Introduction As electronic products become more sophisticated and design margins tighten, defining the thermal management strategy early in the design cycle is vital to ensure a cost-effective design for the level of heat dissipation. Optimizing…read more
ASHRAE Committee Formed to Establish Thermal Guidelines for Datacom Facilities
February 1st, 2005
Introduction The environment of every data center is complex and unique. Air currents within the data center have hot and cold air streams colliding, cold air exhausting upward from perforated tiles, hot air streams exhausting…read more
Estimating Temperatures in an Air-cooled Closed Box Electronics Enclosure
February 1st, 2005
Introduction In the majority of air-cooling applications, openings or vents are provided in the enclosure or box in which the electronic components are housed. The required cooling air is drawn in from outside the box…read more
Communication Network Power Efficiency Assessment, Limitations and Directions
August 1st, 2004
Introduction Despite the slowdown in the communication industry, Internet traffic continues to grow rapidly, fueled by the explosion in data communications, mobile Internet, e-commerce, content rich applications, and multi-media services. Internet traffic has increased by…read more
Opto-electronic Transceiver Modules, a System Design Perspective
August 1st, 2004
Introduction Small Form Factor (SFF) optical transceiver packages for use at 1-2 Gbits/s data rates have been described by several authors [1-5]. These rely on dual miniature optical connectors such as the MT-RJ or the…read more
Critical Cooling Issues in High Power Radio Frequency Transmitter Amplifiers
May 1st, 2004
Introduction While emerging methodologies correctly insist that thermal engineers should be involved right from the early conceptual stages of electronics product design [1], many situations still require thermal analysis well after the introduction of the…read more
Hot Spots in Data Centers
August 1st, 2003
Heat loads of data processing equipment continue to increase at a rapid rate. This increasing heat load has been documented by a Thermal Management Consortium of 17 companies [1] as shown in Figure 1. Also…read more
Cooling of a Flat TV Monitor
May 1st, 2003
Thermal design in the consumer electronics business is about dealing with two difficult challenges: The first is to fulfill, and if possible surpass, customer expectations. The second is to do this in ever shortening design…read more
Challenges In Thermal Control Of Military Electronics Systems
February 1st, 2003
Thermal design engineers working in defense electronics are facing many challenges, some of which have been around for a long time and some that are more recent. Worldwide climatic extreme temperatures are reasonably constant and…read more
Packaging And Temperature Control Considerations For Planar Waveguide Circuits
February 1st, 2003
Optical Networking The all-optical network has been emerging as a solution to provide higher bandwidth, lower cost systems for handling high capacity network traffic. Due to the inherent limits of copper wire and the high…read more
Power Density Challenges Of Next Generation Telecommunication Networks
February 1st, 2003
Despite the current downturn in the telecommunications industry, data transfer (i.e. network traffic) is continuing to grow at a 100% rate [1]. It is already projected that network traffic demand will reach tens of Tb/s…read more
A system level cooling solution for cellular phone applications
May 1st, 2000
Improving thermal performance of electronic components is very challenging due to the increasing power density and decreasing module sizes. The design trade off between electrical and mechanical characteristics and the cost of manufacturing MCM products…read more
Computer-related thermal packaging at the millenial divide
January 1st, 2000
Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as…read more
Acoustic noise emission and communication systems in the next century
January 1st, 1999
Acoustic noise emission is one of several physical design issues addressed during the design of telecommunications and information technology equipment. In most systems, noise is a by-product of the air-movers used for system cooling. The…read more
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