Ever since the advent of the automotive alternator, or claw-pole alternating current generator, in the 1960′s, there has been an ever-increasing thermal design challenge to cool the power electronics in these machines. Figure 1 depicts…read more
Managing power requirements in the electronics industry
December 1st, 2000
Rapid growth in the use of Internet and telecommunication services has created unique yet critical demands on the power required to energize this network. Continuing market requirements for higher-speed access – coupled with expanding needs…read more
A system level cooling solution for cellular phone applications
May 1st, 2000
Improving thermal performance of electronic components is very challenging due to the increasing power density and decreasing module sizes. The design trade off between electrical and mechanical characteristics and the cost of manufacturing MCM products…read more
Computer-related thermal packaging at the millenial divide
January 1st, 2000
Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as…read more
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