Graphite mining and exploration company Focus Graphite Inc. has announced a joint venture development agreement on behalf of Grafoid Inc. with CapTherm Systems Inc., a developer of cooling technologies for high-power electronics, to develop and…read more
Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced
April 19th, 2013
Electronics Cooling Simulation Software Enables ‘Earlier Virtual Prototyping’, ‘Fewer Design Iterations’ in MDA and EDA Domains
March 19th, 2013
Mentor Graphics, a developer of electronic hardware and software design solutions, has announced FloTHERM XT, an electronics cooling simulation software package that enables “earlier virtual prototyping, fewer design iterations and advanced ‘what if’ analysis for…read more
Company Acquires Exclusive Licensing Rights for Electric Vehicle Heat Dissipation Process
January 18th, 2013
Electric Moto Corporation, Inc. (EMOT), a developer and manufacturer of zero-emission vehicles and related products, has announced it has acquired exclusive licensing rights for a patented heat dissipation process in electric vehicles. The patent for…read more
Ford Assigned Patent for Hybrid Electric Vehicle Thermal Management System
January 4th, 2013
Ford Global Technologies, a wholly-owned subsidiary of Ford Motor Company, has been assigned patent No. 8,246,422 for a “hybrid electric vehicle thermal management system.” According to the abstract of the patent published by the U.S.…read more
Nanotechnology Copper-Based Solder Material for Applications in Military and Commercial Systems
November 12th, 2012
Scientists at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto, California have developed CuantumFuse, a nanotechnology copper-based electrical interconnect material for applications in aerospace, military and commercial systems. According to the…read more
Thermoplastic Polyester for Thermal Management in LEDs and Electronic Components
October 29th, 2012
Science-based company Royal DSM has released PET XL-T, a thermoplastic polyester for thermal management in LED lighting systems and automotive electronics components. According to the company, Arnite PET XL-T was developed as an alternative to…read more
Thin Cavity Fluidic Heat Exchanger
July 5th, 2012
Third Millennium Engineering has released a Thin Cavity Fluidic Heat Exchanger, a small volume, high performance method for cooling critical electronic devices at the chip, board, module, and system levels. Its high thermal performance originates…read more
Silicon Carbide’s Potential in Hybrid and Electric Vehicles
June 11th, 2012
Encouraged by silicon carbide’s superior material properties, major automotive manufacturers involved in developing hybrid and electric vehicles are currently testing SiC-based MOSFETs and other transistors as a viable alternative to silicon-based transistors, particularly for under-the-hood…read more
Thermal Interface Materials Improve Heat Management
March 19th, 2012
Intermark offers thermal interface materials (silicone based, silicone free, EMC and Thermal management dual function types), heat spreader sheets, thin thermal tape, and other solutions to improve the heat management of any application including LED Lighting, laptops,…read more
Companies Form Partnership to Launch Hybrid Electric Drive
January 9th, 2012
Quantum Fuel Systems Technologies Worldwide, Inc. and SBE, Inc. announced a technology partnership. As part of this partnership, SBE, Inc. is providing a novel integrated capacitor/bus structure design solution for Quantum power electronics for automotive…read more
GM to Stop Chevy Volt Battery Coolant Fires
January 9th, 2012
General Motors is going to modify its Chevrolet Volt plug-in car to eliminate the possibility that its batteries can catch on fire hours or days after a serious side-impact crash. It turns out that battery…read more
New Ford Model Updates Cooling System
November 21st, 2011
The latest high performance variant of the Ford Mustang bearing the Shelby name has a 5.8-liter supercharged V8 producing a 650 horsepower and 600 lb-ft of torque. The new 5.8-liter engine also sees updates to…read more
Recent Posts
- New Business Development Specialist Seeks Position
- ‘Advanced Composite Thermal Management Materials and Applications’ Webinar to Take Place
- Preventing Thermal & Vibration Failures in Electronic Equipment
- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
Popular Posts
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Seebeck Coefficient 3 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 15 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
