Low Maintenance Air Conditioner Encompasses New Design

December 15th, 2014

TECA has introduced its new Pivot Clean design which simplifies cooling, according to the company. This new design allows users to open the external housing without needing to remove it from the air conditioner. Air…read more

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Company offers Thermoplastic Compounds Solutions

December 9th, 2014

There is a reported global shortage of Polyetherimide (PEI) and RTP Company offers a solution with its thermoplastic compounds as a practical alternative to the polymer. Engineers from RTP Company have produced and modified these…read more

Application Builder Assists in Development of Simulation App

December 9th, 2014

Last month, APEI introduced its new Application Builder, and has now announced the development of a multiphysics simulation application using this application builder. This new app “allows COMSOL software users to build an intuitive interface…read more

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Use of the Monte Carlo Method in Packaging Thermal Calculations

December 3rd, 2014

Bruce Guenin, Assoc. Technical Editor Introduction The state of the art in performing thermal calculations in our industry is very advanced. However, how applicable the results of a calculation are to the real-world performance of…read more

Posted in Calculation Corner, Number 4, Volume 20 | Comments Off

Leakage Power: Physical Mechanisms and Possible Solutions

December 2nd, 2014

Caleb Serafy and Ankur Srivastava ECE Department, University of Maryland, College Park {cserafy1,ankurs} As technology scaling continues to push transistors to smaller and smaller sizes, leakage power has become a significant portion of total power…read more

Posted in Free Air Cooling, Number 4, Volume 20 | Comments Off

Electronics Cooling December 2014 Issue Now Online

December 2nd, 2014

Don’t miss out on the December 2014 issue of Electronics Cooling, which includes feature articles on Carbon-Based Thermal Interface Material; Leakage Power; Thermal Considerations in LED System Modeling; and more. If you would like to…read more

Posted in Number 4, Volume 20 | Comments Off

Add-on to Existing Product Enhances Thermal Simulation

November 24th, 2014

Harley Thermal LLC has announced its new SolariaPCB, an add-on to Solaria, the company’s thermal simulation software tool.  The SolariaPCB allows quick and easy thermal simulation of printed circuit boards. “The SolariaPCB add-on to Solaria…read more

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Company Introduces Low Outgassing Epoxy

November 24th, 2014

The Master Bond EP17HT-LO has just been introduced by Master Bond Inc. This product is a low outgassing “one part epoxy for bonding, sealing, coating and encapsulation applications.” This epoxy is capable of operating in…read more

New Technology Reduces Thermal Testing Time by 90 Percent

November 10th, 2014

The Industrial Technology Research Institute in Taiwan announces its new In-Line Compact Thermal Analyzer Technology, the ICTA. The ICTA improves LED thermal testing time by more than 90 percent by reducing the testing time to…read more

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Lab Safety Improved with Quick Disconnect Couplings on Caps

November 10th, 2014

Colder Products Company introduces its BQ45GL series – 45mm caps with integrated quick disconnect couplings, which is a first in the market. “Adding quick disconnects to media bottles enhances the user experience when using laboratory…read more

Fast Curing Epoxy Introduced

November 10th, 2014

Master Bond Inc. announces its new Master Bond Supreme 3HTND-2DA, which is a high performance, one component epoxy for die attach applications. At 150 degrees Celsius the epoxy can cure in only five to ten…read more

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New Thermoelectric Air Conditioner Introduced

November 10th, 2014

TECA introduces a new and improved Thermoelectric Air Conditioner, known as the AHP-690.  The AHP-690 is powerful, compact, and offers a 55 percent greater performance in cooling than other products in the industry. Because TECA’s…read more

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Gasoline and Diesel Fueled Vehicles and Instruments See Increased Fuel Efficiency in Near Future

October 27th, 2014

A new thermoelectric material to increase fuel efficiency has been introduced by GMZ Energy. The material is called Hafnium-free p-type half-Heusler and costs less to produce than previous materials. This material also has an improved…read more

New Software Decreases Solution Time

October 27th, 2014

Daat Research Corp. has cut solution time for transient problems by more than ten times with its new v.14 CFD software. This new software now allows engineers to use larger steps when solving transients and…read more

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