Automotive

New Gap Filler Improves Heat Management in Automotive Electronics

May 20th, 2015

Dow Corning introduces the TC-4525, a thermally conductive gap filler that offers advanced heat management in automotive electronics. This gap filler is two-part silicone, soft, compressible and cost-effective. It can be used directly from its…read more

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Thermal Simulation to Improve LED Car Headlight Design

January 13th, 2015

Structural changes to LED headlights have generally been adding to the complexity of  its production, according to researchers. Certain car models come with a few choices of headlights, such as the new Audi TT which…read more

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Scientists Discover New Benefits of Graphene

January 5th, 2015

Scientists from Manchester University have discovered graphene can be used to harvest hydrogen from air and improve efficiency of solar cells. The scientists discovered that thin layers of Graphene can separate hydrogen from air using…read more

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Plastic Compounds Lower Weight of Automobiles by 50 Percent

November 10th, 2014

RTP Company announces its new thermally conductive compounds that reduce the weight in vehicles by replacing metal in the heating and cooling systems. “The automotive market is putting more emphasis on eliminating metals in order…read more

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Gasoline and Diesel Fueled Vehicles and Instruments See Increased Fuel Efficiency in Near Future

October 27th, 2014

A new thermoelectric material to increase fuel efficiency has been introduced by GMZ Energy. The material is called Hafnium-free p-type half-Heusler and costs less to produce than previous materials. This material also has an improved…read more

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Partnership Leads to Success in Development of New Converter

September 19th, 2014

Calyos, a new company that specializes in 2-phase cooling solutions of electronics, has partnered with Alstom Transport to develop a railway converter named the CIPLIX Traction Coffer.  From September 23-26, Calyos will be in Berlin…read more

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One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

August 7th, 2014

Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more

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High-Performing Thermoelectric Material May Improve Clean Energy Research

May 12th, 2014

Researchers at the University of Houston have discovered a new thermoelectric material capable of high performance at temperatures ranging from room temperature to 300 degrees Celsius (573 degrees Fahrenheit) and possibly higher. The material is…read more

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Power Cycle and Thermal Testing of Electronic Components

May 12th, 2014

Mentor Graphics Corporation has released the new MicReD Industrial Power Tester 1,500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance. The MicReD Industrial Power Tester 1500A is ideal…read more

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Polymer-Based Thermal Interface Material Cools Devices at 200°C

April 3rd, 2014

Scientists have developed a new polymer-based thermal interface material (TIM) capable of conducing heat 20 times better than conventional polymer. Reliable in temperatures of up to 200°C, the modified material can be fabricated on heat…read more

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Tesla to Replace Charging Adapters Following Vehicle Fire

January 28th, 2014

Electric vehicle manufacturer Tesla Motors Inc. has announced it will send out replacement wall charger adapters to customers following an investigation into a garage fire involving a Tesla Model S sedan and its wall-mounted charging…read more

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New Dispensable Thermal Pads Offer Improved Heat Management, Greater Application Potential

December 5th, 2013

Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new…read more

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New Thermal Modeling Programs Offer Wide Range of Application Simulations

November 22nd, 2013

Software designer Cradle Co., Ltd. has announced the release of version 11 of its SC/Tetra, scSTREAM/Heat Designer, and EOopti thermal modeling programs. SC/Tetra is the unstructured grid Computational Fluid Dynamics (CFD) software for simulations in…read more

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Thermally Conductive Adhesives for Use with Automotive Electronics

October 7th, 2013

Dow Corning has announced the release of two new thermally conductive adhesives, Dow Corning TC-2030 and Dow Corning TC-2035, for use with automotive electronics assemblies. The announcement was made today at Bondexpo in Stuttgart, Germany.…read more

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