Computer

High Static Pressure Fan Offers 1.4 Times Static Pressure

May 11th, 2015

Sanyo Denki introduces its new San Ace 40 9HV type high static pressure fan. The fan type offers the highest static pressure in the industry – 1.4 times the static pressure than conventional DC fans,…read more

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UPenn Physicists Discover New Material that May Cool Computers

May 5th, 2015

Heat emitted from computers, laptops and other electronic devices during use is regularly caused by numerous transistors overcrowded in the devices. This also expels large amounts of wasted heat energy. A pair of physicists from…read more

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Cooling System for Computer Processors Could Save Consumers Billions

May 5th, 2015

A patented passive cooling system for computer processors could save U.S. consumers more than 6.3 billion dollars in electricity costs per year. The system is currently being manufactured at the University of Alabama in Huntsville…read more

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Startup Utilizes Waste Heat and Lowers Server Computing Costs

April 14th, 2015

Nerdalize, a Dutch startup company, wants to utilize waste heat generated from servers to heat homes for free. The company offers “eRadiators,” which are high-performance servers that also act as radiators. The company plans to…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

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ASU Engineer’s Computing Node Research Suggests Large Reduction in Energy Usage

April 7th, 2015

Carole-Jean Wu, computer scientist and engineer at Arizona State University, is gaining recognition for her work to improve energy efficiency of computing nodes, which includes everything from smartphones and tablets, to desktop processors and data…read more

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Dissolvable Materials Look Toward ‘Greener’ Future

October 28th, 2014

A research group, lead by John A. Rogers, at the University of Illinois at Urbana-Champaign, has produced dissolvable circuits and sensors. These devices are made from silicon and can dissolve completely when immersed in water…read more

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One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

August 7th, 2014

Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more

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Nanodiamonds Boost Thermal Conductivity of Thermoplastics

July 18th, 2014

Carbodeon has announced the release of new nanodiamond-enhanced thermoplastics, which offer a 20-100 percent improvement in thermal conductivity compared to traditional materials. The new uDiamond® products can achieve a 20 percent increase in polymer thermal…read more

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Thermal Adhesive Tape Reduces PCB Production Time

June 18th, 2014

Universal Science, a provider of thermal management solutions, has introduced a reflowable, thermally conductive adhesive tape designed for application during PCB manufacturing. Bondline 1000-Reflow can be laminated directly to PCBs prior to processing, enabling the…read more

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Syringe-Packaged Greases Satisfy Electrical and Thermal Conductivity Needs

June 9th, 2014

Intertronics now offers CircuitWorks’ syringe-packaged conductive greases, which provide electric and/or thermal conductivity for a range of applications. CircuitWorks’ new silicone-free heat sink grease will not harden or dry out while offering excellent thermal conductivity…read more

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Three-Phase Thermoelectric Air Conditioners for Enclosure Cooling

June 9th, 2014

Thermolectric cooling supplier TECA has announced new three-phase thermoelectric air conditioners. Offering high performance and efficiency, the new maintenance-free air conditioners do not require filters, coolant or chemicals of any kind. Each has a built-in…read more

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Thermally Conductive Epoxy for Aerospace, Electronics and OEM Industries

May 21st, 2014

Master Bond has introduced EP46HT-1AO, a two-component, thermally conductive epoxy formulated for bonding and sealing applications in the aerospace, electronic and specialty OEM industries. EP46HT-1AO combines thermal conductivity and electrical insulation properties. This dimensionally stable…read more

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Filter Fans Provide Effective Cooling for Electrical and Electronic Enclosures

May 21st, 2014

EIC Solutions, Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has introduced a new line of filter fans designed to remove unwanted heat from electrical/electronic enclosures and cabinets. The VFF series…read more

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