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Tech Brief: Commercially-available Thermally Enhanced Polymer Composite Materials Characteristics

August 22nd, 2016

Peter Rodgers, Editor Valérie Eveloy, The Petroleum Institute Introduction The development, characterization, and implementation of polymer composite materials for the thermal management of electronic equipment has recently began to attract attention [1,2].  The enhanced thermal conductivity,…read more

Posted in Articles, Communications, Computer, Consumer, Heat Exchanger, Materials, Compounds, Adhesives, Substrates, Technical Brief | Comments Off on Tech Brief: Commercially-available Thermally Enhanced Polymer Composite Materials Characteristics

Webinar and Report Available On-Demand Now

August 18th, 2016

The Critical Power Expo has recently released their report and webinar on “Key Trends on the Design and Operation of Power Systems for Mission-Critical Environments” free and on-demand. The exclusive report explores the key trends…read more

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Temporary Bonding Adhesive for Thin Wafer Handling Introduced

August 15th, 2016

AI Technology has developed specialized tools and equipment to handle thin wafers and thin reconstituted wafers. A series of temporary bonding materials can process temperatures up to 150 Cº, and are well accepted for grinding,…read more

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Introducing Technical Editor MP Divakar

August 8th, 2016

by MP Divakar, PhD, Stack Design Automation (www.stack-da.com) Technical Editor, Electronics Cooling Online   It gives me great pleasure to join the electronics thermal management community as the Technical Editor for the online edition of…read more

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Custom Modular Cooling Pumps Providing Off-The-Shelf Component Design

July 12th, 2016

Parker Aerospace, a business segment of global leader in motion and control technologies Parker Hannifin Corporation (NYSE:PH), announced a new family of cooling pumps featuring a common core of basic motor and pump components. According…read more

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Thermal Facts and Fairy Tales: Understanding and Defining Electronics Cooling Requirements

July 8th, 2016

Jim Wilson My experience in electronics cooling has taught me that it is often a fairy tale that thermal engineers fully understand requirements related to their designs and analyses, or that they fully understand the…read more

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Application of Phase Change Materials in Handheld Computing Devices

July 7th, 2016

William Maltz, Darryl Moore, and Arun Raghupathy 1. Introduction With peak loads often in the order of minutes and ergonomic considerations limiting surface temperatures and acoustical noise, handheld devices, such as smart phones or tablets, are…read more

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New Software Creates Heat Sink Geometries

July 5th, 2016

From Cradle, HeatDesigner is a fast, efficient, and easy to use thermal analysis tool for electronics cooling. It includes a one time saving feature, a Parametric Study Tool, and plate heat sink creation. With a…read more

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Thermal Simulation Tool for Design Engineers Available

May 23rd, 2016

In recent years, Cradle has created and launched an easy to use, real-time, printed circuit board thermal analysis tool for electrical designers, called the Cradle PICLS. PICLS enables electrical designers to instantly evaluate how changes…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

Posted in Aerospace, Automotive, Communications, Computer, Defense, Industrial, Materials, Compounds, Adhesives, Substrates, Medical, New Products | Comments Off on New Availability of Data Matrix Codes (DMCs)

New “Form-In-Place” Product with Process Demonstration Video

April 22nd, 2016

JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech…read more

Posted in Computer, Design, Design, Materials, Compounds, Adhesives, Substrates, New Products, Thermal Imaging | Comments Off on New “Form-In-Place” Product with Process Demonstration Video

New System Improves Lead Times

April 18th, 2016

A manufacturer of thermoelectric air conditioners, TECA Corporation, has recently implemented a new program to improve lead times. President of TECA, Mike Mikalauskis, said, “We were able to pair new software with a more streamlined…read more

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Calculation Corner: Estimating Parallel Plate-fin Heat Sink Pressure Drop

April 14th, 2016

Editor’s note: In recognition of the 20th year of ElectronicsCooling, we are republishing articles from past issues that we believe to be of particular value to our readership.  The following article was published in the…read more

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Cooling Matters

April 14th, 2016

The World’s First Liquid-Cooled Gaming Laptop The Asus ROG GX700 has been introduced as the world’s first liquid-cooled gaming laptop. Asus ROG Global Marketing Director Derek Yu created the inch-thick laptop with a Nvidia GTX…read more

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