Industrial

Microchips Tolerate Extreme Temperatures in Industrial Applications

April 4th, 2014

German scientists have successfully fabricated compact microchips able to tolerate temperatures up to 300°C in an achievement that could have significant implications for the geothermal and oil production industries. Drill bits and borehole probes employed…read more

Heat Exchangers Cool Electrical and Electronic Enclosures

March 21st, 2014

EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released its HE series heat exchangers for cooling electrical and electronic enclosures. Ideal for cooling medical devices, food/beverage process controls, telecom…read more

Non-Silicone Thermal Pad Offers Natural Tack, Good Insulation

March 10th, 2014

Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and…read more

Magnetic Refrigeration Could Replace Compressor Systems

March 7th, 2014

Researchers working in GE labs have used special magnetic material to generate temperatures cold enough to freeze water in a breakthrough that could find its way into commercial refrigerators by the end of the decade.…read more

Thermoelectrically-Cooled Electronic Enclosure Line Expanded for More Applications

February 24th, 2014

EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has expanded its line of pre-packaged electronic enclosures with new sizes to meet more applications. Designed to protect and cool electronics and…read more

Heat Sink Series Provides Modular Cooling Options for Electrical Components

February 20th, 2014

Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection.…read more

Research Could Lead to New Thermal Flow Control Devices

February 4th, 2014

Researchers have proposed a new method of controlling heat flow similar to the way electronic components handle electrical current that could deliver more efficient thermal management in a variety of applications. Developed by scientists at…read more

Thermally Conductive Two Component Urethane Modified Epoxy Gel

January 12th, 2014

Master Bond, a manufacturer of epoxy adhesives, sealants, coatings, potting and encapsulation compounds, has released Master Bond Super Gel 9AO, a soft, urethane modified gel-like epoxy with thermal conductivity and electrical insulation properties that adheres…read more

Air-Inlet Grill Reduces Axial and Centrifugal Fan Noise

January 10th, 2014

Fan and blower manufacturer ebm-papst has released FlowGrid, a patent-pending air-inlet grill designed to reduce noise levels for fans installed within limited-space air-moving equipment. “FlowGrid is the result of our extensive airflow testing for inlet…read more

Electrical Field Facilitates Better Heat Transfer

January 9th, 2014

The application of an electric field to a condenser could double the efficiency of surface heat transfer in power plant and high performance computing cooling systems, according to new research released by scientists at MIT.…read more

New Fan Delivers High Static Pressure and Energy Reduction

December 16th, 2013

Sanyo Denki Co., Ltd. has introduced the new San Ace 92 DC fan to its DC fan lineup. Measuring 92 × 92 × 38 mm, the new fan delivers the industry’s highest static pressure and…read more

Highly-Conformable Gap Filler Pad with Reinforced Mesh Center

December 9th, 2013

Fujipoly America Corporation has released its new Sarcon25GR-T2d thermal interface material, a soft, highly-conformable gap filler pad with a reinforced mesh center ideal for applications that require a thermal interface bridge across larger surface areas.…read more

Carbon Nanotubes Offer Thermal Stress Relief at Critical Juntions

December 9th, 2013

Scientists at Stanford University have released new findings that demonstrate the benefits of using carbon nanotube arrays at critical junctions between two materials to help better relieve thermal stress. Thermal stress, often caused by the…read more

Boron Nitride Filler for Thermally Conductive Dielectric Plastic Compounds

December 5th, 2013

Saint-Gobain Ceramic Materials has released its new CarboTherm boron nitride thermal management fillers for use in thermally conductive, dielectric plastic compounds. The new boron nitride fillers will be on display December 10-11 at the Compounding…read more