As wireless networking companies push to become more environmentally friendly, CommScope, Inc. has launched an energy conservation initiative that supports the industry’s global efforts in reducing power consumption, greenhouse gas emissions and operating costs. It…read more
Thermal Gap Fillers Combine High Performance, Low Pricing
August 23rd, 2010
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are…read more
Ultra-Thin Waterproof Piezoelectric Speaker
August 10th, 2010
Murata Electronics North America recently launched an ultra-thin waterproof piezoelectric speaker. With a thickness of only 0.9mm, this 19.5mm x 14.1mm speaker enables greater design freedom for the rapidly growing and evolving mobile market. The…read more
Influence of Motor Supports on Cooling Performance of Small Scale Fans
July 26th, 2010
Ed J. Walsh, Jason Stafford & Vanessa Egan Stokes Research Institute, Dept. of Mechanical and Aeronautical Engineering, University of Limerick Introduction Today’s marketplace consists of many portable computing devices such as personal digital assistants and…read more
Miniature Environmental Control Unit for Electronics
April 27th, 2010
Aspen Systems has completed the development and military qualification of ECU-Chill™, a ruggedized refrigeration-based environmental control unit (ECU) for cooling electronics in mobile applications. ECU-Chill™ maintains sealed electronics enclosures at or below ambient temperatures, enabling Commercial-Off-The-Shelf…read more
The Better Box Model
August 1st, 2009
Introduction For the consumer, natural convection cooling or fan-less cooling is the method of choice. It is silent, it is reliable, it is simple, and it is environmentally sound because no additional energy is used…read more
Change and Communication
August 1st, 2009
We live in an age of change. Of course this is not new, the history of the human race has been one of change and adaptation throughout the ages. However, it seems that never before…read more
Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods
May 9th, 2009
Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field…read more
LED Thermal Standardization: A Hot Topic
May 9th, 2009
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more
Numerical Simulation of Complex Submicron Devices
May 1st, 2009
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to…read more
Challenges In Thermal Management Of Memory Modules
February 1st, 2008
The Datacenter Quandary Two significant challenges facing datacenter operators today are increased power and cooling costs [1]. In a recent survey of datacenter operators, 38% of respondents said they considered both power and cooling as…read more
en Route to a Greener Thermal Technology
February 1st, 2008
It’s no surprise. Power levels in the data center keep rising. In fact, the cost of powering the computers in the data center is beginning to exceed the cost of the computers themselves. The computer…read more
Advanced Cooling Using Meso-Scale Evaporative Cold Plates
November 1st, 2007
Introduction Thermal management of servers and communications equipment has become significantly more challenging over the past several years. As is well known, processor powers have increased to 150 W or more and are projected to…read more
Liquid Cooling is Back
August 1st, 2005
Introduction IBM announced its return to water cooling on April 19, 2005 with the introduction of a water cooled heat exchanger mounted to the back cover of a 19 inch rack. This is the first…read more
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