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Custom Modular Cooling Pumps Providing Off-The-Shelf Component Design

July 12th, 2016

Parker Aerospace, a business segment of global leader in motion and control technologies Parker Hannifin Corporation (NYSE:PH), announced a new family of cooling pumps featuring a common core of basic motor and pump components. According…read more

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Thermal Facts and Fairy Tales: Understanding and Defining Electronics Cooling Requirements

July 8th, 2016

Jim Wilson My experience in electronics cooling has taught me that it is often a fairy tale that thermal engineers fully understand requirements related to their designs and analyses, or that they fully understand the…read more

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Application of Phase Change Materials in Handheld Computing Devices

July 7th, 2016

William Maltz, Darryl Moore, and Arun Raghupathy 1. Introduction With peak loads often in the order of minutes and ergonomic considerations limiting surface temperatures and acoustical noise, handheld devices, such as smart phones or tablets, are…read more

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New Software Creates Heat Sink Geometries

July 5th, 2016

From Cradle, HeatDesigner is a fast, efficient, and easy to use thermal analysis tool for electronics cooling. It includes a one time saving feature, a Parametric Study Tool, and plate heat sink creation. With a…read more

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Thermal Simulation Tool for Design Engineers Available

May 23rd, 2016

In recent years, Cradle has created and launched an easy to use, real-time, printed circuit board thermal analysis tool for electrical designers, called the Cradle PICLS. PICLS enables electrical designers to instantly evaluate how changes…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

Posted in Aerospace, Automotive, Communications, Computer, Defense, Industrial, Materials, Compounds, Adhesives, Substrates, Medical, New Products | Comments Off on New Availability of Data Matrix Codes (DMCs)

New “Form-In-Place” Product with Process Demonstration Video

April 22nd, 2016

JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech…read more

Posted in Computer, Design, Design, Materials, Compounds, Adhesives, Substrates, New Products, Thermal Imaging | Comments Off on New “Form-In-Place” Product with Process Demonstration Video

New System Improves Lead Times

April 18th, 2016

A manufacturer of thermoelectric air conditioners, TECA Corporation, has recently implemented a new program to improve lead times. President of TECA, Mike Mikalauskis, said, “We were able to pair new software with a more streamlined…read more

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Calculation Corner: Estimating Parallel Plate-fin Heat Sink Pressure Drop

April 14th, 2016

Editor’s note: In recognition of the 20th year of ElectronicsCooling, we are republishing articles from past issues that we believe to be of particular value to our readership.  The following article was published in the…read more

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Cooling Matters

April 14th, 2016

The World’s First Liquid-Cooled Gaming Laptop The Asus ROG GX700 has been introduced as the world’s first liquid-cooled gaming laptop. Asus ROG Global Marketing Director Derek Yu created the inch-thick laptop with a Nvidia GTX…read more

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Electronics Cooling with Autodesk CFD

February 9th, 2016

  Electronics Cooling with Autodesk CFD WEBINAR See the invisible. Maximize product performance.   To view the recording of this webinar, click here.   Who should attend:  Analysts, Engineers, those involved in industries including electronics…read more

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New Hybrid Adhesives Use UV Cure and Heat Cure Combination

January 8th, 2016

Epoxy Technology Inc. has released a new line of UV Hybrid adhesives. The company says these adhesives allow “engineers to reach new levels of production/process improvement” and afford “greater design flexibility.” They use “a primary…read more

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Thermal Facts and Fairy Tales – Electronics Cooling Communication for dumMEs and dumEEs

December 1st, 2015

Bringing Together Mechanical and Electrical Engineers By Jim Wilson Electronics cooling design and analysis problems inherently bring together engineers from different backgrounds, especially mechanical and electrical engineers.  Engineers with a heat transfer or fluid mechanics…read more

Posted in Number 4, Volume 21 | Comments Off on Thermal Facts and Fairy Tales – Electronics Cooling Communication for dumMEs and dumEEs

Tech Brief – Low Electrical Conductivity Liquid Coolants for Electronics Cooling

December 1st, 2015

By Bojanna Shantheyanda, Sreya Dutta, Kevin Coscia and David Schiemer Dynalene, Inc. 1.0 Introduction Liquid cooling, which can be achieved using indirect or direct means, is utilized in electronics applications having thermal power densities that…read more

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