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Company Delivers Products to the International Space Station

January 26th, 2015

SpaceX’s CRS 5 dragon capsule successfully delivered four of Advanced Cooling Technologies Inc. (ACT)s’ fluid compensation accumulators installed in NASA’s Cloud Aerosol Transport Systems (CATS) to the International Space Station on January 13. These accumulators…read more

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Instruments with Low Noise Levels Introduced

January 26th, 2015

Wavelength electronics introduces the new QCL500 Lab series Quantum Cascade Laser Drivers. This series of instruments offers the lowest noise in the industry. The QCL500 series is ideal for use in remote detection, medical diagnoses,…read more

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Gas-air-ratio Control Solutions on Display at AHR Expo

January 26th, 2015

Ebm-papst will showcase its NRV series product line of pneumatic gas air ratio control (GARC) systems at the 2015 AHR Expo at booth 2110. These control systems condense boiler technology. One product line, the NRV…read more

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Elastomeric Connector Connects LCDs to PCBs

January 26th, 2015

Fujipoly America Corporation introduces a way to connect an LCD to a PCB with its debut of the Zebra 2004 Elastomeric Connector. When placed between a printed circuit board (PCB) and a parallel device, such…read more

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Debut of Comprehensive Power Cords and Cord Sets

January 12th, 2015

Qualtek has a comprehensive selection of power cores and cord sets including North American Power Cords, International Power Cords and Hospital Grade Power Cords. The power cords and cord sets are RoHS and REACH compliant,…read more

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New Epoxy Offers Low Coefficient of Thermal Expansion

January 12th, 2015

Master Bond announces its EP42HT-2LTE, a two part room temperature curing epoxy. This epoxy is ideal for use in bonding, sealing, coating and casting applications in the aerospace, electronic, optical and specialty OEM industries. The…read more

Low Maintenance Air Conditioner Encompasses New Design

December 15th, 2014

TECA has introduced its new Pivot Clean design which simplifies cooling, according to the company. This new design allows users to open the external housing without needing to remove it from the air conditioner. Air…read more

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Company offers Thermoplastic Compounds Solutions

December 9th, 2014

There is a reported global shortage of Polyetherimide (PEI) and RTP Company offers a solution with its thermoplastic compounds as a practical alternative to the polymer. Engineers from RTP Company have produced and modified these…read more

Application Builder Assists in Development of Simulation App

December 9th, 2014

Last month, APEI introduced its new Application Builder, and has now announced the development of a multiphysics simulation application using this application builder. This new app “allows COMSOL software users to build an intuitive interface…read more

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Use of the Monte Carlo Method in Packaging Thermal Calculations

December 3rd, 2014

Bruce Guenin, Assoc. Technical Editor Introduction The state of the art in performing thermal calculations in our industry is very advanced. However, how applicable the results of a calculation are to the real-world performance of…read more

Posted in Calculation Corner, Number 4, Volume 20 | Comments Off

Leakage Power: Physical Mechanisms and Possible Solutions

December 2nd, 2014

Caleb Serafy and Ankur Srivastava ECE Department, University of Maryland, College Park {cserafy1,ankurs}@umd.edu As technology scaling continues to push transistors to smaller and smaller sizes, leakage power has become a significant portion of total power…read more

Posted in Free Air Cooling, Number 4, Volume 20 | Comments Off

Electronics Cooling December 2014 Issue Now Online

December 2nd, 2014

Don’t miss out on the December 2014 issue of Electronics Cooling, which includes feature articles on Carbon-Based Thermal Interface Material; Leakage Power; Thermal Considerations in LED System Modeling; and more. If you would like to…read more

Posted in Number 4, Volume 20 | Comments Off

Add-on to Existing Product Enhances Thermal Simulation

November 24th, 2014

Harley Thermal LLC has announced its new SolariaPCB, an add-on to Solaria, the company’s thermal simulation software tool.  The SolariaPCB allows quick and easy thermal simulation of printed circuit boards. “The SolariaPCB add-on to Solaria…read more

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Company Introduces Low Outgassing Epoxy

November 24th, 2014

The Master Bond EP17HT-LO has just been introduced by Master Bond Inc. This product is a low outgassing “one part epoxy for bonding, sealing, coating and encapsulation applications.” This epoxy is capable of operating in…read more