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Surface Temperatures of Electronics Products: Appliances vs. Wearables

September 20th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Prior to designing the requisite thermal management solution, engineers routinely calculate the junction temperatures of active and passive components using various methods at…read more

Posted in Consumer, Design, Design, Electronics Cooling Blog, Enclosures, Materials, Compounds, Adhesives, Substrates | Comments Off on Surface Temperatures of Electronics Products: Appliances vs. Wearables

New Epoxy Ideal for High Vacuum Environments

August 30th, 2016

Master Bond has released their new two part epoxy, EP30AN-1. EP30AN-1 is ideal for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and NASA low outgassing approval. It offers superb dimensional…read more

Posted in Aerospace, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on New Epoxy Ideal for High Vacuum Environments

Thermal Conductivity & CTE of Materials: Can We Engineer Them?

August 30th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Most electronics cooling problems are not just limited to the computation of temperatures at various points and the design remedies thereof. They also…read more

Posted in Electronics Cooling Blog, Industrial, Materials, Compounds, Adhesives, Substrates | Comments Off on Thermal Conductivity & CTE of Materials: Can We Engineer Them?

Understand Organic PCM Differences

August 29th, 2016

Microtek has a large selection of organic PCMs, offered in 3 main forms: PCM, Microencapsulated PCM, and Macroencapsulated PCM. PCM applications include shipping and packaging, solar energy systems, radiant heat flooring, industrial/commercial apparel (work vests,…read more

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Tech Brief: Commercially-available Thermally Enhanced Polymer Composite Materials Characteristics

August 22nd, 2016

Peter Rodgers, Editor Valérie Eveloy, The Petroleum Institute Introduction The development, characterization, and implementation of polymer composite materials for the thermal management of electronic equipment has recently began to attract attention [1,2].  The enhanced thermal conductivity,…read more

Posted in Articles, Communications, Computer, Consumer, Heat Exchanger, Materials, Compounds, Adhesives, Substrates, Technical Brief | Comments Off on Tech Brief: Commercially-available Thermally Enhanced Polymer Composite Materials Characteristics

Webinar and Report Available On-Demand Now

August 18th, 2016

The Critical Power Expo has recently released their report and webinar on “Key Trends on the Design and Operation of Power Systems for Mission-Critical Environments” free and on-demand. The exclusive report explores the key trends…read more

Posted in Design, Design, New Products, Power | Comments Off on Webinar and Report Available On-Demand Now

Temporary Bonding Adhesive for Thin Wafer Handling Introduced

August 15th, 2016

AI Technology has developed specialized tools and equipment to handle thin wafers and thin reconstituted wafers. A series of temporary bonding materials can process temperatures up to 150 Cº, and are well accepted for grinding,…read more

Posted in Aerospace, Automotive, Industrial, Materials, Compounds, Adhesives, Substrates, New Products | Comments Off on Temporary Bonding Adhesive for Thin Wafer Handling Introduced

Introducing Technical Editor MP Divakar

August 8th, 2016

by MP Divakar, PhD, Stack Design Automation (www.stack-da.com) Technical Editor, Electronics Cooling Online   It gives me great pleasure to join the electronics thermal management community as the Technical Editor for the online edition of…read more

Posted in Electronics Cooling Blog | Comments Off on Introducing Technical Editor MP Divakar

Custom Modular Cooling Pumps Providing Off-The-Shelf Component Design

July 12th, 2016

Parker Aerospace, a business segment of global leader in motion and control technologies Parker Hannifin Corporation (NYSE:PH), announced a new family of cooling pumps featuring a common core of basic motor and pump components. According…read more

Posted in Aerospace, Coolers, New Products, Power | Comments Off on Custom Modular Cooling Pumps Providing Off-The-Shelf Component Design

Thermal Facts and Fairy Tales: Understanding and Defining Electronics Cooling Requirements

July 8th, 2016

Jim Wilson My experience in electronics cooling has taught me that it is often a fairy tale that thermal engineers fully understand requirements related to their designs and analyses, or that they fully understand the…read more

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Application of Phase Change Materials in Handheld Computing Devices

July 7th, 2016

William Maltz, Darryl Moore, and Arun Raghupathy 1. Introduction With peak loads often in the order of minutes and ergonomic considerations limiting surface temperatures and acoustical noise, handheld devices, such as smart phones or tablets, are…read more

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New Software Creates Heat Sink Geometries

July 5th, 2016

From Cradle, HeatDesigner is a fast, efficient, and easy to use thermal analysis tool for electronics cooling. It includes a one time saving feature, a Parametric Study Tool, and plate heat sink creation. With a…read more

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Thermal Simulation Tool for Design Engineers Available

May 23rd, 2016

In recent years, Cradle has created and launched an easy to use, real-time, printed circuit board thermal analysis tool for electrical designers, called the Cradle PICLS. PICLS enables electrical designers to instantly evaluate how changes…read more

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New Availability of Data Matrix Codes (DMCs)

May 9th, 2016

Rogers has announced that they can add data matrix codes (DMCs) to a wide range of metalized substrates, including direct-bonded-copper and active-metal-brazed substrates. The codes can be “text or numeric in form and encoded by…read more

Posted in Aerospace, Automotive, Communications, Computer, Defense, Industrial, Materials, Compounds, Adhesives, Substrates, Medical, New Products | Comments Off on New Availability of Data Matrix Codes (DMCs)