Plastics

Nanodiamonds Boost Thermal Conductivity of Thermoplastics

July 18th, 2014

Carbodeon has announced the release of new nanodiamond-enhanced thermoplastics, which offer a 20-100 percent improvement in thermal conductivity compared to traditional materials. The new uDiamond® products can achieve a 20 percent increase in polymer thermal…read more

Thermally Conductive Plastic for LED Heat Sinks Reduces Lighting Costs

June 4th, 2014

Bayer Material Science has announced Makrolon® polycarbonate as the latest addition to its family of heat-resistant plastics designed specifically for LED heat sink applications. Compared with aluminum, this grade of Makrolon polycarbonate conduct similar thermal performance…read more

Posted in Heat Sinks, LED / Lighting, Plastics | Comments Off

Boron Nitride Filler for Thermally Conductive Dielectric Plastic Compounds

December 5th, 2013

Saint-Gobain Ceramic Materials has released its new CarboTherm boron nitride thermal management fillers for use in thermally conductive, dielectric plastic compounds. The new boron nitride fillers will be on display December 10-11 at the Compounding…read more

Thermoplastic Polyester for Thermal Management in LEDs and Electronic Components

October 29th, 2012

Science-based company Royal DSM has released PET XL-T, a thermoplastic polyester for thermal management in LED lighting systems and automotive electronics components. According to the company, Arnite PET XL-T was developed as an alternative to…read more

Firm Opens 2nd Consumer Electronics Production Facility in China

October 25th, 2010

Indianapolis, Ind.-based Marian, Inc., recently opened another facility in China. Located in the Chaohuilou Technology Industrial Park in Dalang, Longhua, Shenzhen in the Guangdong province, the engineering and manufacturing facility features a 2,700 square meter…read more

Technical Data Summary

August 1st, 2009

ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common…read more

Determining the junction temperature in a plastic semiconductor package, part II

September 1st, 1999

In the majority of applications involving plastic surface-mount packages, most of the heat generated by integrated circuits will flow to the printed circuit board (PCB) by way of the package leads and then to In…read more

Determining the junction temperature in a plastic semiconductor package, part 1

May 1st, 1999

One of the primary tasks of the thermal engineer is to determine the temperature of the junction (active circuitry on an integrated circuit) for the various packages in a system. Measurements performed in the industry-standard…read more

Thermal interface under a plastic quad flat pack

May 1st, 1998

Introduction Plastic components are designed so that the heat is dissipated by forced or natural convection. The use of plastic packages under conditions where neither cooling method is available introduces new challenges. High heat-dissipation plastic…read more