Medical

Heat Exchangers Cool Electrical and Electronic Enclosures

March 21st, 2014

EIC Solutions, a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released its HE series heat exchangers for cooling electrical and electronic enclosures. Ideal for cooling medical devices, food/beverage process controls, telecom…read more

Connectors for Liquid Cooling Applications

November 21st, 2013

Colder Products Company, a provider of quick disconnect couplings and fittings for plastic tubing, has released the new LQ6 series connectors. Designed specifically for liquid cooling applications requiring multiple connect and disconnect cycles, these specialized…read more

New Cooling Technology Offers Helium Alternative

September 20th, 2013

A new way to cool magnets to the extremely low temperatures needed for MRI machines may hold the answer to overcoming the effects of the increasing global helium shortage. Well-known for its use in party…read more

Laser Cooling Method is “One Step Closer” to Smaller Medical Devices, “Self-Cooling” Computer Chips

February 5th, 2013

Scientists from Nanyang Technological University (NTU) in Singapore have developed a new laser cooling method that could replace extreme refrigerant-based cooling systems in medical devices and satellite cameras and help develop futuristic computer chips capable…read more

Wind Tunnel-Cooled Computer May Help Cure Cancer

January 4th, 2013

Blogger Mike Schropp of “Total Geekdom” recently revealed the construction of his new wind tunnel-cooled computer. Designed for grid computing, Schropp’s new computer is part of the IBM’s World Community Grid, which combines a worldwide…read more

High Power, High Efficiency Cooling Fans and Impellers

August 6th, 2012

NMB Technologies Corporation released a new line of high power, high efficiency cooling fans and impellers for applications such as storage and server rack systems, routers and switches, base stations, modular data systems, and in…read more

New Revolution of SOB Fans with High Fluid Static Pressure and Air Flow

July 12th, 2012

Cooltron offers a variety of specialty fans for some specific applications in varied markets. Its patented Stator Outlet Blade technology helps reduce turbulence caused by fan blades, thereby streamlining the fluid flow and direction. This…read more

Thin Cavity Fluidic Heat Exchanger

July 5th, 2012

Third Millennium Engineering has released a Thin Cavity Fluidic Heat Exchanger, a small volume, high performance method for cooling critical electronic devices at the chip, board, module, and system levels. Its high thermal performance originates…read more

Thermal Interface Materials Improve Heat Management

March 19th, 2012

Intermark offers thermal interface materials (silicone based, silicone free, EMC and Thermal management dual function types), heat spreader sheets, thin thermal tape, and other solutions to improve the heat management of any application including LED Lighting, laptops,…read more

Compact Linear Laser Diode Driver Supports Fiber-Coupled Lasers

June 13th, 2011

Wavelength Electronics’ PLD-CH Series is now available in a 12.5 A model. This new driver supports fiber-coupled lasers used in applications such as medical, dental, micro-machining, material processing, semiconductor inspection, and imaging. The PLD-CH Series…read more

Data Centers Play Key Role in Transferring Medical Information

June 21st, 2010

The issue of building new data centers and retrofitting or expansion of older ones to handle more sophisticated and increased amounts of medical data has become more critical as the Obama administration has announced that $975…read more

Health Assessment and Prognostics of Electronic Products: An Alternative to Traditional Reliability Prediction Methods

May 9th, 2009

Introduction Traditional handbook-based reliability prediction methods for electronic products include Mil-Hdbk-217, Telcordia SR-332 (formerly Bellcore), PRISM, FIDES, CNET/RDF (European), and the Chinese GJB-299. These methods rely on analysis of failure data collected from the field…read more

LED Thermal Standardization: A Hot Topic

May 9th, 2009

Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more

Numerical Simulation of Complex Submicron Devices

May 1st, 2009

Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to…read more