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Small NEMA 12 Cabinet Coolers Resist Heat And Dirt

April 17th, 2014

EXAIR has introduced new small NEMA 12 cabinet cooling systems to keep electrical enclosures cool while resisting heat and dirty environments that could adversely affect the internal components. Featuring a cooling capacity of up to…read more

Thermal Material Provides Both Compressibility and Conformability with Phase-Change Ability

April 17th, 2014

AI Technology, Inc. has released COOL-PAD™ CPR7154, a thermal interface material that dispenses like a thermal pad but exhibits characteristics like that of a grease or gel when device temperatures increase to above 45°C. Ideal…read more

Diamond-Mineral Oil Mix May Be Best Heat Transfer Nanofluid, Say Researchers

April 17th, 2014

A mixture of diamond nanoparticles and mineral oil may be the most effective nanofluid for heat transfer applications, according to new research from Rice University. Thermal fluids are used in a variety of applications, from…read more

Free Sizing Software for Thermoelectric Air Conditioners

April 15th, 2014

TECA Corporation has released its newest sizing software to estimate thermoelectric air conditioner requirements. Available as a free download from TECA’s website, the new sizing software features an intuitive and user-friendly interface. With parameters defined…read more

Flexible Thermoelectric Generator Could Power Wearable Devices Using Body Heat

April 11th, 2014

Researchers have developed a new thermoelectric generator that could replace batteries as a more versatile power source. As interest grows in wearable electronics like Google Glass, smartwatches and fitness trackers, finding a suitable, long-lasting reliable…read more

Microchips Tolerate Extreme Temperatures in Industrial Applications

April 4th, 2014

German scientists have successfully fabricated compact microchips able to tolerate temperatures up to 300°C in an achievement that could have significant implications for the geothermal and oil production industries. Drill bits and borehole probes employed…read more

New Thermal Adhesive Boasts Twice the Conductivity at Half the Cost

April 4th, 2014

3M’s Electronics Markets Materials Division (EMMD) has released 3M 8904, a thermally conductive adhesive tape for thermal management and part bonding in electronic devices, as well as general heat dissipation. Containing thermally conductive particles as…read more

Polymer-Based Thermal Interface Material Cools Devices at 200°C

April 3rd, 2014

Scientists have developed a new polymer-based thermal interface material (TIM) capable of conducing heat 20 times better than conventional polymer. Reliable in temperatures of up to 200°C, the modified material can be fabricated on heat…read more

High Thermal Conductivity Thin Film

April 3rd, 2014

Fujipoly America has announced Sarcon 30-YR-a Thin Film, a new high performance thermal interface material. Measuring just 0.3mm thick, the Sarcon 30-YR-a thin film exhibits a thermal conductivity of 2.2 W/m°K with a thermal resistance…read more

Liquid Cold Plate Cools Power Electronics

March 27th, 2014

Thermal management company GCoreLab has introduced a new generation of cold plates for the cooling of power electronics. The new XtremeChill liquid cold plate utilizes GCoreLab’s patented oblique fin technology, which offers superior thermal cooling…read more

2014 Electronics Components Technology Conference (ECTC)

March 25th, 2014

May 27 – 30, 2014 Lake Buena Vista (Orlando), FL, USA The IEEE Electronics Components Technology conference (ECTC) is the premier electronics packaging conference. This year it features 5 invited sessions and 41 technical sessions…read more

Researchers Pinpoint Heat Movement in Nanostructures

March 25th, 2014

Researchers at Cornell University have developed a new method of precisely measuring the subtle movement of heat in nanostructures. Heat flows at the nanoscale differently than at larger scales, the researchers say, and understanding how…read more

ITherm 2014

March 21st, 2014

May 27 – 30, 2014 Lake Buena Vista (Orlando), FL, USA The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) is an international conference for scientific and engineering exploration of thermal,…read more

Liquid Cooling System to Cut Data Center Cooling Costs

March 21st, 2014

An associate professor of mechanical engineering at the University of Wisconsin-Madison has developed a liquid cooling system he says is safer than water cooling and could cut cooling costs of data centers by up to…read more