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New Materials Technology Brochure Released

July 1st, 2015

Thermacore, Inc. released a new materials technology brochure which offers information about the company’s Materials Technology Division (MTD) including material development and processing capabilities. Some of the capabilities, products and services discussed in the brochure include…read more

Posted in Design, Design, Materials, Compounds, Adhesives, Substrates, New Products, Test & Measurement | Comments Off on New Materials Technology Brochure Released

New Fast Curing Silicone Designed for High Performance Bonding

June 29th, 2015

Master Bond Inc. announces the MasterSil 912Med, a new one-part, neutral curing silicone designed for high performance bonding, coating and sealing for medical devices. It easily adheres to materials including ceramics, composites, glass, metals, rubbers,…read more

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New IGBT Series Reduces EMI and Power Dissipation

June 22nd, 2015

Alpha and Omega Semiconductor Limited (AOS) has expanded its Insulated-Gate Bipolar Transistor (IGBT) product portfolio with the addition of a new 650V M-series. “The new M-series is co-packaged with a soft and fast freewheeling diode…read more

Posted in Consumer, Design, Industrial, New Products, Power, Semiconductor | Comments Off on New IGBT Series Reduces EMI and Power Dissipation

Silicone-based Sponge Connectors Unveiled

June 8th, 2015

Fujipoly America Corporation introduces new self-supporting sponge connectors. These connectors are ideal for connecting LCD panels to circuit boards. “Each connector is made from an economical and highly reliable Zebra core that is sandwiched between…read more

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An All-Silicon Field Programmable Thermal Emulator for Integrated Circuits

May 21st, 2015

By: Wen Yueh, Khondker Z. Ahmed, and Saibal Mukhopadhyay School of ECE, Georgia Institute of Technology Introduction Thermal test chips with integrated thin-film heaters via post-processing are often used as the test structure to evaluate…read more

Posted in Articles, Number 2, Technical Brief, Volume 21 | Comments Off on An All-Silicon Field Programmable Thermal Emulator for Integrated Circuits

The Holy Books of Heat Transfer: Facts or Fairy Tales?

May 21st, 2015

By: Clemens J.M. Lasance; Guest Editor The answer to the question stated in the title is: both! It all depends on whether or not your situation is truly similar to the situation described in the…read more

Posted in Articles, Heat Exchanger, Number 2, Volume 21 | Comments Off on The Holy Books of Heat Transfer: Facts or Fairy Tales?

The Joy of Engineering

May 21st, 2015

By: Bruce Guenin, Acting Editor-in-Chief The recent financial crisis and the subsequent difficulties encountered by many recent college graduates in finding satisfying jobs, particularly for those in the humanities, has led to many questioning the…read more

Posted in Editorial, Number 2, Volume 21 | Comments Off on The Joy of Engineering

New Gap Filler Improves Heat Management in Automotive Electronics

May 20th, 2015

Dow Corning introduces the TC-4525, a thermally conductive gap filler that offers advanced heat management in automotive electronics. This gap filler is two-part silicone, soft, compressible and cost-effective. It can be used directly from its…read more

Posted in Automotive, Heat Exchanger, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on New Gap Filler Improves Heat Management in Automotive Electronics

New Hot Melt Adhesive Offers Instant Green Strength

May 11th, 2015

Dow Corning announces a new hot melt room-temperature vulcanization (RTV) black adhesive, the EA-4600. It’s a one-component, moisture-cure and solventless silicon material, designed to improve assembly of consumer electronics and other devices such as smart…read more

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Thermal Simulation Software Named Product of the Year

April 24th, 2015

Future Facilities’ thermal simulation software, the 6SigmaET R9, has been chosen as product of the year at the Engineering Simulation Show 2015. Judges awarded the prize for the software being “easy to use, powerful and intuitive”…read more

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Temporary Bonding Adhesive for 3D Wafer Integration

April 6th, 2015

AI Technology Inc. introduces its new 3D TSV ultra thin wafer processing adhesive (WPA) for thin wafer processing. The new adhesives are thermally stable to 320-330 degrees Celsius and have high bond strength. “In comparison…read more

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New Accelerometer Eliminates Noise

March 23rd, 2015

PCB Piezotronics, Inc., announces a new crystal technology for use in high temperature applications – the Ultra High Temperature 1200 degrees Fahrenheit, or UHT-12™. “This new development solves the gas turbine manufacturers problem with ceramic based…read more

Posted in New Products, Test & Measurement | Comments Off on New Accelerometer Eliminates Noise

Thermal Facts and Fairy Tales: Past Data and Columns

March 20th, 2015

Jim Wilson ElectronicsCooling magazine provided a technical data column from 1997 to 2009 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. The most common materials and…read more

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Design Optimization of a Multi-Device Single-Phase Branching Microchannel Cold Plate

March 20th, 2015

 Ercan M. Dede   INTRODUCTION Single-phase liquid cooling is an established approach to the thermal management of highly-reliable hybrid vehicle power electronics. However, as the electrification of hybrid vehicles increases, and under-hood space becomes further…read more

Posted in Articles, Design | Comments Off on Design Optimization of a Multi-Device Single-Phase Branching Microchannel Cold Plate