Automotive

Special Design of All-Electric Supercar is Efficient Cooling Step Forward

June 28th, 2016

(June 27, 2016) In a recent interview with Faraday Future’s head of global design, Richard Kim explained their new FFZERO1 Concept car’s efficient cooling platform. “With the FFZERO1 we looked to push the limit in…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

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New Material Cools Solar Cells Yet Absorbs Sunlight

May 9th, 2016

Recently, researchers from Stanford University have achieved a combination of cooling and maintaining sunlight absorption with a wafer made of silica to better cool solar cells, according to BusinessWire.com. BusinessWire.com explained, “The researchers etched tapered…read more

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New USB Type-C Connectors and Cable Assemblies

May 2nd, 2016

Heilind Electronics has recently added Molex USB Type-C shielded I/O connectors and cable assemblies to its stock. The Type-C connectors offer a “more compact design” with “greater PCB savings, while allowing high-frequency mating in data,…read more

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Graphene Nanoflakes Better Dissipates Electronics’ Heat

May 2nd, 2016

(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments…read more

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Potential Electronics Cooling Application of Carbon Nanotubes

April 25th, 2016

(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique…read more

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New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures

April 4th, 2016

The US Army has awarded GE Aviation with a contract to develop silicon carbide-based power electronics that will allow high-voltage, next-generation ground vehicles to operate at higher temperatures. “The US Army’s implementation of [this technology…read more

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New TIMs That Offer High Thermal Conductivity

March 21st, 2016

Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications,…read more

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Higher Temperature Rated MLC Capacitors Announced

March 1st, 2016

Knowles brand, Dielectric Laboratories (DLI), has taken temperature performance to a level of 175°C in their Ultra-low ESR and High Q MLC capacitors. DLI detailed the following: “UL is an EIA Class I Stable TC,…read more

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Scientists Grow Efficient Light-Emitting Organic Semiconductor Crystals

February 19th, 2016

Recently, scientists from the faculty of physics of the Moscow State University have grown organic semiconductor crystals with extremely high light-emitting efficiency that can reduce the cost of creating light, flexible, and transparent light-emitting electronic…read more

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Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

New Cooling System for Automotive Battery is Simpler and Offers Higher Cooling Rates

December 14th, 2015

As electric cars go to higher charging rates, better cooling will be needed.  Direct Expansion, or DX, is a new cooling system that “uses the same refrigerant as used in your vehicle’s air conditioning system…read more

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Extreme-Temperature Probing Solutions Offered

November 25th, 2015

Keysight Technologies recently introduced the N7007A extreme-temperature 400-MHz passive probe and the N7013A extreme-temperature extension kit for medium- and high-voltage differential active probes. According to the company, the extreme-temperature probing solutions offer bandwidths up to…read more

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New Adhesives Ideal for Bonding and Encapsulating Semiconductors

August 24th, 2015

DELO introduces new one-component epoxy resins that can withstand temperatures up to 250 degrees Celsius. These new anhydride-based adhesives are ideal for bonding and encapsulating sensors and semiconductors, according to the company. The adhesives were…read more

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