More

New “Form-In-Place” Product with Process Demonstration Video

April 22nd, 2016

JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech…read more

Posted in Computer, Design, Design, Materials, Compounds, Adhesives, Substrates, New Products, Thermal Imaging | Comments Off on New “Form-In-Place” Product with Process Demonstration Video

New System Improves Lead Times

April 18th, 2016

A manufacturer of thermoelectric air conditioners, TECA Corporation, has recently implemented a new program to improve lead times. President of TECA, Mike Mikalauskis, said, “We were able to pair new software with a more streamlined…read more

Posted in Computer, Consumer, Enclosures, New Products, Software/Modeling | Comments Off on New System Improves Lead Times

Calculation Corner: Estimating Parallel Plate-fin Heat Sink Pressure Drop

April 14th, 2016

Editor’s note: In recognition of the 20th year of ElectronicsCooling, we are republishing articles from past issues that we believe to be of particular value to our readership.  The following article was published in the…read more

Posted in Articles, Calculation Corner | Comments Off on Calculation Corner: Estimating Parallel Plate-fin Heat Sink Pressure Drop

Cooling Matters

April 14th, 2016

The World’s First Liquid-Cooled Gaming Laptop The Asus ROG GX700 has been introduced as the world’s first liquid-cooled gaming laptop. Asus ROG Global Marketing Director Derek Yu created the inch-thick laptop with a Nvidia GTX…read more

Posted in Articles | Comments Off on Cooling Matters

Electronics Cooling with Autodesk CFD

February 9th, 2016

  Electronics Cooling with Autodesk CFD WEBINAR See the invisible. Maximize product performance.   To view the recording of this webinar, click here.   Who should attend:  Analysts, Engineers, those involved in industries including electronics…read more

Posted in Design, Design | Comments Off on Electronics Cooling with Autodesk CFD

New Hybrid Adhesives Use UV Cure and Heat Cure Combination

January 8th, 2016

Epoxy Technology Inc. has released a new line of UV Hybrid adhesives. The company says these adhesives allow “engineers to reach new levels of production/process improvement” and afford “greater design flexibility.” They use “a primary…read more

Posted in Design, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on New Hybrid Adhesives Use UV Cure and Heat Cure Combination

Thermal Facts and Fairy Tales – Electronics Cooling Communication for dumMEs and dumEEs

December 1st, 2015

Bringing Together Mechanical and Electrical Engineers By Jim Wilson Electronics cooling design and analysis problems inherently bring together engineers from different backgrounds, especially mechanical and electrical engineers.  Engineers with a heat transfer or fluid mechanics…read more

Posted in Number 4, Volume 21 | Comments Off on Thermal Facts and Fairy Tales – Electronics Cooling Communication for dumMEs and dumEEs

Tech Brief – Low Electrical Conductivity Liquid Coolants for Electronics Cooling

December 1st, 2015

By Bojanna Shantheyanda, Sreya Dutta, Kevin Coscia and David Schiemer Dynalene, Inc. 1.0 Introduction Liquid cooling, which can be achieved using indirect or direct means, is utilized in electronics applications having thermal power densities that…read more

Posted in Design, Number 4, Volume 21 | Comments Off on Tech Brief – Low Electrical Conductivity Liquid Coolants for Electronics Cooling

Enhanced Pool Boiling using Separate Liquid-Vapor Pathways for Cooling High Heat Flux Electronics Devices

December 1st, 2015

By Satish G. Kandlikar1,2 and Arvind Jaikumar2 1Mechanical Engineering Department, Rochester Institute of Technology, 76 Lomb Memorial Dr., Rochester, NY 14623, USA; 2Microsystems Engineering Department, Rochester Institute of Technology, 168 Lomb Memorial Dr., Rochester, NY 14623, USA The…read more

Posted in Design, Number 4, Volume 21 | Comments Off on Enhanced Pool Boiling using Separate Liquid-Vapor Pathways for Cooling High Heat Flux Electronics Devices

Calculation Corner: Estimating Parallel Plate-fin Heat Sink Thermal Resistance

December 1st, 2015

By Robert E. Simons, IBM Corporation Editor’s note: In recognition of the 20th year of ElectronicsCooling, we are republishing articles from past issues that we believe to be of particular value to our readership.  The following article was published in the February…read more

Posted in Design, Number 4, Volume 21 | Comments Off on Calculation Corner: Estimating Parallel Plate-fin Heat Sink Thermal Resistance

Saving Energy with Every Byte: An Concerted Effort for Efficient Thermal Management of Data Centers

November 30th, 2015

By Yogesh Fulpagare and Atul Bhargav Energy Systems Research Laboratory, Indian Institute of Technology Gandhinagar, India With the advancement of technology, the access to information has become rapid as well as ubiquitous.  These mammoth resources…read more

Posted in Design, Number 4, Volume 21 | Comments Off on Saving Energy with Every Byte: An Concerted Effort for Efficient Thermal Management of Data Centers

A Figure of Merit for Smart Phone Thermal Management

November 30th, 2015

By Victor Chiriac1, Steve Molloy1, Jon Anderson1, Ken Goodson2 1 Qualcomm Technologies, Inc., 2 Stanford Mechanical Engineering Introduction With smart phones and other mobile devices available in a variety of sizes and shapes, it is…read more

Posted in Design, Number 4 | Comments Off on A Figure of Merit for Smart Phone Thermal Management

Extreme-Temperature Probing Solutions Offered

November 25th, 2015

Keysight Technologies recently introduced the N7007A extreme-temperature 400-MHz passive probe and the N7013A extreme-temperature extension kit for medium- and high-voltage differential active probes. According to the company, the extreme-temperature probing solutions offer bandwidths up to…read more

Posted in Automotive, New Products | Comments Off on Extreme-Temperature Probing Solutions Offered

High Temperature Resistant, Thermal Conductive System Meets ASTM E595 Specifications

November 23rd, 2015

Master Bond’s MasterSil 972TC-LO, a high temperature resistant, thermally conductive system, now meets the requirements for low outgassing per ASTM E595 specifications. “MasterSil 972TC-LO is an insulator that has a thermal conductivity of 7-9 BTU•in/ft²•hr•°F…read more

Posted in Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on High Temperature Resistant, Thermal Conductive System Meets ASTM E595 Specifications