IT Products

Researchers Pinpoint Heat Movement in Nanostructures

March 25th, 2014

Researchers at Cornell University have developed a new method of precisely measuring the subtle movement of heat in nanostructures. Heat flows at the nanoscale differently than at larger scales, the researchers say, and understanding how…read more

Heat Exchangers Cool Electrical and Electronic Enclosures

March 21st, 2014

EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released its HE series heat exchangers for cooling electrical and electronic enclosures. Ideal for cooling medical devices, food/beverage process controls, telecom…read more

Ultra-Thin Titanium Based Thermal Solution for Electronic Applications

February 28th, 2014

Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design…read more

Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization

February 28th, 2014

Anurag Gupta, David H. Altman, Daniel P. Resler Raytheon Integrated Defense Systems Introduction Electrical resistors are often used to simulate heat-dissipating electronic devices in thermal characterization of semiconductor devices. This article describes a study in…read more

Use of JEDEC Thermal Metrics in Calculating Chip Temperatures in Packages with Attached Heat Sinks

February 27th, 2014

Bruce Guenin Associate Technical Editor, Electronics Cooling   INTRODUCTION The previous column, “Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)” dealt with the application of JEDEC thermal metrics to IC…read more

Cooling Fans for 1U Rack Applications

February 24th, 2014

Thermal management product designer US Tech has released three new high performance fan series for use in 1U rack applications. The 36mm model produces 24.16 CFM of air volume and 67.52 mm-H2O pressure. In addition,…read more

Heat Sink Series Provides Modular Cooling Options for Electrical Components

February 20th, 2014

Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection.…read more

Cooling Fans and Accessories Protect Critical Components

February 10th, 2014

NTE Electronics has released a new line of cooling fans and accessories to protect critical electronic components from premature failure due to heat. Available in five different sizes—40x40mm, 60x60mm, 80x80mm, 92x92mm and 120x120mm—the new AC…read more

Fansinks for High Temperature Applications

February 6th, 2014

CTS Corporation has announced the release of new fansinks for high temperature applications. Designed to absorb and disperse heat away from high temperature devices, the FHS series features an operating temperature range of -10°C to…read more

Mini Thermoelectric Modules Incorporate Thermally Conductive Circuit Boards

February 5th, 2014

Laird Technologies has announced a new series of miniature thermoelectric modules for applications where temperature stabilization of sensitive optical components in photonics, telecom, medical and consumer markets is critical. Built using Laird Tlam thermally conductive…read more

Heating Up Nanodevices May Keep Electronics Cool

January 28th, 2014

As electronic devices have grown smaller and more powerful, new thermal management methods have been created to help prevent them from overheating; however, researchers and engineers are in a constant race to come up with…read more

Air-Inlet Grill Reduces Axial and Centrifugal Fan Noise

January 10th, 2014

Fan and blower manufacturer ebm-papst has released FlowGrid, a patent-pending air-inlet grill designed to reduce noise levels for fans installed within limited-space air-moving equipment. “FlowGrid is the result of our extensive airflow testing for inlet…read more

Thermal Management of Many-Core Processors Using Power Multiplexing

December 19th, 2013

Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor…read more

Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)

December 19th, 2013

Bruce Guenin Assoc. Technical Editor, Electronics Cooling INTRODUCTION JEDEC single-chip package thermal metrics are widely used as a means of characterizing the thermal performance of semiconductor packages. They correlate the peak temperature of a uniformly-heated…read more