohmite Manufacturing, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has announced two new heat sinks: the C series modular heat sink for use in high power…read more
Board-Level Heat Sinks for Semiconductor Devices in D2Pak, SOT-32, TO-220, and TO-263 Packages
January 21st, 2013
Electronic components distributor Digi-Key has released the Assmann WSW line of board-level heat sinks for use in industrial process control equipment, telecommunications equipment, consumer products and automotive applications. According to the company, the heat sinks…read more
Unique Heat Sink Design Incorporates Tower Design with Multiple Heat Pipes and Fans
January 4th, 2013
Electronics cooling specialist Gelid Solutions has released a three-fan “Black Edition” heat sink designed for gamers and computer enthusiasts. According to the company, the new cooler incorporates a thin-fin aluminum tower design and seven independent…read more
U.S. LED Lighting Manufacturer Develops Industry’s First Extruded Heat Sink “of its Kind”
January 3rd, 2013
A U.S. supplier and manufacturer of LED lighting, LED Waves, has announced that as of December 2012, the company’s LED high bay light will be equipped with “the only extruded heat sink of its kind…read more
New Thermal Management “Centers of Excellence” Optimal for Heat Sink Production
December 31st, 2012
Thermal management solutions company Sapa Extrusions North America has created two thermal management “centers of excellence” at the company’s Mountain Top, Pa. and City of Industry, Calif. locations. According to the company, the “center of…read more
High-Performance Heat Sinks for Challenging Microprocessor Cooling Applications
December 17th, 2012
Thermal solutions company Thermacore, Inc. has released a new product line of compact, high-performance air-cooled heat sinks. According to the company, the new generation of heat sinks is the result of a multimillion-dollar development contract…read more
Thermal Management Compound for LED Heat Sinks
October 19th, 2012
PolyOne Corporation reports that Finland-based LED lighting systems maker Kruunutekniikka Oy has chosen its Therma-Tech thermal management compounds to replace aluminum in the lighting systems maker’s Coolics LED light fixtures. Aluminum is the traditional material…read more
Polycarbonate Replaces Aluminum in Cooling Elements for LED Thermal Management
October 19th, 2012
With the demand for polycarbonate for the production of LED lighting systems growing, Bayer MaterialScience has been steadily expanding its product range to include injection molding and extrusion granules as well as semi-finished film and…read more
Thermally Conductive Epoxy System for Bonding Heat Sinks in Electronic Assemblies
October 4th, 2012
Aremco Products, Inc., a developer of technical ceramics, adhesives, coatings and sealants, has released Aremco-Bond™ 860, a thermally conductive epoxy system developed for bonding heat sinks and fins used in heat exchangers and electronic assemblies.…read more
Heat Sink Analysis System for Testing Surface Contact and Pressure Distribution
October 4th, 2012
Sensor Products Inc., a developer of tactile pressure sensing solutions, has released the Tactilus heat-sink analysis system for testing surface contact and pressure distribution between the heat sink and heat source. The Tactilus sensor measures…read more
New Data Storage Solution Debuts at DEMO Fall 2012 Conference
October 4th, 2012
Evtron, a St. Louis-based startup, officially launched Evtron CELL, a high-density server storage platform fitting 120 hard disk drives (HDDs) at the DEMO Fall 2012 conference. According to Evtron Founder Andrew Mayhall, the company has…read more
CPU Cooler for Compact Environment
October 3rd, 2012
Thermal solutions developer Phanteks has released the PH-TC90LS, an ultra-low profile thermal radiator for CPU cooling in a compact environment. The PH-TC90LS heat sink measures 27mm tall—34mm when the bundled fan is attached—and is compatible…read more
Heat Sinks for Use in High-Power Semiconductor Devices
October 2nd, 2012
Electronics component manufacturer Ohmite has released the CP4 Series of cold plate four-pass heat sinks for use in SCRs, rectifiers, diodes, thyristors and other high-power semiconductor devices for variable speed drive, power supplies, robotics and…read more
Recent Posts
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- Fans for Low-Noise, Low-Airflow Applications
- Programmable Digital Temperature Control for Electronic Enclosures
- U.S. Patent for Two-Stage Enclosure Coolers Awarded
- Company Acquires Thermal and Vacuum Product Manufacturer
- Thermal Spreading and More Using Open-Source FEA Software
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