Industrial

Company Asked to Participate in Three-Year Project

September 22nd, 2014

Element Six has recently been asked by the European Commission’s Seventh Framework Programme to assist in a three year project to develop high power laser on a 3.1 million dollar budget. “The new laser will…read more

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Partnership Leads to Success in Development of New Converter

September 19th, 2014

Calyos, a new company that specializes in 2-phase cooling solutions of electronics, has partnered with Alstom Transport to develop a railway converter named the CIPLIX Traction Coffer.  From September 23-26, Calyos will be in Berlin…read more

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One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

August 7th, 2014

Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more

High-Pressure Torsion Method Could Yield More Efficient Thermoelectric Devices

July 14th, 2014

Scientists at Kyushu University in Japan have developed a novel way of reducing the thermoconductivity of crystalline silicon using high-pressure torsion that could result in a more efficient thermoelectric device. Thermoelectric energy devices, which rely…read more

Phase-Change TIM Offers Good Alternative to Grease

July 7th, 2014

Universal Science has introduced a new phase change thermal interface material that offers a cleaner, more effective alternative to thermal grease. With 4.0 w/mK thermal conductivity, UniPhase 4000-COB is ideal for use in a wide…read more

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Metal Organic Frameworks Applied in Layers Could Signal Cooling Revolution

June 26th, 2014

Researchers at Germany’s Fraunhofer Institute of Solar Energy Systems have developed highly-porous metal organic frameworks (MOFs) that can be applied in a thin layer to efficiently absorb large quantities of water vapor. MOFs, as determined…read more

Adhesive Cures at Temperatures as Low as 60°C

June 23rd, 2014

DELO, a manufacturer of industrial adhesives for automotive, consumer and industrial electronics applications, has released a new heat-curing adhesive that cures to full strength in temperatures as low at 60°C. The new DELOMONOPOX LT204 epoxy resin…read more

New Device to Cool Chips at the Micro-Scale

June 19th, 2014

Researchers at the University of California, Berkeley and the University of California, San Diego have developed a novel evaporator structure that can be integrated directly into electronics to cool chips with micro-sized components. “The idea…read more

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Thermal Adhesive Tape Reduces PCB Production Time

June 18th, 2014

Universal Science, a provider of thermal management solutions, has introduced a reflowable, thermally conductive adhesive tape designed for application during PCB manufacturing. Bondline 1000-Reflow can be laminated directly to PCBs prior to processing, enabling the…read more

Syringe-Packaged Greases Satisfy Electrical and Thermal Conductivity Needs

June 9th, 2014

Intertronics now offers CircuitWorks’ syringe-packaged conductive greases, which provide electric and/or thermal conductivity for a range of applications. CircuitWorks’ new silicone-free heat sink grease will not harden or dry out while offering excellent thermal conductivity…read more

Three-Phase Thermoelectric Air Conditioners for Enclosure Cooling

June 9th, 2014

Thermolectric cooling supplier TECA has announced new three-phase thermoelectric air conditioners. Offering high performance and efficiency, the new maintenance-free air conditioners do not require filters, coolant or chemicals of any kind. Each has a built-in…read more

Filter Fans Provide Effective Cooling for Electrical and Electronic Enclosures

May 21st, 2014

EIC Solutions, Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has introduced a new line of filter fans designed to remove unwanted heat from electrical/electronic enclosures and cabinets. The VFF series…read more

High-Performing Thermoelectric Material May Improve Clean Energy Research

May 12th, 2014

Researchers at the University of Houston have discovered a new thermoelectric material capable of high performance at temperatures ranging from room temperature to 300 degrees Celsius (573 degrees Fahrenheit) and possibly higher. The material is…read more

Power Cycle and Thermal Testing of Electronic Components

May 12th, 2014

Mentor Graphics Corporation has released the new MicReD Industrial Power Tester 1,500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance. The MicReD Industrial Power Tester 1500A is ideal…read more