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High Performance Thermal Imaging Camera Meets R&D Requirements

August 26th, 2014

FLIR Systems has introduced the FLIR A65sc, a new high performance thermal imaging camera designed for research and design applications. Capable of visualizing temperatures from -40°C to +550°C with temperature differences as small as 50mK,…read more

Webinar on, “Thermal RC Modeling Using a Spreadsheet”

August 26th, 2014

Overview: In this webinar, we will take a look at thermal analysis and modeling using nothing more than your every-day spreadsheet program. In particular, we will focus on Foster-ladder thermal RC models, including how to…read more

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Webinar on, “Traditional Thermal Materials and Applications”

August 26th, 2014

Overview: Thermal management, which includes heat dissipation and thermal stresses, is a key problem in most electronic and photonic applications. Materials play a key role in meeting thermal requirements. In the previous three presentations in…read more

Webinar on, “Linear Superposition: Tutorial on Thermal-RC Networks”

August 26th, 2014

Overview This 45-minute seminar will show how some basic concepts of transient analysis of linear thermal systems can be applied to a real-world thermal system design. The mathematical concepts utilized will be presented as principles,…read more

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Metal Organic Frameworks Applied in Layers Could Signal Cooling Revolution

June 26th, 2014

Researchers at Germany’s Fraunhofer Institute of Solar Energy Systems have developed highly-porous metal organic frameworks (MOFs) that can be applied in a thin layer to efficiently absorb large quantities of water vapor. MOFs, as determined…read more

Thermal Facts and Fairy Tales: Historical Suggestions for Thermal Management of Electronics

May 29th, 2014

Jim Wilson, Engineering Fellow Raytheon Company I have a small book in my office labeled “Suggestions for Designers of Navy Electronic Equipment, 1970 Edition” that was given to me several years ago by the editor…read more

Posted in Defense, Design, Number 2, Volume 20 | Comments Off

Challenges in Measuring Theta jc for High Thermal Performance Packages

May 29th, 2014

Jesse Galloway and Ted Okpe Amkor Technology One of the more challenging thermal resistance measurements to make for electronic packages is the junction-to-case resistance called Theta jc. The equation for Theta jc, equation (1), is…read more

Posted in Design, Number 2, Test & Measurement, Volume 20 | Comments Off

Estimating the Thermal Interaction between Multiple Side-by-Side Chips on a Multi-Chip Package

May 29th, 2014

Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other…read more

Scientists Achieve First Measurement of Moly’s Thermal Conductivity

May 27th, 2014

Scientists at the National Institute of Standards and Technology’s Physical Measurement Laboratory have succeeded in measuring the thermal conductivity for the first time of an ultra-thin material that is expected to play a major role…read more

Thermally Conductive Epoxy for Aerospace, Electronics and OEM Industries

May 21st, 2014

Master Bond has introduced EP46HT-1AO, a two-component, thermally conductive epoxy formulated for bonding and sealing applications in the aerospace, electronic and specialty OEM industries. EP46HT-1AO combines thermal conductivity and electrical insulation properties. This dimensionally stable…read more

Power Cycle and Thermal Testing of Electronic Components

May 12th, 2014

Mentor Graphics Corporation has released the new MicReD Industrial Power Tester 1,500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance. The MicReD Industrial Power Tester 1500A is ideal…read more

Self-Ventilating Heat Exchanger Cools Sealed Compartments without Contamination

May 9th, 2014

AMETEK Rotron has introduced the new Discus self-ventilating heat exchanger designed to cool sealed airborne or ground-based electronic and optical compartments without introducing contaminated external air. Ideal for pod-mounted airborne optical systems, the Discus can…read more

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Technical Guide Offers In-Depth Product Dispensing Information

May 5th, 2014

Chomerics, a division of Parker-Hannifin Corporation, has released a new thermal interface material dispensing guide. The 16-page guide contains product and in-depth technical information on the company’s range of THERM-A-GAP gels, THERM-A-FORM cure-in-place compounds and…read more

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Heat Pipe Assembly for Spacecraft and Hypersonic Vehicles Passes NASA Hypersonic Tests

May 2nd, 2014

Advanced thermal solutions provider Thermacore has announced that its heat pipe assembly recently completed testing at the NASA Ames Arc Jet Complex operating at very high temperatures in a hypersonic leading edge simulation, making it…read more

Posted in Aerospace, Defense, Heat Pipes | Comments Off