Computer

Heat Sinks Contribute to Cool Silence

July 27th, 2010

Silent-cooled graphics cards are becoming increasingly prevalent as PC hardware is becoming increasingly efficient. In silent cooling, a heat sink is installed in a model that engineers determine can remain safely cool without a fan.…read more

Series of Papers Illustrate Use of Thermal Simulation Technology in Design

July 26th, 2010

NMB Technologies Corporation introduces a new series of informational engineering papers on how thermal simulation can aid, not only in the design of a system, but in anticipating the behavior of cooling components. In looking…read more

The Uses of Simplicity in Thermal Analysis

July 26th, 2010

Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater packaging and system…read more

Experimental Methodologies for Thermal Design in Silicon Validation Platforms

July 26th, 2010

Rahima K. Mohammed, Yi Xia, Ying-Feng Pang, Ridvan A. Sahan Intel® Corporation Introduction Silicon validation platforms are purpose-built to validate processors, chipsets, and ASICs to ensure world-class quality and reliable products. These platforms are a…read more

Influence of Motor Supports on Cooling Performance of Small Scale Fans

July 26th, 2010

Ed J. Walsh, Jason Stafford & Vanessa Egan Stokes Research Institute, Dept. of Mechanical and Aeronautical Engineering, University of Limerick Introduction Today’s marketplace consists of many portable computing devices such as personal digital assistants and…read more

Product & Industry News

July 26th, 2010

Mitsubishi Adds LED-Based Cube to Display Wall Line-up Mitsubishi Digital Electronics America’s Presentation Products Division has expanded its SeventySeries display wall line with the SeventySeries: LED, an LED-based, rear-projection display wall cube designed specifically for…read more

Sony Recalls VAIO Laptop Computers Due to Burn Hazard

July 12th, 2010

Sony Electronics Inc. has announced a recall of about 233,000 Sony VAIO 233000 notebook computers after it received 30 reports of the deformed keyboards and casing owing to overheating. This overheating poses a burn hazard…read more

Forced-Air Enclosure for Conduction-Cooled Embedded Computing Boards

June 21st, 2010

Extreme Engineering Solutions (X-ES) in Middleton, Wis., is introducing the 8.8 pound XPand4200, a sub-half-ATR, forced-air-cooled enclosure for conduction-cooled modules for embedded computing in vetronics and avionics applications in unmanned aerial vehicles (UAVs), helicopters, fixed-wing…read more

Liquid Submersion Blade Server

June 7th, 2010

Hardcore Computer, Inc., recently launched Liquid Blade™, a Total Liquid Submersion blade server. The initial Liquid Blade™ server platform, which is powered by two Intel® 5500 or 5600 series Xeon® processors running on an Intel S5500HV…read more

Heat Conducting Graphene Could Cool Electronics

June 7th, 2010

Multiple layers of graphene show strong heat conducting properties that can be harnessed in removing dissipated heat from electronic devices, a team of scientists from the University of California reported in a recently published paper…read more

Multiple Platforms CPU Cooler

May 25th, 2010

GlacialTech has introduced the IGLOO 5760 Multiple Platforms CPU cooler. This design incorporates a specially aligned copper heat pipe combination of three pipes that disperse the heat from the CPU directly into the heat sink…read more

Ultra-Green CPU Cooling Technology

May 25th, 2010

NEC has developed an eco-friendly cooling system for CPUs, said to use 60% less energy than a water-cooling system and even 80% less than an air-cooling system. The core of the system is a liquid…read more

Compact Water-Circulation System Prevents Stacks of Electronic Chips

May 25th, 2010

A research team from the A*STAR Institute of Microelectronics and Nanyang University in Singapore has designed and built a water circulation system to cool stacks of integrated electrical circuits.  “The heat must be removed from…read more

Intel® Atom™ Processor-Based Platform Uses Significantly Lower Power

May 10th, 2010

Intel Corporation has unveiled its newest Intel® Atom™ processor-based platform. The technology package provides significantly lower power consumption and prepares the company to target a range of computing devices, including high-end smartphones, tablets and other…read more