An earlier article in this column considered the problem of cooling electronic components in a closed box [1]. In outdoor applications for example, it may be necessary to totally seal the box to prevent exposure…read more
Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat Rejection
May 17th, 2013
Temperature Controller for Thermoelectric Modules and Supplemental Resistive Heaters
May 17th, 2013
Oven Industries, a supplier of custom temperature controllers and sensors for a variety of industries, has released the new 5R7-001 PID bi-directional temperature controller for independent thermoelectric modules or for use in conjunction with auxiliary…read more
Programmable Digital Temperature Control for Electronic Enclosures
May 17th, 2013
EIC Solutions Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has released a digital temperature control (DTC) for fine-tuned temperature control inside air-conditioned electronic enclosures. “[While] our standard bimetallic thermostat meets…read more
Thermal Facts and Fairy Tales: A System Perspective for Electronics Cooling
May 16th, 2013
A friend of mine who was an aspiring plumber once stated that all you need to know to be a plumber is that you get paid on Friday and that waste flows downhill. Maybe there…read more
Nanoscale Heat Transfer Research Awarded Air Force Grant
April 22nd, 2013
An Arizona State University engineer has been awarded a grant from the U.S. Air Force Office of Scientific Research for nanoscale heat transfer research that could help improve thermoelectric devices and thermal barrier coatings. An…read more
Thermoelectric Air Conditioner for Use in Mobile Military and Defense Applications
April 5th, 2013
Thermoelectric air conditioner manufacturer EIC Solutions, Inc. has released the ThermoTEC 145 series 1500 BTU military-grade air conditioner for use in transit cases for mobile military and defense applications. According to Jamie Alletag, EIC Solutions…read more
Refrigerator Super-Cools Advanced Sensors Using Quantum Physics
March 25th, 2013
A tiny solid-state refrigerator that employs quantum physics in micro- and nanostructures to cool larger objects to extremely low temperatures has been demonstrated by researchers at the National Institute of Standards and Technology (NIST). According…read more
Advanced Circuitry Option for Thermoelectric Cooling Unit Enables Maximum Cooling Output “Regardless of Available Power Supply or Integrity of Voltage Flow”
March 8th, 2013
EIC Solutions, Inc., a manufacturer of thermoelectric air conditioners, electronic enclosures and transit cases, has announced the availability of an advanced circuitry engineering option for the company’s thermoelectric cooling units that enables “maximum cooling output…read more
Laird Technologies Acquires Thermoelectric Technology Developer Nextreme Thermal Solutions
February 22nd, 2013
Laird Technologies, a developer of components and solutions for electromagnetic interference protection and thermal protection of electronics, has announced the acquisition of U.S.-based manufacturer of thin-film thermoelectric technologies Nextreme Thermal Solutions. Though Nextreme and Laird…read more
Researchers Enhance Thermoelectric Device Efficiency with Embedded Nanoparticles
February 7th, 2013
Researchers at the Massachusetts Institute of Technology (MIT) and Rutgers University have developed a new method of enhancing the efficiency of thermoelectric devices using embedded nanoparticles, structures created by embedding one material into another. The…read more
3200 BTU Thermoelectric Air Conditioner
August 6th, 2012
EIC Solutions has introduced a 3,200 BTU thermoelectric air conditioner. The new air conditioner employs 50 percent more thermoelectric chips (TECs) with a minimal change in the overall dimensions of the unit. The footprint is…read more
Research Program Attempts Embedded Cooling
June 11th, 2012
DARPA’s Intrachip/Interchip Enhanced Cooling (ICECool) program seeks to explore embedded thermal management by bringing microfluidic cooling inside the substrate, chip or package by including thermal management in the earliest stages of electronics design. This embedded…read more
New Panel Coolers Decrease Noise Level
June 11th, 2012
Nex Flow™ Air Products introduces a simple and inexpensive solution to heat related problems in Industrial Control Enclosures while addressing the increasing concern about noise levels in the work environment. Silent X-Stream ™ Frigid –X™…read more
Thin-film TEC Improves Cooling Performance
June 11th, 2012
Nextreme Thermal Solutions announced the availability of new thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature of 25°C. This new level of performance translates to improved cooling efficiency, lower…read more
Recent Posts
- Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat Rejection
- Quiet CPU Coolers for Intel Xeon Workstations and Servers
- Temperature Controller for Thermoelectric Modules and Supplemental Resistive Heaters
- Fans for Low-Noise, Low-Airflow Applications
- Programmable Digital Temperature Control for Electronic Enclosures
- U.S. Patent for Two-Stage Enclosure Coolers Awarded
- Company Acquires Thermal and Vacuum Product Manufacturer
- Thermal Spreading and More Using Open-Source FEA Software
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