Automotive

Polymer-Based Thermal Interface Material Cools Devices at 200°C

April 3rd, 2014

Scientists have developed a new polymer-based thermal interface material (TIM) capable of conducing heat 20 times better than conventional polymer. Reliable in temperatures of up to 200°C, the modified material can be fabricated on heat…read more

Tesla to Replace Charging Adapters Following Vehicle Fire

January 28th, 2014

Electric vehicle manufacturer Tesla Motors Inc. has announced it will send out replacement wall charger adapters to customers following an investigation into a garage fire involving a Tesla Model S sedan and its wall-mounted charging…read more

New Dispensable Thermal Pads Offer Improved Heat Management, Greater Application Potential

December 5th, 2013

Dow Corning, a developer of silicon-based technology, has introduced new Dow Corning Dispensable Thermal Pads for use in LED, data server, telecommunications equipment and transportation thermal management applications. “Compared to traditional fabricated thermal pads, new…read more

New Thermal Modeling Programs Offer Wide Range of Application Simulations

November 22nd, 2013

Software designer Cradle Co., Ltd. has announced the release of version 11 of its SC/Tetra, scSTREAM/Heat Designer, and EOopti thermal modeling programs. SC/Tetra is the unstructured grid Computational Fluid Dynamics (CFD) software for simulations in…read more

Thermally Conductive Adhesives for Use with Automotive Electronics

October 7th, 2013

Dow Corning has announced the release of two new thermally conductive adhesives, Dow Corning TC-2030 and Dow Corning TC-2035, for use with automotive electronics assemblies. The announcement was made today at Bondexpo in Stuttgart, Germany.…read more

Researchers Developing New Thermoelectric Materials

September 20th, 2013

New technology from researchers at the University of Houston has the potential to increase vehicle mileage by five percent and power plant and industrial processing performance by as much as 10 percent. The breakthrough combines…read more

Heat Exchanger Research Could Lead to Better Liquid Cooling in Aerospace, Automotive, Defense Applications

August 26th, 2013

A New Mexico State University assistant professor is investigating methods of increasing heat exchanger efficiency that could enable space missions to remain in orbit for longer periods of time and lead to better automotive, defense,…read more

High Temperature Capacitors Could Remove Need for EV Cooling Systems

August 8th, 2013

A new lead-free, high temperature ceramic capacitor developed by scientists at the National Physical Laboratory (NPL), UK could improve the efficiency and reliability of electric and hybrid vehicles by enabling the removal of heavy complex…read more

Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced

April 19th, 2013

Graphite mining and exploration company Focus Graphite Inc. has announced a joint venture development agreement on behalf of Grafoid Inc. with CapTherm Systems Inc., a developer of cooling technologies for high-power electronics, to develop and…read more

Electronics Cooling Simulation Software Enables ‘Earlier Virtual Prototyping’, ‘Fewer Design Iterations’ in MDA and EDA Domains

March 19th, 2013

Mentor Graphics, a developer of electronic hardware and software design solutions, has announced FloTHERM XT, an electronics cooling simulation software package that enables “earlier virtual prototyping, fewer design iterations and advanced ‘what if’ analysis for…read more

Company Acquires Exclusive Licensing Rights for Electric Vehicle Heat Dissipation Process

January 18th, 2013

Electric Moto Corporation, Inc. (EMOT), a developer and manufacturer of zero-emission vehicles and related products, has announced it has acquired exclusive licensing rights for a patented heat dissipation process in electric vehicles. The patent for…read more

Ford Assigned Patent for Hybrid Electric Vehicle Thermal Management System

January 4th, 2013

Ford Global Technologies, a wholly-owned subsidiary of Ford Motor Company, has been assigned patent No. 8,246,422 for a “hybrid electric vehicle thermal management system.” According to the abstract of the patent published by the U.S.…read more

Nanotechnology Copper-Based Solder Material for Applications in Military and Commercial Systems

November 12th, 2012

Scientists at the Lockheed Martin Space Systems Advanced Technology Center (ATC) in Palo Alto, California have developed CuantumFuse, a nanotechnology copper-based electrical interconnect material for applications in aerospace, military and commercial systems. According to the…read more

Thermoplastic Polyester for Thermal Management in LEDs and Electronic Components

October 29th, 2012

Science-based company Royal DSM has released PET XL-T, a thermoplastic polyester for thermal management in LED lighting systems and automotive electronics components. According to the company, Arnite PET XL-T was developed as an alternative to…read more