Computer

Potential Electronics Cooling Application of Carbon Nanotubes

April 25th, 2016

(April 21st, 2016) A technique has been found that could allow carbon nanotubes to be used in electronic cooling and as devices in microchips, sensors and circuits in the future. Phys.org reported that the technique…read more

Posted in Aerospace, Automotive, Computer, Coolers, Defense, Materials, Compounds, Adhesives, Substrates, Medical, News, Semiconductor | Comments Off on Potential Electronics Cooling Application of Carbon Nanotubes

New “Form-In-Place” Product with Process Demonstration Video

April 22nd, 2016

JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech…read more

Posted in Computer, Design, Design, Materials, Compounds, Adhesives, Substrates, New Products, Thermal Imaging | Comments Off on New “Form-In-Place” Product with Process Demonstration Video

New Website for Unique Product Line

April 18th, 2016

Developer of cooling solutions for high-powered electronics, QuantaCool,  has selected Schubert b2b to design a new website to support the company as it goes to market with its PolarBox™, PolarRak™ and PolarMax™ product lines. “QuantaCool’s…read more

Posted in Computer, Data Centers, Heat Pipes, LED / Lighting, New Products, Refrigeration | Comments Off on New Website for Unique Product Line

New System Improves Lead Times

April 18th, 2016

A manufacturer of thermoelectric air conditioners, TECA Corporation, has recently implemented a new program to improve lead times. President of TECA, Mike Mikalauskis, said, “We were able to pair new software with a more streamlined…read more

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Metal Inverse Opals Could Better Cool Electronics

April 18th, 2016

(April 7th, 2016) New work by researchers at Stanford University and the University of Illinois at Urbana-Champaign, suggest that “metal inverse opals” could be used to cool down electronic devices as well as other thermal…read more

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Thermal Facts and Fairy Tales: Automated Meshing Philosophy?

April 14th, 2016

Thermal Facts and Fairy Tales: Automated Meshing Philosophy? Peter Rodgers Fairy tales are a well-established way to convey science and technology education. For example, a recent textbook [1] has documented how a range of Victorian-era…read more

Posted in Articles, CFD Software, Computer, Liquid Cooling, Software/Modeling, Test & Measurement | Comments Off on Thermal Facts and Fairy Tales: Automated Meshing Philosophy?

World’s Thinnest Laptop Runs on ‘Hyperbaric’ Cooling

April 11th, 2016

HP has recently released the world’s thinnest laptop – the Spectre 13.3” notebook, which cools its CPUs with what HP calls ‘hyperbaric cooling technology’. This system features two ultra-thin fans, a heat-pipe, and a special…read more

Posted in Blowers / Fans / Filters, Computer, Design, Design, Heat Pipes, News | Comments Off on World’s Thinnest Laptop Runs on ‘Hyperbaric’ Cooling

Electrocaloric Polymers That Create On-Demand Cooling

April 11th, 2016

A team of researchers from Pennsylvania State University have recently developed a blend of ferroelectric polymers that could cool chips and small scale systems on demand. According to NewElectronics these are called electrocaloric materials, and…read more

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Overheating Causes 911 System Failure

April 4th, 2016

Due to a problem with the computer cooling system, 911 service was down for about four hours recently in Buffalo, New York’s Erie County. According to Time Warner Cable News, the room at the Public…read more

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Company Doubles Compute Capacity within Existing Racks with Liquid Cooling Upgrade

March 29th, 2016

Cascade Technologies is deploying direct contact liquid cooling from CoolIT Systems to increase their compute density by 2.5 times within their existing floor space, rack space and air conditioning capacity. “The upgraded Cascade cluster now…read more

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Diamonds May Take Silicon’s Place in Future Smartphones

March 28th, 2016

A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Design, Design, Heat Sinks, News, Power, Research, Semiconductor | Comments Off on Diamonds May Take Silicon’s Place in Future Smartphones

New Particle Creates Less Heat, Saves Energy

March 28th, 2016

Researchers have discovered a new particle that doesn’t consume a lot of energy, and thus doesn’t require an elaborate cooling system. It is called the Weyl fermion, a particle that only exists inside materials and…read more

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Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

Cooling High-Powered Electronics with Tiny Drops of Water

March 21st, 2016

Lockheed Martin and the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) want to cool high-powered microchips with microscopic drops of water. “A core team of Lockheed Martin engineers is working on a…read more

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