Laird Technologies, Inc.’s purchase of Klüver Aggregatebau GmbH expands the scope of Laird’s thermal management business into compressor-based temperature control systems for use in medical, telecommunications, and other end-use markets. Learn more from Laird Technologies.
ElectronicsCooling Spring 2010 Print Issue
April 30th, 2010
Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in…read more
The Better Box Model
August 1st, 2009
Introduction For the consumer, natural convection cooling or fan-less cooling is the method of choice. It is silent, it is reliable, it is simple, and it is environmentally sound because no additional energy is used…read more
Lowering a Notebook CPU Temperature Using a Dual-Tunnel Blower
August 1st, 2009
Figure 1. Side by side comparison of blower technologies. Introduction Notebook computers on the market today may be classified in three categories. In the first category are the super slim and powerful notebooks such as…read more
Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods
May 9th, 2009
Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field…read more
LED Thermal Standardization: A Hot Topic
May 9th, 2009
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more
Numerical Simulation of Complex Submicron Devices
May 1st, 2009
Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to…read more
Estimating Temperatures in an Air-cooled Closed Box Electronics Enclosure
February 1st, 2005
Introduction In the majority of air-cooling applications, openings or vents are provided in the enclosure or box in which the electronic components are housed. The required cooling air is drawn in from outside the box…read more
Hot Spots in Data Centers
August 1st, 2003
Heat loads of data processing equipment continue to increase at a rapid rate. This increasing heat load has been documented by a Thermal Management Consortium of 17 companies [1] as shown in Figure 1. Also…read more
Cooling of a Flat TV Monitor
May 1st, 2003
Thermal design in the consumer electronics business is about dealing with two difficult challenges: The first is to fulfill, and if possible surpass, customer expectations. The second is to do this in ever shortening design…read more
Power Density Challenges Of Next Generation Telecommunication Networks
February 1st, 2003
Despite the current downturn in the telecommunications industry, data transfer (i.e. network traffic) is continuing to grow at a 100% rate [1]. It is already projected that network traffic demand will reach tens of Tb/s…read more
Numerical Modeling and Experimental Verification of High-density Servers
November 1st, 2002
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a…read more
The Challenge of Operating Computers at Ultra-low Temperatures
August 1st, 2001
Although the potential for low temperature enhancement of CMOS circuit performance has been recognized for some time, circuit scaling (proportionally reducing the size of the circuit) has been the preferred method of achieving higher performance.…read more
Thermal challenges in the telecom and networks industry
May 1st, 2000
Figure 1: Telecom Equipment Operating EnvironmentsThere are two main reasons for doing thermal design in the telecommunication industry. The first is to ensure functionality of the equipment and system when subjected to extreme environments. The…read more
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