The purpose of the present article is to suggest that accurate solution of thermal spreading problems for multilayer, edge-truncated geometry is easily accomplished using free, open-source finite element software. This should be especially attractive…read more
Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers
May 16th, 2013
Server manufacturers and data center managers are showing a greater concern regarding the energy efficiency and cooling of the new generation of servers for data centers. With very large data centers exceeding 100 000 servers,…read more
Thermal Facts and Fairy Tales: A System Perspective for Electronics Cooling
May 16th, 2013
A friend of mine who was an aspiring plumber once stated that all you need to know to be a plumber is that you get paid on Friday and that waste flows downhill. Maybe there…read more
Electronic Performance Impact of Elevated Humidity Environments — Implications for Free Air Cooling of Data Centers
May 16th, 2013
Introduction The computer industry is exploring various options for reducing the cost and energy consumption associated with cooling data centers. The use of liquid cooling in the data center has long been exploited as a…read more
Epoxy Meets UL94V-0 Specifications
May 15th, 2013
Master Bond released a new epoxy, EP21FRNS-2, which passed UL 94V-0 testing for “flame retardancy in potting, encapsulation and casting applications.” The EP21FRNS-2 is color-coded for simplicity, “features a non-halogen filler,” and “is a reliable…read more
Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets
May 15th, 2013
Two different package styles, two very different thermal responses when a extruded plate fin heatsink is placed on each. At the very least a FloTHERM simulation can be used to observe the thermal behaviour of…read more
New PWM Version of Fan Released
May 15th, 2013
Noctua has released a “performance-oriented” PWM version of the NF-A14 140 mm fan. Previously, only the NF-A15 round-frame model was available with PWM support for automatic speed control. The NF-A14 “complies with Noctua’s Advanced Acoustic…read more
Revisions for CPU Coolers for Intel Xeon
May 15th, 2013
Noctua, a maker of cooling components, has released revisions of its NH-U12DX and NH-U9DX for Intel Xeon workstations and servers. These new i4 models support LGA2011, LGA 1356 and LGA2011 and also come with “PWM…read more
High Powered Temperature Controller Released
May 15th, 2013
Oven Industries, suppliers of custom temperature controllers and sensors, has released a new high powered temperature controller that can be used on a heat sink, allowing for a “seamless transition between heating and cooling devices.”…read more
Ellsworth Adhesives Sales Representatives Awarded 2012 Gold and Bronze Sellers of the Year Awards
May 14th, 2013
Ellsworth Adhesives, a distributor of adhesives and specialty chemicals, has been recognized by Dow Corning Corporation for top performance in 2012. Ellsworth Adhesives’ Engineering Sales Representatives Ron Cormier (Northern California) and Sergio Ramirez (Mexico) have…read more
Parker Aerospace to Supply Thermal Management System for Joint Strike Missile
May 14th, 2013
The Parker Aerospace business segment of Parker Hannifin Corp., which specializes in single-phase liquid and two-phase liquid/vapor thermal management products and systems, has been awarded a contract to provide the thermal management system to Kongsberg…read more
New Patent-Pending Heat Sink Mounting System
May 13th, 2013
Penn Engineering has released the new patent-pending PEM heat sink mounting system for secure attachment of heat sinks to circuit boards. According to the company, the new heat sink mounting system consists of “Type HSCB…read more
PCIM Europe Presentation on Solder TIMs for Power Electronics Thermal Management
May 13th, 2013
Karthik Vijay, Indium Corporation’s technical manager for Europe, Africa and the Middle East, will present “Solder TIMs for Superior Thermal Management in Power Electronics” at PCIM Europe on Thursday, May 16 in Nuremberg, Germany. Vijay’s…read more
Embedded Heat Pipe Technology for Heat Removal in Military Applications
May 13th, 2013
Researchers at Advanced Cooling Technologies Inc. have developed a new cooling technique for high-power VPX embedded computing cards that utilizes embedded heat pipes to increase heat removal for computer boards. The new Dual-Sided Condenser technology…read more
Recent Posts
- Thermal Spreading and More Using Open-Source FEA Software
- Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers
- Thermal Facts and Fairy Tales: A System Perspective for Electronics Cooling
- Electronic Performance Impact of Elevated Humidity Environments — Implications for Free Air Cooling of Data Centers
- Epoxy Meets UL94V-0 Specifications
- Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets
- New PWM Version of Fan Released
- Revisions for CPU Coolers for Intel Xeon
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