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Add-on to Existing Product Enhances Thermal Simulation

November 24th, 2014

Harley Thermal LLC has announced its new SolariaPCB, an add-on to Solaria, the company’s thermal simulation software tool.  The SolariaPCB allows quick and easy thermal simulation of printed circuit boards. “The SolariaPCB add-on to Solaria…read more

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Company Introduces Low Outgassing Epoxy

November 24th, 2014

The Master Bond EP17HT-LO has just been introduced by Master Bond Inc. This product is a low outgassing “one part epoxy for bonding, sealing, coating and encapsulation applications.” This epoxy is capable of operating in…read more

New Technology Reduces Thermal Testing Time by 90 Percent

November 10th, 2014

The Industrial Technology Research Institute in Taiwan announces its new In-Line Compact Thermal Analyzer Technology, the ICTA. The ICTA improves LED thermal testing time by more than 90 percent by reducing the testing time to…read more

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Lab Safety Improved with Quick Disconnect Couplings on Caps

November 10th, 2014

Colder Products Company introduces its BQ45GL series – 45mm caps with integrated quick disconnect couplings, which is a first in the market. “Adding quick disconnects to media bottles enhances the user experience when using laboratory…read more

Fast Curing Epoxy Introduced

November 10th, 2014

Master Bond Inc. announces its new Master Bond Supreme 3HTND-2DA, which is a high performance, one component epoxy for die attach applications. At 150 degrees Celsius the epoxy can cure in only five to ten…read more

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New Thermoelectric Air Conditioner Introduced

November 10th, 2014

TECA introduces a new and improved Thermoelectric Air Conditioner, known as the AHP-690.  The AHP-690 is powerful, compact, and offers a 55 percent greater performance in cooling than other products in the industry. Because TECA’s…read more

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Gasoline and Diesel Fueled Vehicles and Instruments See Increased Fuel Efficiency in Near Future

October 27th, 2014

A new thermoelectric material to increase fuel efficiency has been introduced by GMZ Energy. The material is called Hafnium-free p-type half-Heusler and costs less to produce than previous materials. This material also has an improved…read more

New Software Decreases Solution Time

October 27th, 2014

Daat Research Corp. has cut solution time for transient problems by more than ten times with its new v.14 CFD software. This new software now allows engineers to use larger steps when solving transients and…read more

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New Thermoelectric Module Doubles Previous Power Output

October 27th, 2014

GMZ Energy introduces its new thermoelectric module, the TG16-1.0, which produces twice the amount of power its previous model, the TG8, produced. The greater power output yields stronger performance while preserving a small footprint. The…read more

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New HyperFlash Introduced

October 9th, 2014

Netzsch has just announced its new Light Flash Apparatus – the LFA 467 HyperFlash. “The Flash method is a fast, non-contact, and efficient method for measuring the three fundamental thermophysical properties of thermal diffusivity, specific…read more

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New EP21AOLV-2Med Epoxy Proves Successful and Desirable

September 22nd, 2014

Masterbond Inc. has just introduced its New Epoxy named EP21AOLV-2Med which has passed all USP Class VI Tests and ISO 10993-5 Specifications. “EP21AOLV-2Med is thermally conductive and electrically isolating with a smooth consistency and good…read more

New Development of Silicon Carbide Substrates Raises the Bar

September 22nd, 2014

Dow Corning, an industry leader in silicon materials, has just introduced it now offers “150 mm diameter silicon carbide (SiC) wafers under its ground-breaking Prime Grade portfolio. Recently launched to set new standards for 100…read more

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Company Announces New SPG-20B

September 22nd, 2014

Fujipoly America Corporation has just announced its silicon product SARCON® SPG-20B – a new version of their previous product, SARCON® SPG-15A. Benefits of the new product include a 40 percent greater thermal conductivity level and…read more

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New Series of Bonding Wax Created to Shrink Wafers in Electronic Devices

September 22nd, 2014

AI Technology, Inc. has just announced its new temporary bonding wax – which was developed with intentions to shrink the thickness of wafers and dies in electronic devices such as cell phones, tablets, cameras, etc.…read more