Communications

Ball Bearing for Cooling Fan Motors Handles High-Speed Motor Operation

April 8th, 2013

NSK Ltd., a developer of industrial bearings, automotive bearings and modules and linear motion products, has released a high-performance ball bearing for cooling fan motors used in personal computers, data servers and communication base stations.…read more

High Power, High Efficiency Cooling Fans and Impellers

August 6th, 2012

NMB Technologies Corporation released a new line of high power, high efficiency cooling fans and impellers for applications such as storage and server rack systems, routers and switches, base stations, modular data systems, and in…read more

Global Energy Conservation Initiative for Wireless Industry

October 11th, 2011

As wireless networking companies push to become more environmentally friendly, CommScope, Inc. has launched an energy conservation initiative that supports the industry’s global efforts in reducing power consumption, greenhouse gas emissions and operating costs. It…read more

Thermal Gap Fillers Combine High Performance, Low Pricing

August 23rd, 2010

New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are…read more

Ultra-Thin Waterproof Piezoelectric Speaker

August 10th, 2010

Murata Electronics North America recently launched an ultra-thin waterproof piezoelectric speaker. With a thickness of only 0.9mm, this 19.5mm x 14.1mm speaker enables greater design freedom for the rapidly growing and evolving mobile market.  The…read more

Influence of Motor Supports on Cooling Performance of Small Scale Fans

July 26th, 2010

Ed J. Walsh, Jason Stafford & Vanessa Egan Stokes Research Institute, Dept. of Mechanical and Aeronautical Engineering, University of Limerick Introduction Today’s marketplace consists of many portable computing devices such as personal digital assistants and…read more

Miniature Environmental Control Unit for Electronics

April 27th, 2010

Aspen Systems has completed the development and military qualification of ECU-Chill™, a ruggedized refrigeration-based environmental control unit (ECU) for cooling electronics in mobile applications. ECU-Chill™ maintains sealed electronics enclosures at or below ambient temperatures, enabling Commercial-Off-The-Shelf…read more

The Better Box Model

August 1st, 2009

Introduction For the consumer, natural convection cooling or fan-less cooling is the method of choice. It is silent, it is reliable, it is simple, and it is environmentally sound because no additional energy is used…read more

Change and Communication

August 1st, 2009

We live in an age of change. Of course this is not new, the history of the human race has been one of change and adaptation throughout the ages. However, it seems that never before…read more

Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods

May 9th, 2009

Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field…read more

LED Thermal Standardization: A Hot Topic

May 9th, 2009

Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more

Numerical Simulation of Complex Submicron Devices

May 1st, 2009

Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to…read more

Challenges In Thermal Management Of Memory Modules

February 1st, 2008

The Datacenter Quandary Two significant challenges facing datacenter operators today are increased power and cooling costs [1]. In a recent survey of datacenter operators, 38% of respondents said they considered both power and cooling as…read more

en Route to a Greener Thermal Technology

February 1st, 2008

It’s no surprise. Power levels in the data center keep rising. In fact, the cost of powering the computers in the data center is beginning to exceed the cost of the computers themselves. The computer…read more