Computer

3D Printed Smartphone Case to Include Cooling Fans for Sustained Pokemon Go Play

July 19th, 2016

(July 18, 2016) A 3D printed smartphone case that may better support and cool smartphones has recently been designed and prototype printed. Made to look like a real life Pokédex, SparkFun user NPOOLE created the…read more

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Cooling Powerful Electronics with Powerful Sand

July 19th, 2016

(July 13, 2016) Recently, associate professor Baratunde Cola of the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology uncovered the “potential of silicon dioxide nanoparticles coated with a high dielectric constant polymer…read more

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Application of Phase Change Materials in Handheld Computing Devices

July 7th, 2016

William Maltz, Darryl Moore, and Arun Raghupathy 1. Introduction With peak loads often in the order of minutes and ergonomic considerations limiting surface temperatures and acoustical noise, handheld devices, such as smart phones or tablets, are…read more

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Research Underway for Heat Conductor Substitutes for Diamond

July 5th, 2016

(July 5, 2016) Thanks to a research grant awarded from the Office of Naval Research for pursuing “high risk-high reward” scientific and technological breakthroughs, six universities are working to develop cost-effective and high-quality substitutes for…read more

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Cooling Fans Used for Computer Hacking

July 5th, 2016

(June 24, 2016) Researchers in Israel have recently created malware call Fansmitter and hijacked computer fans to transmit data. According to PCWorld.com, “The research from Ben-Gurion University of the Negev shows how data could be…read more

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Thermal Expansion Discovery Could Lead to More Durable Electronics

June 28th, 2016

(June 27, 2016) Standford professor of materials science and engineering, Reinhold Dauskardt, and doctoral candidate Joseph Burg, recently released a study revealing that the layers protecting transistors in chips respond differently to compression and tension…read more

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Two New Approaches to Thermal Management Problems

June 21st, 2016

(June 14, 2016) Recent research is looking at two opposite physical effects to keep chips cool by possibly distributing process loads across multiple cores. According to NewElectronics.co.uk, the National Physical Laboratory (NPL) is conducting two…read more

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Microfluidic Cooling Could Be Answer to Heat Buildup in Microchips

June 13th, 2016

(June 4, 2016) DARPA is seeking out solutions for the massive problem of heat buildup in microchips. They think they found it in microfluidic cooling. They’ve initiated a program called ICECool Applications (Intra/Interchip Enhanced Cooling), according to…read more

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Sizes Added to Backward-Curved Impeller Line

June 8th, 2016

Rosenberg has recently expanded its high-efficiency E-Series backward-curved impellers to now include sizes from 12.4 to 22 inches with either AC or EC motors. The unique airfoil blade impeller increases energy efficiency by up to…read more

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Researchers May Have Solved the Problem of Thermal Resistance for ICs

May 23rd, 2016

(May 18, 2016) Researchers at Lockheed Martin are further exploring the idea of microspraying hot integrated circuits (ICs) to cool their thermal resistance problem. EETimes.com reported, “The efforts are focused on gallium-nitride (GaN) power amplifiers…read more

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Thin “Super-Flow Micro” Fan Offers 0.60cfm

May 18th, 2016

JARO has recently released their newest Micro-Fan available with 0.60cfm. The fan measures 17x17x4 mm (at 15,000rpm), and offers a static pressure  of 2.413 mm H2O, according to JARO. With operating voltages from 2.8 to…read more

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New Skived-Copper Fan Heat-sink Keeps Intel Servers Cool

May 18th, 2016

JARO has recently released their new low-profile, 1U CPU cooler with a heat-sink and blower, model JCC00066. Specifically designed for use with data storage, high-density, backup, or cloud servers, JARO’s cooler works well for Intel processors…read more

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Recall On Overheating Laptop Battery Packs

May 17th, 2016

(March 31, 2016) Toshiba recently issued a voluntary recall on its laptop battery packs for potential burn and fire hazards from overheating. According to ConsumerReports.org, the battery packs were manufactured by Panasonic and installed in…read more

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Laptops May Start Producing Far Less Heat

May 17th, 2016

(May 10, 2016) Massachusetts Institute of Technology’s postdoc Cui-Zu Chang and his colleagues have been “working to create devices with components which have little [to no] resistance to the flow of electricity” in laptops, according…read more

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