Temporary Bonding Adhesive for 3D Wafer Integration

April 6th, 2015

AI Technology Inc. introduces its new 3D TSV ultra thin wafer processing adhesive (WPA) for thin wafer processing. The new adhesives are thermally stable to 320-330 degrees Celsius and have high bond strength. “In comparison…read more

New Accelerometer Eliminates Noise

March 23rd, 2015

PCB Piezotronics, Inc., announces a new crystal technology for use in high temperature applications – the Ultra High Temperature 1200 degrees Fahrenheit, or UHT-12™. “This new development solves the gas turbine manufacturers problem with ceramic based…read more

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Thermal Facts and Fairy Tales: Past Data and Columns

March 20th, 2015

Jim Wilson ElectronicsCooling magazine provided a technical data column from 1997 to 2009 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. The most common materials and…read more

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Design Optimization of a Multi-Device Single-Phase Branching Microchannel Cold Plate

March 20th, 2015

 Ercan M. Dede   INTRODUCTION Single-phase liquid cooling is an established approach to the thermal management of highly-reliable hybrid vehicle power electronics. However, as the electrification of hybrid vehicles increases, and under-hood space becomes further…read more

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Strategies for the Thermal Modeling of Metal Traces on Printed Circuit Boards

March 20th, 2015

Bruce Guenin, Assoc. Technical Editor Introduction As integrated circuit (IC) devices get more complex, the interconnections between them provided by printed circuit boards (PCBs) get more complicated as well. Thermal simulation software tools are getting…read more

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Thermal Power Plane Enabling Dual-Side Electrical Interconnects for High-Performance Chip Stacks

March 20th, 2015

Thomas Brunschwiler, Gerd Schlottig, Hubert Harrer and Stefano Oggioni Abstract In this report the design and performance of a thermally enhanced laminate called thermal power plane (TPP) is reported. It enables dual-side electrical interconnects to…read more

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ACT Assists German Government Lab

March 9th, 2015

Advanced Cooling Technologies (ACT) announced it has recently delivered a pressure controlled heat pipe (PCHP) calibrator to a German government lab. ACT is known for supplying companies in the industry with its heat pipes and…read more

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New Conductive Adhesives and Inks Announced

March 9th, 2015

Creative Materials, Inc. introduces electrically conductive adhesives and inks that are custom-designed for wearable electronics. Some of these products include the 125-19FS, the 120-07, and the 124-33. The 125-19FS is a conductive ink that is…read more

Company’s New Schroff Case Includes Integrated Cooling Solution

March 9th, 2015

Pentair Technical Solutions introduces its first compact Schroff case that meets the embeddedNUC standard and includes integration cooling solutions.  The case allows users to protect and cool their PC units while simultaneously controlling and monitoring…read more

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Bendable Heat Pipes Ideal for Space-limited Applications

February 19th, 2015

Jaro Thermal announces its new ultra-slim, maintenance free, “Capillary” heatpipes that allow cooling from 5W to 35W. These heatpipes use water as working fluid “that continually alternates between evaporation and condensation. This constant cycling of water to…read more

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Two-phase Cooling Technologies Achieve 1,000 w/cm2

February 19th, 2015

Celsia Inc. has successfully tested its new hybrid and passive two-phase cooling technology to 1,000 w/cm2. The copper devices are available in different thicknesses and are ideal for use in high power density laser diodes,…read more

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UV-cured Adhesive Increases Reliability in Assembly of Electronics

February 9th, 2015

Engineered Materials Systems, Inc. introduces a new UV cure adhesive, the 535-11M-3. The 535-11M-3 is a non-conductive, low-outgassing, flexible adhesive that eliminates “crowning” of sliders in Head Gimbal Assemblies. This flexible and strong adhesive does not contain antimony…read more

Thermally Stable and Optically Clear Epoxy Introduced

February 9th, 2015

Master Bond Inc. introduces its EP62-1LPSP, an optically clear and low viscosity epoxy which features a long open time at room temperature. This epoxy bonds well to many substrates such as composites, metals, glass and…read more

Company Delivers Products to the International Space Station

January 26th, 2015

SpaceX’s CRS 5 dragon capsule successfully delivered four of Advanced Cooling Technologies Inc. (ACT)s’ fluid compensation accumulators installed in NASA’s Cloud Aerosol Transport Systems (CATS) to the International Space Station on January 13. These accumulators…read more

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