Automotive

Temporary Bonding Adhesive for Thin Wafer Handling Introduced

August 15th, 2016

AI Technology has developed specialized tools and equipment to handle thin wafers and thin reconstituted wafers. A series of temporary bonding materials can process temperatures up to 150 Cº, and are well accepted for grinding,…read more

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IC Coolers for Limited-Space Requirements

August 11th, 2016

Jaro’s new IC Coolers are ideal for limited-space requirements and designed with BGA, graphic, embedded processors and other IC packages in mind. They are intended for PCMCIA, PCI express cards, blade servers, and all hot…read more

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Ultra-Thin Thermoelectric Cooler Provides Precise Temperature Control for Optical Electronics

August 4th, 2016

Phononic recently announced its pico-TEC series, a high-performance solid-state thermoelectric module (TEM) designed to provide precise temperature control in order to meet the unique thermal management requirements of optoelectronics and fiber optic modules. The pico-TECs are…read more

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New Thermally Conductive Interface Material Announced

August 2nd, 2016

Noelle Industries, a division of Creative Materials, Inc, has recently introduced their new thermally conductive interface material, the 804-24. The 804-24 is a one-component thermal grease that has excellent heat dissipation properties, low sag, and…read more

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Fan-less Modular 600W PSU Announced

July 26th, 2016

Excelsys has recently announced the development of its CoolX600, a fan-less modular 600W power supply that is 215 x 115 x 40mm (8.5 x 4.5inch x 1U). CoolX600 can be populated with up to four…read more

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Cooling Powerful Electronics with Powerful Sand

July 19th, 2016

(July 13, 2016) Recently, associate professor Baratunde Cola of the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology uncovered the “potential of silicon dioxide nanoparticles coated with a high dielectric constant polymer…read more

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Electric Cars Will Not Meet the Same Fate as HoverBoards’ Overheated Batteries

July 12th, 2016

(July 11, 2016) Where electric cars and hoverboards both use lithium-ion cells, electric cars will have a more diligent manufacturing process and thus more heat control. According to blog CarAndDriver.com, “Automotive-grade cells are very, very…read more

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Automobile Exposition Coming to Michigan This Year

July 12th, 2016

(July 6, 2016) The Electric & Hybrid Vehicle Technology Expo will be coming to Novi, Michigan, USA on September 13 – 15, 2016. The “Electric & Hybrid Vehicle Technology Expo is the premier showcase for…read more

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Special Design of All-Electric Supercar is Efficient Cooling Step Forward

June 28th, 2016

(June 27, 2016) In a recent interview with Faraday Future’s head of global design, Richard Kim explained their new FFZERO1 Concept car’s efficient cooling platform. “With the FFZERO1 we looked to push the limit in…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

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New Material Cools Solar Cells Yet Absorbs Sunlight

May 9th, 2016

Recently, researchers from Stanford University have achieved a combination of cooling and maintaining sunlight absorption with a wafer made of silica to better cool solar cells, according to BusinessWire.com. BusinessWire.com explained, “The researchers etched tapered…read more

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New USB Type-C Connectors and Cable Assemblies

May 2nd, 2016

Heilind Electronics has recently added Molex USB Type-C shielded I/O connectors and cable assemblies to its stock. The Type-C connectors offer a “more compact design” with “greater PCB savings, while allowing high-frequency mating in data,…read more

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Graphene Nanoflakes Better Dissipates Electronics’ Heat

May 2nd, 2016

(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments…read more

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Potential Electronics Cooling Application of Carbon Nanotubes

April 25th, 2016

(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique…read more

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