Communications

Book Review of Electronics Cooling (2016)

September 6th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving…read more

Tech Brief: Commercially-available Thermally Enhanced Polymer Composite Materials Characteristics

August 22nd, 2016

Peter Rodgers, Editor Valérie Eveloy, The Petroleum Institute Introduction The development, characterization, and implementation of polymer composite materials for the thermal management of electronic equipment has recently began to attract attention [1,2].  The enhanced thermal conductivity,…read more

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Combination of Two Insulators Could Enable More Efficient Heat Management

August 2nd, 2016

(July 28, 2016) Recently, “researchers at the University of Utah and the University of Minnesota have discovered that when two oxide compounds—strontium titanate (STO) and neodymium titanate (NTO)—are joined together, they make an extraordinary conductive…read more

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Fan-less Modular 600W PSU Announced

July 26th, 2016

Excelsys has recently announced the development of its CoolX600, a fan-less modular 600W power supply that is 215 x 115 x 40mm (8.5 x 4.5inch x 1U). CoolX600 can be populated with up to four…read more

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3D Printed Smartphone Case to Include Cooling Fans for Sustained Pokemon Go Play

July 19th, 2016

(July 18, 2016) A 3D printed smartphone case that may better support and cool smartphones has recently been designed and prototype printed. Made to look like a real life Pokédex, SparkFun user NPOOLE created the…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Design, Design, News, Plastics, Power | Comments Off on 3D Printed Smartphone Case to Include Cooling Fans for Sustained Pokemon Go Play

Cooling Fans Used for Computer Hacking

July 5th, 2016

(June 24, 2016) Researchers in Israel have recently created malware call Fansmitter and hijacked computer fans to transmit data. According to PCWorld.com, “The research from Ben-Gurion University of the Negev shows how data could be…read more

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High Temperature Analogue and Mixed Signal Electronics May Become Silicon Carbide-Based

May 31st, 2016

(May 24, 2016) Recently, SiC (Silicon carbide) has been recognized as a material that can be “used for small signal electronics – such as analogue and mixed-signal devices – making possible the locating of monitoring…read more

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New Speed Controllers for Fans to Reduce Energy Consumption

May 23rd, 2016

Orion Fans has recently developed a low-cost dual channel phase control unit to control fan speed for single or multiple fan assemblies, series OA11/22. It is field adjustable, with the ability to precisely control fan noise,…read more

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Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

Posted in Communications, Computer, Coolers, Data Centers, Defense, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, News | Comments Off on Researchers May Have Solved the Problem of Thermal Resistance for ICs

Self-Healable Electronic Material That Can Help Prevent Overheating

May 17th, 2016

(May 16, 2016) A new, more durable electronic material has recently been created to repair itself and heal all its functionality even after breaking several times. Phys.org detailed, “Self-healable materials are those that, after withstanding…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

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Liquid Cooling Used in New Off-Grid Power Generator and Water Purifier

May 3rd, 2016

(April 7, 2016) Watly has recently launched an Indiegogo campaign to raise the final needed funds for the release of its water sanitizing and electricity generating computer powered entirely by solar energy. The Watly 3.0…read more

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Software Update Leads to Device Failure by Overheating

May 2nd, 2016

(April 29, 2016) The new Nextfit Robin, an Android-based smartphone, experienced a major cooling malfunction after a recent software update which resulted in the phones overheating. The device normally heats up a bit when performing everyday…read more

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New Market Entry of Sealed Enclosure Coolers

April 11th, 2016

As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their…read more

Posted in Communications, Consumer, Coolers, Defense, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Medical, New Products | Comments Off on New Market Entry of Sealed Enclosure Coolers