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An All-Silicon Field Programmable Thermal Emulator for Integrated Circuits

May 21st, 2015

By: Wen Yueh, Khondker Z. Ahmed, and Saibal Mukhopadhyay School of ECE, Georgia Institute of Technology Introduction Thermal test chips with integrated thin-film heaters via post-processing are often used as the test structure to evaluate…read more

Posted in Articles, Number 2, Technical Brief, Volume 21 | Comments Off on An All-Silicon Field Programmable Thermal Emulator for Integrated Circuits

The Holy Books of Heat Transfer: Facts or Fairy Tales?

May 21st, 2015

By: Clemens J.M. Lasance; Guest Editor The answer to the question stated in the title is: both! It all depends on whether or not your situation is truly similar to the situation described in the…read more

Posted in Articles, Heat Exchanger, Number 2, Volume 21 | Comments Off on The Holy Books of Heat Transfer: Facts or Fairy Tales?

The Joy of Engineering

May 21st, 2015

By: Bruce Guenin, Acting Editor-in-Chief The recent financial crisis and the subsequent difficulties encountered by many recent college graduates in finding satisfying jobs, particularly for those in the humanities, has led to many questioning the…read more

Posted in Editorial, Number 2, Volume 21 | Comments Off on The Joy of Engineering

New Gap Filler Improves Heat Management in Automotive Electronics

May 20th, 2015

Dow Corning introduces the TC-4525, a thermally conductive gap filler that offers advanced heat management in automotive electronics. This gap filler is two-part silicone, soft, compressible and cost-effective. It can be used directly from its…read more

Posted in Automotive, Heat Exchanger, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on New Gap Filler Improves Heat Management in Automotive Electronics

New Hot Melt Adhesive Offers Instant Green Strength

May 11th, 2015

Dow Corning announces a new hot melt room-temperature vulcanization (RTV) black adhesive, the EA-4600. It’s a one-component, moisture-cure and solventless silicon material, designed to improve assembly of consumer electronics and other devices such as smart…read more

Posted in Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on New Hot Melt Adhesive Offers Instant Green Strength

Thermal Simulation Software Named Product of the Year

April 24th, 2015

Future Facilities’ thermal simulation software, the 6SigmaET R9, has been chosen as product of the year at the Engineering Simulation Show 2015. Judges awarded the prize for the software being “easy to use, powerful and intuitive”…read more

Posted in New Products, Software/Modeling | Comments Off on Thermal Simulation Software Named Product of the Year

Temporary Bonding Adhesive for 3D Wafer Integration

April 6th, 2015

AI Technology Inc. introduces its new 3D TSV ultra thin wafer processing adhesive (WPA) for thin wafer processing. The new adhesives are thermally stable to 320-330 degrees Celsius and have high bond strength. “In comparison…read more

Posted in Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on Temporary Bonding Adhesive for 3D Wafer Integration

New Accelerometer Eliminates Noise

March 23rd, 2015

PCB Piezotronics, Inc., announces a new crystal technology for use in high temperature applications – the Ultra High Temperature 1200 degrees Fahrenheit, or UHT-12™. “This new development solves the gas turbine manufacturers problem with ceramic based…read more

Posted in New Products, Test & Measurement | Comments Off on New Accelerometer Eliminates Noise

Thermal Facts and Fairy Tales: Past Data and Columns

March 20th, 2015

Jim Wilson ElectronicsCooling magazine provided a technical data column from 1997 to 2009 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. The most common materials and…read more

Posted in Articles | Comments Off on Thermal Facts and Fairy Tales: Past Data and Columns

Design Optimization of a Multi-Device Single-Phase Branching Microchannel Cold Plate

March 20th, 2015

 Ercan M. Dede   INTRODUCTION Single-phase liquid cooling is an established approach to the thermal management of highly-reliable hybrid vehicle power electronics. However, as the electrification of hybrid vehicles increases, and under-hood space becomes further…read more

Posted in Articles, Design | Comments Off on Design Optimization of a Multi-Device Single-Phase Branching Microchannel Cold Plate

Strategies for the Thermal Modeling of Metal Traces on Printed Circuit Boards

March 20th, 2015

Bruce Guenin, Assoc. Technical Editor Introduction As integrated circuit (IC) devices get more complex, the interconnections between them provided by printed circuit boards (PCBs) get more complicated as well. Thermal simulation software tools are getting…read more

Posted in Articles, Calculation Corner | Comments Off on Strategies for the Thermal Modeling of Metal Traces on Printed Circuit Boards

Thermal Power Plane Enabling Dual-Side Electrical Interconnects for High-Performance Chip Stacks

March 20th, 2015

Thomas Brunschwiler, Gerd Schlottig, Hubert Harrer and Stefano Oggioni Abstract In this report the design and performance of a thermally enhanced laminate called thermal power plane (TPP) is reported. It enables dual-side electrical interconnects to…read more

Posted in Articles, Design | Comments Off on Thermal Power Plane Enabling Dual-Side Electrical Interconnects for High-Performance Chip Stacks

Thermal Test Chips on Display at SEMI-THERM

March 13th, 2015

Thermal Engineering Associates (TEA) will display Thermal Test Chips and Wafers at SEMI-THERM at booth 300. The wafers on display range from 200mm and 300mm and thicker ones range from 700mm to 800mm. Thinner wafers will…read more

Posted in New Products, Semiconductor | Comments Off on Thermal Test Chips on Display at SEMI-THERM

ACT Assists German Government Lab

March 9th, 2015

Advanced Cooling Technologies (ACT) announced it has recently delivered a pressure controlled heat pipe (PCHP) calibrator to a German government lab. ACT is known for supplying companies in the industry with its heat pipes and…read more

Posted in Heat Pipes, New Products | Comments Off on ACT Assists German Government Lab