IT Products

Book Review of Electronics Cooling (2016)

September 6th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving…read more

Wide Array of Flow Switches Available

August 29th, 2016

Sika offers a wide array of flow instruments, including flow switches. Flow switch options include the VK300 Flow Switch, Trimmable Paddle for Insertion, the VK300 Flow Switch for Copper Pipes, a Flow Switch for Pool…read more

Free Component Libraries Launched

July 26th, 2016

Würth Elektronik eiSos, a manufacturer of electronic and electromagnetical components, is now providing free component libraries of its passive components for Zuken’s CADSTAR design software. The libraries allow users to simply download the correct components…read more

Posted in Computer, Consumer, IT Products, New Products, Semiconductor, Software/Modeling | Comments Off on Free Component Libraries Launched

Graphene Nanoflakes Better Dissipates Electronics’ Heat

May 2nd, 2016

(April 29, 2016) Recently, a team of researchers from Chalmers University of Technology in Sweden have developed a more efficient approach to cooling electronics using graphene nanoflake-based film. According to E&T, the team performed “experiments…read more

Posted in Aerospace, Automotive, Computer, Data Centers, Defense, Heat Exchanger, Industrial, IT Products, Materials, Compounds, Adhesives, Substrates, Medical, News, Research, Test & Measurement, TIMs | Comments Off on Graphene Nanoflakes Better Dissipates Electronics’ Heat

New TIMs That Offer High Thermal Conductivity

March 21st, 2016

Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications,…read more

Posted in Automotive, Communications, Enclosures, Heat Sinks, IT Products, Materials, Compounds, Adhesives, Substrates, New Products, TIMs | Comments Off on New TIMs That Offer High Thermal Conductivity

New Refrigerant-Based Rack and Row Cooling Solution for IT Equipment

March 21st, 2016

Rittal Corporation has recently introduced a new refrigerant-based rack and row cooling solution, LCP DX, for heat removal of critical IT components. The Rittal Rack LCP DX “puts the cooling only where needed to protect…read more

Posted in Blowers / Fans / Filters, Coolers, Data Centers, Heat Exchanger, IT Products, New Products, Refrigeration | Comments Off on New Refrigerant-Based Rack and Row Cooling Solution for IT Equipment

Three-Phase Thermoelectric Air Conditioners for Enclosure Cooling

June 9th, 2014

Thermolectric cooling supplier TECA has announced new three-phase thermoelectric air conditioners. Offering high performance and efficiency, the new maintenance-free air conditioners do not require filters, coolant or chemicals of any kind. Each has a built-in…read more

Posted in Computer, Data Centers, Enclosures, Industrial, IT Products, TECs | Comments Off on Three-Phase Thermoelectric Air Conditioners for Enclosure Cooling

Thermally Conductive Epoxy for Aerospace, Electronics and OEM Industries

May 21st, 2014

Master Bond has introduced EP46HT-1AO, a two-component, thermally conductive epoxy formulated for bonding and sealing applications in the aerospace, electronic and specialty OEM industries. EP46HT-1AO combines thermal conductivity and electrical insulation properties. This dimensionally stable…read more

Posted in Aerospace, Computer, Design, IT Products, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on Thermally Conductive Epoxy for Aerospace, Electronics and OEM Industries

Researchers Pinpoint Heat Movement in Nanostructures

March 25th, 2014

Researchers at Cornell University have developed a new method of precisely measuring the subtle movement of heat in nanostructures. Heat flows at the nanoscale differently than at larger scales, the researchers say, and understanding how…read more

Posted in IT Products, Materials, Compounds, Adhesives, Substrates, News, Research, Test & Measurement | Comments Off on Researchers Pinpoint Heat Movement in Nanostructures

Heat Exchangers Cool Electrical and Electronic Enclosures

March 21st, 2014

EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released its HE series heat exchangers for cooling electrical and electronic enclosures. Ideal for cooling medical devices, food/beverage process controls, telecom…read more

Posted in Communications, Enclosures, Industrial, IT Products, Medical, New Products | Comments Off on Heat Exchangers Cool Electrical and Electronic Enclosures

Ultra-Thin Titanium Based Thermal Solution for Electronic Applications

February 28th, 2014

Payam Bozorgi and George Fleischman PiMEMS, Inc. Introduction As electronic system technology advances with continual increases in requirements leading to greater demand for higher power consumption, there have been growing challenges related to the design…read more

Posted in Computer, Design, Design, Heat Pipes, IT Products, Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | Comments Off on Ultra-Thin Titanium Based Thermal Solution for Electronic Applications

Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization

February 28th, 2014

Anurag Gupta, David H. Altman, Daniel P. Resler Raytheon Integrated Defense Systems Introduction Electrical resistors are often used to simulate heat-dissipating electronic devices in thermal characterization of semiconductor devices. This article describes a study in…read more

Posted in Computer, Design, Design, IT Products, Software/Modeling, Test & Measurement | Comments Off on Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization

Use of JEDEC Thermal Metrics in Calculating Chip Temperatures in Packages with Attached Heat Sinks

February 27th, 2014

Bruce Guenin Associate Technical Editor, Electronics Cooling   INTRODUCTION The previous column, “Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)” dealt with the application of JEDEC thermal metrics to IC…read more

Posted in Heat Sinks, IT Products | Comments Off on Use of JEDEC Thermal Metrics in Calculating Chip Temperatures in Packages with Attached Heat Sinks

Cooling Fans for 1U Rack Applications

February 24th, 2014

Thermal management product designer US Tech has released three new high performance fan series for use in 1U rack applications. The 36mm model produces 24.16 CFM of air volume and 67.52 mm-H2O pressure. In addition,…read more

Posted in Blowers / Fans / Filters, Data Centers, IT Products, New Products | Comments Off on Cooling Fans for 1U Rack Applications