Communications

3D Printed Smartphone Case to Include Cooling Fans for Sustained Pokemon Go Play

July 19th, 2016

(July 18, 2016) A 3D printed smartphone case that may better support and cool smartphones has recently been designed and prototype printed. Made to look like a real life Pokédex, SparkFun user NPOOLE created the…read more

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Cooling Fans Used for Computer Hacking

July 5th, 2016

(June 24, 2016) Researchers in Israel have recently created malware call Fansmitter and hijacked computer fans to transmit data. According to PCWorld.com, “The research from Ben-Gurion University of the Negev shows how data could be…read more

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High Temperature Analogue and Mixed Signal Electronics May Become Silicon Carbide-Based

May 31st, 2016

(May 24, 2016) Recently, SiC (Silicon carbide) has been recognized as a material that can be “used for small signal electronics – such as analogue and mixed-signal devices – making possible the locating of monitoring…read more

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New Speed Controllers for Fans to Reduce Energy Consumption

May 23rd, 2016

Orion Fans has recently developed a low-cost dual channel phase control unit to control fan speed for single or multiple fan assemblies, series OA11/22. It is field adjustable, with the ability to precisely control fan noise,…read more

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Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

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Self-Healable Electronic Material That Can Help Prevent Overheating

May 17th, 2016

(May 16, 2016) A new, more durable electronic material has recently been created to repair itself and heal all its functionality even after breaking several times. Phys.org detailed, “Self-healable materials are those that, after withstanding…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

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Liquid Cooling Used in New Off-Grid Power Generator and Water Purifier

May 3rd, 2016

(April 7, 2016) Watly has recently launched an Indiegogo campaign to raise the final needed funds for the release of its water sanitizing and electricity generating computer powered entirely by solar energy. The Watly 3.0…read more

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Software Update Leads to Device Failure by Overheating

May 2nd, 2016

(April 29, 2016) The new Nextfit Robin, an Android-based smartphone, experienced a major cooling malfunction after a recent software update which resulted in the phones overheating. The device normally heats up a bit when performing everyday…read more

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New Market Entry of Sealed Enclosure Coolers

April 11th, 2016

As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their…read more

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Overheating Causes 911 System Failure

April 4th, 2016

Due to a problem with the computer cooling system, 911 service was down for about four hours recently in Buffalo, New York’s Erie County. According to Time Warner Cable News, the room at the Public…read more

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New Energy Efficient Air-to-Air Outdoor Cooler Released

March 29th, 2016

Laird has released its new air-to-air outdoor cooler, the AA-480 Series, that is smaller and more energy efficient than similar units on the market. The cooler has “480 Watts of cooling power and a Coefficient…read more

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Diamonds May Take Silicon’s Place in Future Smartphones

March 28th, 2016

A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already…read more

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New TIMs That Offer High Thermal Conductivity

March 21st, 2016

Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications,…read more

Posted in Automotive, Communications, Enclosures, Heat Sinks, IT Products, Materials, Compounds, Adhesives, Substrates, New Products, TIMs | Comments Off on New TIMs That Offer High Thermal Conductivity