Computer

Graphene Improves Copper Film Thermal Conductivity

March 11th, 2014

The placement of a single atomic plane of graphene on the surface of a copper film can significantly increase the film’s thermal conductivity, making the hybrid material ideal for more demanding thermal management applications, according…read more

Magnetically-Stimulated Flow Patterns Could Boost Heat Transfer

March 11th, 2014

Magnetically-stimulated fluid flow patterns may offer a new method for handling difficult heat transfer problems by overcoming natural convection limits, according to new research from scientists at Sandia National Laboratories. Convection cooling, which refers to…read more

Nanoscale Pillars May Improve Thermoelectric Materials

March 10th, 2014

Researchers at the University of Colorado Boulder say a new method of improving thermoelectric materials could lead to the development of better solar panels, more energy-efficient cooling equipment and effective devices that could turn waste…read more

Researchers Eye Passive Cooling System for Microelectronics

March 6th, 2014

Researchers at San Diego State University in California are examining an alternative to traditional heat pipes they say could help increase cooling efficiency in laptops and other portable electronic devices. Known as pulsating or oscillating…read more

Ultra-Thin Titanium Based Thermal Solution for Electronic Applications

February 28th, 2014

Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design…read more

Bitcoin 2-Phase Immersion Cooling and the Implications for High Performance Computing

February 28th, 2014

Alex Kampl Allied Control Company Abstract Recently, Bitcoin and Bitcoin mining have aroused international interest.  This article describes the cooling challenges faced by Bitcoin miners and discusses the implications on the future of cooling for…read more

Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization

February 28th, 2014

Anurag Gupta, David H. Altman, Daniel P. Resler Raytheon Integrated Defense Systems Introduction Electrical resistors are often used to simulate heat-dissipating electronic devices in thermal characterization of semiconductor devices. This article describes a study in…read more

Apple Files Patent for Smaller, Quieter Wireless Cooling Fan

February 20th, 2014

A patent application filed by Apple hints at the company’s latest plan to bypass design limitations and shrink their devices even more. While the technology company strives to develop increasingly lighter and thinner products, certain…read more

Heat Sink Series Provides Modular Cooling Options for Electrical Components

February 20th, 2014

Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection.…read more

Fansinks for High Temperature Applications

February 6th, 2014

CTS Corporation has announced the release of new fansinks for high temperature applications. Designed to absorb and disperse heat away from high temperature devices, the FHS series features an operating temperature range of -10°C to…read more

Research Could Lead to New Thermal Flow Control Devices

February 4th, 2014

Researchers have proposed a new method of controlling heat flow similar to the way electronic components handle electrical current that could deliver more efficient thermal management in a variety of applications. Developed by scientists at…read more

Carbon Nanotubes Boost Microprocessor Cooling

February 4th, 2014

Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to…read more

PCMA Thermal Interface for Intel Core LGA-115x Processors

February 4th, 2014

Liquid cooling product manufacturer EK Water Blocks has released EK-TIM Indigo XS, a thermal interface material for Intel Core LGA-115x processors. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo XS is a…read more

Heating Up Nanodevices May Keep Electronics Cool

January 28th, 2014

As electronic devices have grown smaller and more powerful, new thermal management methods have been created to help prevent them from overheating; however, researchers and engineers are in a constant race to come up with…read more