Computer

Atom Cooling Technique Discovered

August 25th, 2015

A team of researchers from the University of Southampton have successfully used matter waves to cool molecules that cannot be handled by typical laser methods. This is the first demonstration of this technique, which was…read more

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Solid-state CPU Cooler Offers Advanced Cooling

August 24th, 2015

Phononic unveils a new solid-state CPU cooler, the Phononic model HEX 1.0. The small package, with dimensions of 4.3″ x 3.5″ x 3.5″, offers an advanced cooling performance despite its tiny size. “Unlike traditional heatsink/fan…read more

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Liquid-cooled Primergy Server to Cut Energy Costs in Half

August 12th, 2015

Fujitsu unveiled a new liquid-cooled Primergy server, the Primergy CX400 M1, which will cut energy costs in half and increase density in data centers by five times. “Fujitsu is revolutionizing data center design, and is…read more

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California Energy Code Updated; New Regulations for Cooling Data Centers

July 28th, 2015

The California Energy Code, also known Title 24 of the CA Code of Regulations – part 6, has been revised. The new revision implements new regulations for cooling data centers and server rooms in order…read more

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New Fan Offers Industry Leading Static Pressure

July 27th, 2015

Sanyo Denki introduces the San Ace 172 9HV type ø 172 x 150 x 51 mm high static pressure fan. The San Ace 172 9HV type offers industry leading static pressure, or 1.6 times the…read more

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Colored Electrically Conductive Inks and Coatings

July 20th, 2015

Creative Materials, Inc. introduces the 126-29 product series of electrically conductive inks and coatings. The inks and coatings are available in red, blue or yellow. “Colored conductive inks feature good color stability and minimal opportunity…read more

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New Heat Transfer Tapes Offer Advanced Thermal Management

July 14th, 2015

Techsil introduces two new thermally conductive and pressure sensitive adhesive tapes for thermal management of electronic systems, the Stokvis 202331 and 202332. The tapes are double sided and provide efficient cooling solutions by dissipating heat…read more

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Discovered Material May Reduce Heat Buildup in Computer Chips

June 23rd, 2015

Researchers conducting x-ray studies at the U.S. Department of Energy’s SLAC National Accelerator Laboratory have observed a possible solution for reducing heat buildup in computer chips for the first time. The team observed “an exotic…read more

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University Installs Liquid-cooling Solution

June 23rd, 2015

CoolIT Systems has successfully installed its liquid cooling DCLC rack at the Center for Biological Sequence Analysis at the Technical University of Denmark (DTU). The DCLC rack uses waste heat and converts it into usable…read more

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Researchers Successfully Measure Thermoelectric Behavior for the First Time

June 9th, 2015

A team from Sandia National Laboratories has made the first measurement of thermoelectric behavior via nanoporous metal-organic framework (MOF). This discovery could produce a new class of materials in the future that would improve upon…read more

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Optical Transport Could Replace Wires in Computers

June 2nd, 2015

An article published in Nature Photonics announces a breakthrough in creating faster and more efficient computers. Instead of using wires/electricity to send data back and forth in computers, the Stanford team, including electrical engineer Jelena…read more

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High Static Pressure Fan Offers 1.4 Times Static Pressure

May 11th, 2015

Sanyo Denki introduces its new San Ace 40 9HV type high static pressure fan. The fan type offers the highest static pressure in the industry – 1.4 times the static pressure than conventional DC fans,…read more

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UPenn Physicists Discover New Material that May Cool Computers

May 5th, 2015

Heat emitted from computers, laptops and other electronic devices during use is regularly caused by numerous transistors overcrowded in the devices. This also expels large amounts of wasted heat energy. A pair of physicists from…read more

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Cooling System for Computer Processors Could Save Consumers Billions

May 5th, 2015

A patented passive cooling system for computer processors could save U.S. consumers more than 6.3 billion dollars in electricity costs per year. The system is currently being manufactured at the University of Alabama in Huntsville…read more

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