One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

August 7th, 2014

Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more

High-Performing Thermoelectric Material May Improve Clean Energy Research

May 12th, 2014

Researchers at the University of Houston have discovered a new thermoelectric material capable of high performance at temperatures ranging from room temperature to 300 degrees Celsius (573 degrees Fahrenheit) and possibly higher. The material is…read more

Power Cycle and Thermal Testing of Electronic Components

May 12th, 2014

Mentor Graphics Corporation has released the new MicReD Industrial Power Tester 1,500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance. The MicReD Industrial Power Tester 1500A is ideal…read more

Polymer-Based Thermal Interface Material Cools Devices at 200°C

April 3rd, 2014

Scientists have developed a new polymer-based thermal interface material (TIM) capable of conducing heat 20 times better than conventional polymer. Reliable in temperatures of up to 200°C, the modified material can be fabricated on heat…read more

Tesla to Replace Charging Adapters Following Vehicle Fire

January 28th, 2014

Electric vehicle manufacturer Tesla Motors Inc. has announced it will send out replacement wall charger adapters to customers following an investigation into a garage fire involving a Tesla Model S sedan and its wall-mounted charging…read more

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New Dispensable Thermal Pads Offer Improved Heat Management, Greater Application Potential

December 5th, 2013

Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new…read more

New Thermal Modeling Programs Offer Wide Range of Application Simulations

November 22nd, 2013

Software designer Cradle Co., Ltd. has announced the release of version 11 of its SC/Tetra, scSTREAM/Heat Designer, and EOopti thermal modeling programs. SC/Tetra is the unstructured grid Computational Fluid Dynamics (CFD) software for simulations in…read more

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Thermally Conductive Adhesives for Use with Automotive Electronics

October 7th, 2013

Dow Corning has announced the release of two new thermally conductive adhesives, Dow Corning TC-2030 and Dow Corning TC-2035, for use with automotive electronics assemblies. The announcement was made today at Bondexpo in Stuttgart, Germany.…read more

Researchers Developing New Thermoelectric Materials

September 20th, 2013

New technology from researchers at the University of Houston has the potential to increase vehicle mileage by five percent and power plant and industrial processing performance by as much as 10 percent. The breakthrough combines…read more

Heat Exchanger Research Could Lead to Better Liquid Cooling in Aerospace, Automotive, Defense Applications

August 26th, 2013

A New Mexico State University assistant professor is investigating methods of increasing heat exchanger efficiency that could enable space missions to remain in orbit for longer periods of time and lead to better automotive, defense,…read more

High Temperature Capacitors Could Remove Need for EV Cooling Systems

August 8th, 2013

A new lead-free, high temperature ceramic capacitor developed by scientists at the National Physical Laboratory (NPL), UK could improve the efficiency and reliability of electric and hybrid vehicles by enabling the removal of heavy complex…read more

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Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced

April 19th, 2013

Graphite mining and exploration company Focus Graphite Inc. has announced a joint venture development agreement on behalf of Grafoid Inc. with CapTherm Systems Inc., a developer of cooling technologies for high-power electronics, to develop and…read more

Electronics Cooling Simulation Software Enables ‘Earlier Virtual Prototyping’, ‘Fewer Design Iterations’ in MDA and EDA Domains

March 19th, 2013

Mentor Graphics, a developer of electronic hardware and software design solutions, has announced FloTHERM XT, an electronics cooling simulation software package that enables “earlier virtual prototyping, fewer design iterations and advanced ‘what if’ analysis for…read more

Company Acquires Exclusive Licensing Rights for Electric Vehicle Heat Dissipation Process

January 18th, 2013

Electric Moto Corporation, Inc. (EMOT), a developer and manufacturer of zero-emission vehicles and related products, has announced it has acquired exclusive licensing rights for a patented heat dissipation process in electric vehicles. The patent for…read more

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