Communications

Need for Heat Spreaders Yields New Cooling Technologies

January 6th, 2015

The Air Force Research Laboratory (AFRL) and a small business partner have announced they are developing technologies that will help electronics stay cool. With funding from the Air Force Small Business Innovation Research (SBIR) program,…read more

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Heat Exchangers Cool Electrical and Electronic Enclosures

March 21st, 2014

EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released its HE series heat exchangers for cooling electrical and electronic enclosures. Ideal for cooling medical devices, food/beverage process controls, telecom…read more

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Thermoelectrically-Cooled Electronic Enclosure Line Expanded for More Applications

February 24th, 2014

EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has expanded its line of pre-packaged electronic enclosures with new sizes to meet more applications. Designed to protect and cool electronics and…read more

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New Fan Delivers High Static Pressure and Energy Reduction

December 16th, 2013

Sanyo Denki Co., Ltd. has introduced the new San Ace 92 DC fan to its DC fan lineup. Measuring 92 × 92 × 38 mm, the new fan delivers the industry’s highest static pressure and…read more

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Flexible Thermal Absorbing Films Boost Heat Dissipation in Small Electronics

November 21st, 2013

Manufacturing company Henkel has released Loctite TAF, a new thermal absorbing film designed to address the heat management challenges associated with small but high-functioning handheld electronic devices. “Managing the intense heat generated by today’s handheld…read more

Posted in Communications, Consumer, Materials, Compounds, Adhesives, Substrates, New Products, TIMs | Comments Off on Flexible Thermal Absorbing Films Boost Heat Dissipation in Small Electronics

New Low Viscosity, Thermally-Conductive Silicone Potting Elastomer

October 3rd, 2013

NuSil Technology, a manufacturer of silicone materials for the medical, aerospace, electronics and engineering markets, has released R-2165, a new silicone solution for the protection of electronic components and systems such as sensors, relays and…read more

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Ball Bearing for Cooling Fan Motors Handles High-Speed Motor Operation

April 8th, 2013

NSK Ltd., a developer of industrial bearings, automotive bearings and modules and linear motion products, has released a high-performance ball bearing for cooling fan motors used in personal computers, data servers and communication base stations.…read more

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High Power, High Efficiency Cooling Fans and Impellers

August 6th, 2012

NMB Technologies Corporation released a new line of high power, high efficiency cooling fans and impellers for applications such as storage and server rack systems, routers and switches, base stations, modular data systems, and in…read more

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Technical Brief: Design Considerations for High Performance Processor Liquid Cooled Cold Plates

December 22nd, 2011

The meteoric rise in cooling requirements of commercial computer products has been driven by an exponential increase in microprocessor performance over the last decade. The conventional way to cool microprocessors has been to utilize air…read more

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Global Energy Conservation Initiative for Wireless Industry

October 11th, 2011

As wireless networking companies push to become more environmentally friendly, CommScope, Inc. has launched an energy conservation initiative that supports the industry’s global efforts in reducing power consumption, greenhouse gas emissions and operating costs. It…read more

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Thermal Gap Fillers Combine High Performance, Low Pricing

August 23rd, 2010

New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are…read more

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Ultra-Thin Waterproof Piezoelectric Speaker

August 10th, 2010

Murata Electronics North America recently launched an ultra-thin waterproof piezoelectric speaker. With a thickness of only 0.9mm, this 19.5mm x 14.1mm speaker enables greater design freedom for the rapidly growing and evolving mobile market.  The…read more

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Influence of Motor Supports on Cooling Performance of Small Scale Fans

July 26th, 2010

Ed J. Walsh, Jason Stafford & Vanessa Egan Stokes Research Institute, Dept. of Mechanical and Aeronautical Engineering, University of Limerick INTRODUCTION Today’s marketplace consists of many portable computing devices such as personal digital assistants and…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Heat Sinks | Comments Off on Influence of Motor Supports on Cooling Performance of Small Scale Fans

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Miniature Environmental Control Unit for Electronics

April 27th, 2010

Aspen Systems has completed the development and military qualification of ECU-Chill™, a ruggedized refrigeration-based environmental control unit (ECU) for cooling electronics in mobile applications. ECU-Chill™ maintains sealed electronics enclosures at or below ambient temperatures, enabling Commercial-Off-The-Shelf…read more

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