Aerospace

Book Review of Electronics Cooling (2016)

September 6th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving…read more

New Epoxy Ideal for High Vacuum Environments

August 30th, 2016

Master Bond has released their new two part epoxy, EP30AN-1. EP30AN-1 is ideal for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and NASA low outgassing approval. It offers superb dimensional…read more

Posted in Aerospace, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on New Epoxy Ideal for High Vacuum Environments

Wide Array of Flow Switches Available

August 29th, 2016

Sika offers a wide array of flow instruments, including flow switches. Flow switch options include the VK300 Flow Switch, Trimmable Paddle for Insertion, the VK300 Flow Switch for Copper Pipes, a Flow Switch for Pool…read more

Temporary Bonding Adhesive for Thin Wafer Handling Introduced

August 15th, 2016

AI Technology has developed specialized tools and equipment to handle thin wafers and thin reconstituted wafers. A series of temporary bonding materials can process temperatures up to 150 Cº, and are well accepted for grinding,…read more

Posted in Aerospace, Automotive, Industrial, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on Temporary Bonding Adhesive for Thin Wafer Handling Introduced

IC Coolers for Limited-Space Requirements

August 11th, 2016

Jaro’s new IC Coolers are ideal for limited-space requirements and designed with BGA, graphic, embedded processors and other IC packages in mind. They are intended for PCMCIA, PCI express cards, blade servers, and all hot…read more

Posted in Aerospace, Automotive, Computer, Coolers, Data Centers, Defense, Medical, New Products | Comments Off on IC Coolers for Limited-Space Requirements

Ultra-Thin Thermoelectric Cooler Provides Precise Temperature Control for Optical Electronics

August 4th, 2016

Phononic recently announced its pico-TEC series, a high-performance solid-state thermoelectric module (TEM) designed to provide precise temperature control in order to meet the unique thermal management requirements of optoelectronics and fiber optic modules. The pico-TECs are…read more

Posted in Aerospace, Automotive, Computer, New Products, Semiconductor, TECs | Comments Off on Ultra-Thin Thermoelectric Cooler Provides Precise Temperature Control for Optical Electronics

New Thermally Conductive Interface Material Announced

August 2nd, 2016

Noelle Industries, a division of Creative Materials, Inc, has recently introduced their new thermally conductive interface material, the 804-24. The 804-24 is a one-component thermal grease that has excellent heat dissipation properties, low sag, and…read more

Posted in Aerospace, Automotive, Computer, New Products, TIMs | Comments Off on New Thermally Conductive Interface Material Announced

Fan-less Modular 600W PSU Announced

July 26th, 2016

Excelsys has recently announced the development of its CoolX600, a fan-less modular 600W power supply that is 215 x 115 x 40mm (8.5 x 4.5inch x 1U). CoolX600 can be populated with up to four…read more

Posted in Aerospace, Automotive, Communications, Defense, Industrial, Medical, New Products, Power, Test & Measurement | Comments Off on Fan-less Modular 600W PSU Announced

New Raytheon Power Module is Industry Breakthrough

July 19th, 2016

(July 14, 2016) Recently Raytheon has developed a “SiC-based high-temperature small-form-factor power module for electrical switching in harsh environments,” according to Semiconductor-Today.com. Semiconductor-Today reported that, “A prototype module that includes two 1200V silicon carbide (SiC)…read more

Posted in Aerospace, Consumer, News, Power, Semiconductor, Software/Modeling | Comments Off on New Raytheon Power Module is Industry Breakthrough

Cooling Powerful Electronics with Powerful Sand

July 19th, 2016

(July 13, 2016) Recently, associate professor Baratunde Cola of the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology uncovered the “potential of silicon dioxide nanoparticles coated with a high dielectric constant polymer…read more

Posted in Aerospace, Automotive, Computer, Consumer, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Medical, News, Power | Comments Off on Cooling Powerful Electronics with Powerful Sand

Custom Modular Cooling Pumps Providing Off-The-Shelf Component Design

July 12th, 2016

Parker Aerospace, a business segment of global leader in motion and control technologies Parker Hannifin Corporation (NYSE:PH), announced a new family of cooling pumps featuring a common core of basic motor and pump components. According…read more

Posted in Aerospace, Coolers, New Products, Power | Comments Off on Custom Modular Cooling Pumps Providing Off-The-Shelf Component Design

New Orders for Indian Satellites’ Heat Pipes

May 31st, 2016

(May 27, 2016) More orders have been secured by Avasarala Technologies Ltd, the city-based tier-1 supplier of critical components to strategic sectors, to supply heat pipes for Indian satellites. “As an import-substitute component, the pipes…read more

Posted in Aerospace, Heat Pipes, News | Comments Off on New Orders for Indian Satellites’ Heat Pipes

Thin “Super-Flow Micro” Fan Offers 0.60cfm

May 18th, 2016

JARO has recently released their newest Micro-Fan available with 0.60cfm. The fan measures 17x17x4 mm (at 15,000rpm), and offers a static pressure  of 2.413 mm H2O, according to JARO. With operating voltages from 2.8 to…read more

Posted in Aerospace, Blowers / Fans / Filters, Computer, Consumer, Defense, Medical, New Products | Comments Off on Thin “Super-Flow Micro” Fan Offers 0.60cfm

New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

Posted in Aerospace, Automotive, Communications, Computer, Defense, Industrial, Materials, Compounds, Adhesives, Substrates, Medical, New Products | Comments Off on New Availability of Data Matrix Codes (DMCs)