Mersen has named Roy Ball its VP Research & Development, USA/Mexico. Roy will be responsible for new product research and development and sustaining engineering. Roy holds a Masters Degree in Business and Manufacturing from the…read more
Bottlenecks and Interface Materials; Part 3 – Relieving Thermal Bottlenecks Reduce Temperatures
February 10th, 2012
As with all good inventions, you quickly wonder how on earth you could have done without them before. Relieving thermal bottlenecks reduce temperatures; it’s so blindingly obvious. Now that we have the ability to visualise…read more
Research Company Names Top Thermal Management Supplier
February 7th, 2012
Thermacore was identified by BCC Research as one of the leading global suppliers in the rapidly growing thermal management technology market. When compiling its research report—Top 10 Thermal Management Companies and Emerging Transformative Technologies—BCC Research closely examined…read more
Thin-Film Thermoelectrics with Improved Cooling Efficiency
February 7th, 2012
Nextreme Thermal Solutions’ thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.…read more
Temperature/Process Controller Panel CNI-CB120SB
February 7th, 2012
Omega introduces its new series CNI-CB120SB, a self-contained temperature control panel that provides a complete control system design, eliminating the need to select, collect and assemble separate components. The preconfigured panels are ready to install,…read more
New Version of Software for Modeling Data Centers
February 7th, 2012
Daat Research Corp has released v5.0 of its CoolitDC CFD thermal modeling software for data centers. Daat has increased preprocessor performance to permit building larger models in less time. CoolitDC v5.0 adds a new turbulence…read more
New Data Center Infrastructure Management Software
February 7th, 2012
Raritan introduced dcTrack® 2.6 DCIM (Data Center Infrastructure Management) software with new intelligent connectivity management capabilities to help data center professionals manage both network and power connections more efficiently. With better visibility of end-to-end connections…read more
Thermocouple Virtual Chart Recorder
February 7th, 2012
The NEWPORT® iTCX transmitter let’s you monitor temperature from two independent Thermocouple channels over an Ethernet network or the Internet with no special software except a Web Browser. The NEWPORT iTCX serves Active Web Pages…read more
Cooling Semiconductor with Laser Light
February 7th, 2012
Researchers at the Niels Bohr Institute have discovered a new method for laser cooling semiconductor membranes. Semiconductors are vital components in solar cells, LEDs and many other electronics, and the efficient cooling of components is…read more
Graphene as a Thermal Conductor
February 7th, 2012
Alexander Balandin, a professor of electrical engineering at the UC Riverside Bourns College of Engineering, and researchers from The University of Texas at Austin, The University of Texas at Dallas and Xiamen University in China,…read more
Bottlenecks and Interface Materials; Part 2 – When TIMs Go Bad
January 30th, 2012
‘Bits stuck onto other bits’, a succinct definition of an electronic product, if not a product that contains electronics. Soldering is the method of choice for getting the components to attach to the pcb, the…read more
Has Your Brand Image Been Hijacked?
January 25th, 2012
Electronics Cooling Business Bulletin Volume 6 | January 2012 In a recent article entitled “Who is Managing Your Brand Image?” my colleague, Graham Kilshaw, explained how customer behavior has effected a significant shift in marketing,…read more
Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point
January 22nd, 2012
By far and away the most common enquiry by someone using FloTHERM, especially at the start of their adoption, is “How do I model my components?”. This is hardly surprising as the mainstay of electronics…read more
Bottlenecks and Interface Materials; Part 1 – Great Thermal Bedfellows
January 18th, 2012
Probably due to the beer fridge, I now seem to be becoming the repository of broken electronic products with an expectation that the cause of their demise can be identified, retrospectively, using thermal simulation. This…read more
Recent Posts
- Mersen Appoints New Vice President
- Bottlenecks and Interface Materials; Part 3 – Relieving Thermal Bottlenecks Reduce Temperatures
- Research Company Names Top Thermal Management Supplier
- Thin-Film Thermoelectrics with Improved Cooling Efficiency
- Temperature/Process Controller Panel CNI-CB120SB
- New Version of Software for Modeling Data Centers
- New Data Center Infrastructure Management Software
- Thermocouple Virtual Chart Recorder
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