More

New EP21AOLV-2Med Epoxy Proves Successful and Desirable

September 22nd, 2014

Masterbond Inc. has just introduced its New Epoxy named EP21AOLV-2Med which has passed all USP Class VI Tests and ISO 10993-5 Specifications. “EP21AOLV-2Med is thermally conductive and electrically isolating with a smooth consistency and good…read more

Posted in New Products | Comments Off

New Development of Silicon Carbide Substrates Raises the Bar

September 22nd, 2014

Dow Corning, an industry leader in silicon materials, has just introduced it now offers “150 mm diameter silicon carbide (SiC) wafers under its ground-breaking Prime Grade portfolio. Recently launched to set new standards for 100…read more

Posted in New Products | Comments Off

Company Announces New SPG-20B

September 22nd, 2014

Fujipoly America Corporation has just announced its silicon product SARCON® SPG-20B – a new version of their previous product, SARCON® SPG-15A. Benefits of the new product include a 40 percent greater thermal conductivity level and…read more

Posted in New Products | Comments Off

New Series of Bonding Wax Created to Shrink Wafers in Electronic Devices

September 22nd, 2014

AI Technology, Inc. has just announced its new temporary bonding wax – which was developed with intentions to shrink the thickness of wafers and dies in electronic devices such as cell phones, tablets, cameras, etc.…read more

Posted in New Products | Comments Off

Expansion of Company’s Line of Conductive Compounds Expected to Increase Consistency

September 22nd, 2014

RTP company, a company that produces custom thermoplastics, has just announced its new conductive compounds. The expansion of its previous line of conductive compounds is intended to progress levels of consistency in conductivity and mechanical…read more

Posted in New Products | Comments Off

Two New Grades of Compound to Reduce Cost and Maintain High Performance

September 19th, 2014

Saudi Basic Industries Corporation (SABIC) has just announced it has expanded its portfolio of compounds and materials by adding two new grades of a compound called KONDUIT. KONDUIT  PX13012 and PX11311U are made of compounds…read more

Posted in New Products | Comments Off

Partnership Leads to Success in Development of New Converter

September 19th, 2014

Calyos, a new company that specializes in 2-phase cooling solutions of electronics, has partnered with Alstom Transport to develop a railway converter named the CIPLIX Traction Coffer.  From September 23-26, Calyos will be in Berlin…read more

Posted in New Products | Comments Off

The Need for Electronics Thermal Design Practices to Embrace Sustainability

September 11th, 2014

Peter Rodgers, Editor-in-Chief, September 2014 Issue Global energy demand is projected to increase by 36% from 2010 to 2030, driven by population and economic growth in developing nations. This demand growth, combined with the depletion…read more

Posted in Number 3 | Comments Off

High Heat Flux, Single-Phase Microchannel and Minichannel Cooling with Water and Liquid Metal

September 5th, 2014

Rui Zhang, Marc Hodes, Nathan Lower and Ross Wilcoxon Introduction Microchannel heat sinks provide significant opportunities for enhanced thermal management technology through a combination of increased surface area and small length scales that lead to…read more

Posted in Number 3 | Comments Off

Thermal Facts & Fairy Tales: Virtual Prototyping

September 5th, 2014

Peter Rodgers, The Petroleum Institute, Abu Dhabi, United Arab Emirates The focus of the article is on the use of computational fluid dynamics (CFD) as a virtual prototyping tool for electronics thermal design. However, first…read more

Posted in Number 3 | Comments Off

CVD Diamond – Integrating a Superior Thermal Material

September 5th, 2014

T. Obeloer (thomas.obeloer@e6.com), B. E. Bolliger Introduction: As semiconductor devices continue to increase in power density, heat fluxes are becoming extremely high (several 10’s of kW/cm2), and can represent, for example in GaN RF devices,…read more

Posted in Number 3 | Comments Off

Jet Impingement on Micro Pin Fins

September 5th, 2014

Dr. Sidy Ndao sndao2@unl.edu Introduction Recent years have witnessed a surge in sophisticated personal portable electronic devices (e.g., smart phones, tablet PCs, and wearable electronics) and emerging technologies requiring extensive computing (e.g., artificial intelligence, signal…read more

Posted in Number 3 | Comments Off

An Inexpensive Multi-Channel AC Heater Control System

September 5th, 2014

Lucien François Dorthe and Paul Kolodner Introduction A commonly-encountered problem in the experimental modeling of thermal-management solutions is the need to independently power many sources of heat. A typical telecomm circuit pack, for example, may…read more

Posted in Number 3 | Comments Off

Estimating the Thermal Interaction between Vertically Stacked Chips in a Multi-Chip Package

September 5th, 2014

Je-Young Chang and Ashish Gupta Email: je-young.chang@intel.com 3D integration is considered a promising packaging technology option to increase transistor density by vertically integrating two or more dice with a dense high-speed interface with shorter interconnect…read more

Posted in Calculation Corner, Number 3 | Comments Off