Aerospace

Thin “Super-Flow Micro” Fan Offers 0.60cfm

May 18th, 2016

JARO has recently released their newest Micro-Fan available with 0.60cfm. The fan measures 17x17x4 mm (at 15,000rpm), and offers a static pressure  of 2.413 mm H2O, according to JARO. With operating voltages from 2.8 to…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

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Graphene Nanoflakes Better Dissipates Electronics’ Heat

May 2nd, 2016

(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments…read more

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BIG Thermal Test for the JWST Test Model

April 25th, 2016

(April 22nd, 2016) The James Webb Space Telescope had an “observatory core” test model twin of itself constructed for the biggest thermal test Goddard mechanical integration technician, Chris Matthews, has ever had. Matthews’ team of…read more

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Potential Electronics Cooling Application of Carbon Nanotubes

April 25th, 2016

(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique…read more

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Small EHD Pump Solution May Cool Space Hardware

April 18th, 2016

(April 13th, 2016) Michal Talmor, a Ph.D. candidate in mechanical engineering at the Worcester Polytechnic Institute (WPI) in Worcester, Massachusetts, is focused on bringing electrohydrodynamic (EHD)-based thermal control to space exploration devices. Now in the…read more

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Study Shows LED Lighting Helps Grow Edible Plants for Space Missions

March 28th, 2016

The University of Arizona Controlled Environment Agriculture Center (CEAC) and Phillips Lighting have conducted a recent study to find that placing LED lighting in a lunar greenhouse prototype increases the amount of high-quality, edible lettuce…read more

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Higher Temperature Rated MLC Capacitors Announced

March 1st, 2016

Knowles brand, Dielectric Laboratories (DLI), has taken temperature performance to a level of 175°C in their Ultra-low ESR and High Q MLC capacitors. DLI detailed the following: “UL is an EIA Class I Stable TC,…read more

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Scientists Grow Efficient Light-Emitting Organic Semiconductor Crystals

February 19th, 2016

Recently, scientists from the faculty of physics of the Moscow State University have grown organic semiconductor crystals with extremely high light-emitting efficiency that can reduce the cost of creating light, flexible, and transparent light-emitting electronic…read more

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Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

Investigating New Methods for Removing Heat from 3-D Integrated Circuitry

November 2nd, 2015

Franklin Robinson, a NASA Thermal Engineer, and his team are studying different cooling techniques so that NASA might benefit from future integrated circuitry. “To make sure NASA benefits from this emerging 3-D-circuit technology, Robinson and…read more

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Satellite Cooling System Paves Way for More Compact Sensor Systems

September 1st, 2015

A team of scientists from Lockheed Martin have produced a small satellite cooling system, the high power Microcryocooler, which is the lightest on the market and three times more powerful than the company’s first design.…read more

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Non-drip Epoxy Paste Cures Optically Clear

September 1st, 2015

Master Bond Inc. introduces the Master Bond EP21NDCL – a new two component non-drip epoxy paste that cures optically clear in thin sections. It is ideal for bonding, coating and sealing applications in aerospace, electrical,…read more

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Penn State Engineers Developed New Heat-Resistant Polymer

August 11th, 2015

A group of Penn State engineers have produced lightweight, flexible dielectric polymers that are heat resistant and easily manufactured. Because of its resistance to heat, the new polymer is ideal for use in power electronics…read more

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