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New Hybrid Adhesives Use UV Cure and Heat Cure Combination

January 8th, 2016

Epoxy Technology Inc. has released a new line of UV Hybrid adhesives. The company says these adhesives allow “engineers to reach new levels of production/process improvement” and afford “greater design flexibility.” They use “a primary…read more

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Thermal Facts and Fairy Tales – Electronics Cooling Communication for dumMEs and dumEEs

December 1st, 2015

Bringing Together Mechanical and Electrical Engineers By Jim Wilson Electronics cooling design and analysis problems inherently bring together engineers from different backgrounds, especially mechanical and electrical engineers.  Engineers with a heat transfer or fluid mechanics…read more

Posted in Number 4, Volume 21 | Comments Off on Thermal Facts and Fairy Tales – Electronics Cooling Communication for dumMEs and dumEEs

Tech Brief – Low Electrical Conductivity Liquid Coolants for Electronics Cooling

December 1st, 2015

By Bojanna Shantheyanda, Sreya Dutta, Kevin Coscia and David Schiemer Dynalene, Inc. 1.0 Introduction Liquid cooling, which can be achieved using indirect or direct means, is utilized in electronics applications having thermal power densities that…read more

Posted in Design, Number 4, Volume 21 | Comments Off on Tech Brief – Low Electrical Conductivity Liquid Coolants for Electronics Cooling

Enhanced Pool Boiling using Separate Liquid-Vapor Pathways for Cooling High Heat Flux Electronics Devices

December 1st, 2015

By Satish G. Kandlikar1,2 and Arvind Jaikumar2 1Mechanical Engineering Department, Rochester Institute of Technology, 76 Lomb Memorial Dr., Rochester, NY 14623, USA; 2Microsystems Engineering Department, Rochester Institute of Technology, 168 Lomb Memorial Dr., Rochester, NY 14623, USA The…read more

Posted in Design, Number 4, Volume 21 | Comments Off on Enhanced Pool Boiling using Separate Liquid-Vapor Pathways for Cooling High Heat Flux Electronics Devices

Calculation Corner: Estimating Parallel Plate-fin Heat Sink Thermal Resistance

December 1st, 2015

By Robert E. Simons, IBM Corporation Editor’s note: In recognition of the 20th year of ElectronicsCooling, we are republishing articles from past issues that we believe to be of particular value to our readership.  The following article was published in the February…read more

Posted in Design, Number 4, Volume 21 | Comments Off on Calculation Corner: Estimating Parallel Plate-fin Heat Sink Thermal Resistance

Saving Energy with Every Byte: An Concerted Effort for Efficient Thermal Management of Data Centers

November 30th, 2015

By Yogesh Fulpagare and Atul Bhargav Energy Systems Research Laboratory, Indian Institute of Technology Gandhinagar, India With the advancement of technology, the access to information has become rapid as well as ubiquitous.  These mammoth resources…read more

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A Figure of Merit for Smart Phone Thermal Management

November 30th, 2015

By Victor Chiriac1, Steve Molloy1, Jon Anderson1, Ken Goodson2 1 Qualcomm Technologies, Inc., 2 Stanford Mechanical Engineering Introduction With smart phones and other mobile devices available in a variety of sizes and shapes, it is…read more

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Extreme-Temperature Probing Solutions Offered

November 25th, 2015

Keysight Technologies recently introduced the N7007A extreme-temperature 400-MHz passive probe and the N7013A extreme-temperature extension kit for medium- and high-voltage differential active probes. According to the company, the extreme-temperature probing solutions offer bandwidths up to…read more

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High Temperature Resistant, Thermal Conductive System Meets ASTM E595 Specifications

November 23rd, 2015

Master Bond’s MasterSil 972TC-LO, a high temperature resistant, thermally conductive system, now meets the requirements for low outgassing per ASTM E595 specifications. “MasterSil 972TC-LO is an insulator that has a thermal conductivity of 7-9 BTU•in/ft²•hr•°F…read more

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New Adhesive Materials with Jet Dispense and Snap Cure Abilities

November 16th, 2015

Recently, Techsil announced new jettable conductive adhesives with improved conductivity. According to Techsil, these adhesive materials have a high speed production because of their Jet dispense and snap cure abilities. “The new Elecolit® silver filled…read more

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New Medical-grade Silver-Silver Chloride Ink and Coating for Sensors

November 6th, 2015

Creative Materials, Inc. has recently presented 113-09(S), a new medical-grade silver-silver chloride (Ag-AgCl) ink and coating for sensors, ECG, EEG, TENS and defibrillator electrodes. According to Creative Materials, 113-09(S) is chemical-resistant and designed with aging…read more

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New Option for LCD to Printed Circuit Board Connections

October 29th, 2015

Fujipoly recently introduced the Series 5002 Silver Zebra connector. The connector is a low-cost, long-life option for LCD to printed circuit board connections, and can be used as a board to board connector where space…read more

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One-component Epoxy Cures at 200-220°F

October 19th, 2015

Master Bond introduces a new one-component epoxy, the Master Bond EP17HT-100, which is resistant to high temperatures and cures in 60-90 minutes at 200-220 degrees Fahrenheit. The EP17HT-100 is ideal for bonding, encapsulation, potting and…read more

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Company Acquires New Division to Increase Growth Opportunities

October 12th, 2015

Creative Materials, Inc, a manufacturer of adhesives, conductive inks and coatings, has announced its acquisition of Noelle Industries. Noelle Industries manufactures adhesive, coatings, encapsulants, potting compounds and more. “Their products are specialty-formulated epoxies, urethanes, silicones…read more

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