Industrial

New Coolers for Laser Diodes Released

March 29th, 2016

Recently Rogers Corporation’s Power Electronics Solutions (PES) group has released its new curamik CoolPerformance Plus coolers. Roger’s said that “curamik CoolPerformance Plus is an advanced liquid-cooled material designed to dissipate large amounts of heat and…read more

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Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

Higher Temperature Rated MLC Capacitors Announced

March 1st, 2016

Knowles brand, Dielectric Laboratories (DLI), has taken temperature performance to a level of 175°C in their Ultra-low ESR and High Q MLC capacitors. DLI detailed the following: “UL is an EIA Class I Stable TC,…read more

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Scientists Grow Efficient Light-Emitting Organic Semiconductor Crystals

February 19th, 2016

Recently, scientists from the faculty of physics of the Moscow State University have grown organic semiconductor crystals with extremely high light-emitting efficiency that can reduce the cost of creating light, flexible, and transparent light-emitting electronic…read more

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Nominations Open for IEEE ITherm Achievement Award

February 8th, 2016

The biennial ITherm Achievement Award is open for nominations for 2016. The Award is presented in recognition of significant contributions made in thermal and thermomechanical management of electronics, of pioneering and sustaining electronics thermal/thermomechanical research…read more

New Higher-Speed Interface for Thermographic Camera

January 25th, 2016

InfraTech has recently released its new 10 Gigabit Ethernet interface for their ImageIR® thermographic camera series. The 10 Gigabit Ethernet interface has “high-speed imaging allowing microsecond exposure times that freeze the apparent motion of dynamic events,”…read more

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New Graphene Based Filament Introduced

September 30th, 2015

Graphene 3D Lab, Inc., has created Black Magic 3D, a commercial graphene-based conductive polymer filament for use in 3D printing to manufacture electronics. “This graphene-enabled polymer filament is unique on the market in its ability…read more

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New Fan Offers Industry Leading Static Pressure

July 27th, 2015

Sanyo Denki introduces the San Ace 172 9HV type ø 172 x 150 x 51 mm high static pressure fan. The San Ace 172 9HV type offers industry leading static pressure, or 1.6 times the…read more

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New IGBT Series Reduces EMI and Power Dissipation

June 22nd, 2015

Alpha and Omega Semiconductor Limited (AOS) has expanded its Insulated-Gate Bipolar Transistor (IGBT) product portfolio with the addition of a new 650V M-series. “The new M-series is co-packaged with a soft and fast freewheeling diode…read more

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Splash Proof Fan Offers Long Lifespan

June 22nd, 2015

Sanyo Denki introduces its new IP68 splash proof fan with high airflow and a long lifespan. The water and dust resistant fan’s measurements are 40 x 40 x 28 mm. It is ideal for use…read more

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Company Asked to Participate in Three-Year Project

September 22nd, 2014

Element Six has recently been asked by the European Commission’s Seventh Framework Programme to assist in a three year project to develop high power laser on a 3.1 million dollar budget. “The new laser will…read more

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Partnership Leads to Success in Development of New Converter

September 19th, 2014

Calyos, a new company that specializes in 2-phase cooling solutions of electronics, has partnered with Alstom Transport to develop a railway converter named the CIPLIX Traction Coffer.  From September 23-26, Calyos will be in Berlin…read more

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One-Component TIMs Suit Aerospace, Automotive and Semiconductor Industries

August 7th, 2014

Techsil now offers two new one-component thermal interface materials suitable for heat management in a variety of industries, including aerospace, automotive, medical, semiconductor and power. TIM11021 is a one-part grey paste silicone non-curing compound that…read more

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High-Pressure Torsion Method Could Yield More Efficient Thermoelectric Devices

July 14th, 2014

Scientists at Kyushu University in Japan have developed a novel way of reducing the thermoconductivity of crystalline silicon using high-pressure torsion that could result in a more efficient thermoelectric device. Thermoelectric energy devices, which rely…read more

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