Aerospace

Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

Investigating New Methods for Removing Heat from 3-D Integrated Circuitry

November 2nd, 2015

Franklin Robinson, a NASA Thermal Engineer, and his team are studying different cooling techniques so that NASA might benefit from future integrated circuitry. “To make sure NASA benefits from this emerging 3-D-circuit technology, Robinson and…read more

Posted in Aerospace, Liquid Cooling, News | Comments Off on Investigating New Methods for Removing Heat from 3-D Integrated Circuitry

Satellite Cooling System Paves Way for More Compact Sensor Systems

September 1st, 2015

A team of scientists from Lockheed Martin have produced a small satellite cooling system, the high power Microcryocooler, which is the lightest on the market and three times more powerful than the company’s first design.…read more

Posted in Aerospace, Communications, Coolers, News | Comments Off on Satellite Cooling System Paves Way for More Compact Sensor Systems

Non-drip Epoxy Paste Cures Optically Clear

September 1st, 2015

Master Bond Inc. introduces the Master Bond EP21NDCL – a new two component non-drip epoxy paste that cures optically clear in thin sections. It is ideal for bonding, coating and sealing applications in aerospace, electrical,…read more

Posted in Aerospace, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on Non-drip Epoxy Paste Cures Optically Clear

Penn State Engineers Developed New Heat-Resistant Polymer

August 11th, 2015

A group of Penn State engineers have produced lightweight, flexible dielectric polymers that are heat resistant and easily manufactured. Because of its resistance to heat, the new polymer is ideal for use in power electronics…read more

Posted in Aerospace, Automotive, Materials, Compounds, Adhesives, Substrates, News | Comments Off on Penn State Engineers Developed New Heat-Resistant Polymer

Air Force Inquires About New Thermal Management Solutions for Future Aircraft

August 11th, 2015

The U.S. Air Force is looking into new thermal management techniques to cool the electronics in future fighter aircraft. “Officials of the Air Force Research Laboratory at Wright-Patterson Air Force Base, Ohio, issued a broad…read more

Posted in Aerospace, Defense, Design, Design, Heat Sinks, News, Research | Comments Off on Air Force Inquires About New Thermal Management Solutions for Future Aircraft

High Performance Epoxy Passes ASTM E595 Testing For NASA Specifications

July 27th, 2015

Master Bond introduces a two-part, NASA approved, low outgassing, high temperature resistant epoxy known as the EP121CL-LO. “This two component system has a low mixed viscosity of 1,000-3,000 cps with a mix ratio of 100:80…read more

Posted in Aerospace, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on High Performance Epoxy Passes ASTM E595 Testing For NASA Specifications

Need for Heat Spreaders Yields New Cooling Technologies

January 6th, 2015

The Air Force Research Laboratory (AFRL) and a small business partner have announced they are developing technologies that will help electronics stay cool. With funding from the Air Force Small Business Innovation Research (SBIR) program,…read more

Posted in Aerospace, Communications, Coolers, Defense, Heat Exchanger, News | Comments Off on Need for Heat Spreaders Yields New Cooling Technologies

Experiments Demonstrate Graphene is 10 times Stronger than Steel

December 9th, 2014

A research group from Rice University and the University of Massachusetts have discovered that graphene, one of the strongest materials in the world, is 10 times stronger than steel and can stop a speeding bullet.…read more

Posted in Aerospace, Defense, Materials, Compounds, Adhesives, Substrates, News | Comments Off on Experiments Demonstrate Graphene is 10 times Stronger than Steel

Company Introduces Low Outgassing Epoxy

November 24th, 2014

The Master Bond EP17HT-LO has just been introduced by Master Bond Inc. This product is a low outgassing “one part epoxy for bonding, sealing, coating and encapsulation applications.” This epoxy is capable of operating in…read more

Posted in Aerospace, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on Company Introduces Low Outgassing Epoxy

One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

August 7th, 2014

Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more

Posted in Aerospace, Automotive, Computer, Consumer, Industrial, Medical, New Products, Power, TIMs | Comments Off on One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

Thermally Conductive Epoxy for Aerospace, Electronics and OEM Industries

May 21st, 2014

Master Bond has introduced EP46HT-1AO, a two-component, thermally conductive epoxy formulated for bonding and sealing applications in the aerospace, electronic and specialty OEM industries. EP46HT-1AO combines thermal conductivity and electrical insulation properties. This dimensionally stable…read more

Posted in Aerospace, Computer, Design, IT Products, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on Thermally Conductive Epoxy for Aerospace, Electronics and OEM Industries

Self-Ventilating Heat Exchanger Cools Sealed Compartments without Contamination

May 9th, 2014

AMETEK Rotron has introduced the new Discus self-ventilating heat exchanger designed to cool sealed airborne or ground-based electronic and optical compartments without introducing contaminated external air. Ideal for pod-mounted airborne optical systems, the Discus can…read more

Posted in Aerospace, Design, Heat Exchanger | Comments Off on Self-Ventilating Heat Exchanger Cools Sealed Compartments without Contamination

Heat Pipe Assembly for Spacecraft and Hypersonic Vehicles Passes NASA Hypersonic Tests

May 2nd, 2014

Advanced thermal solutions provider Thermacore has announced that its heat pipe assembly recently completed testing at the NASA Ames Arc Jet Complex operating at very high temperatures in a hypersonic leading edge simulation, making it…read more

Posted in Aerospace, Defense, Heat Pipes | Comments Off on Heat Pipe Assembly for Spacecraft and Hypersonic Vehicles Passes NASA Hypersonic Tests