Posts tagged Air Cooling

Air Flow Through Cooling Technology for Embedded Aerospace & Defense Systems

April 28th, 2012

Curtiss-Wright Controls Defense Solutions has licensed Northrop Grumman Corporation’s recently patented air-flow-through (AFT) cooling technology for use in CWCDS’s rugged, deployed embedded systems. Northrop Grumman’s AFT technology improves the air cooling of advanced electronic modules…read more

Posted in Aerospace, Coolers, New Products, TECs | 2 Comments »

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Company Patents Improved Design for Cooling Electronic Modules

October 25th, 2011

Northrop Grumman Corporation has received a patent for a new design to improve the cooling efficiency of a removable electronic module through enhancements to its physical design, and has begun to license it to other…read more

Posted in Blowers / Fans / Filters, New Products | Comments Off


BMW Liquid Cooled Commuter Scooter

July 11th, 2011

BMW Motorrad’s new scooter has more than a 60-mile range and a recharge time of around three hours. The bike’s specs are possible thanks to an innovative design that uses the aluminum battery casing in…read more

Posted in Automotive, Liquid Cooling, News | 1 Comment »

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Multidirectional Mini Blower for Air-Flow Applications

November 23rd, 2010

Providing a solution for customized air-flow applications, JARO’s new JRB2235 series rotates at 8500 RPMs and produces a powerful 1.2 CFM of super-cooled air (with a static pressure of .122″ of H2O). Operating voltage is…read more

Posted in Applications, Blowers / Fans / Filters, New Products | 3 Comments »

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Small LED Cooler for Spot Lights Packs

June 7th, 2010

Nuventix, Inc. has  announced a SynJet Spot Light Cooler for 10 – 30 Watt track and directional downlight applications as small as 75mm in diameter. The air-cooled, fanless design enables 2000 lumens in small profile,…read more

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Thermostatically Controlled Fan Cord

May 10th, 2010

Gardtec Incorporated’s Green Fan Cord, a thermostatically controlled fan cord, allows AC fans to turn on/off as system ambient temperature calls for additional cooling. The fan cord will turn on cooling fans as ambient temperatures…read more

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Department of Energy announces $100 million for innovative research projects

March 30th, 2010

At the inaugural ARPA-E Energy Innovation Summit, U.S. Energy Secretary Steven Chu announced $100 million in Recovery Act funding will be made available to accelerate innovation in green technology, increase America’s competitiveness and create new…read more

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Back to the Future with a Liquid Cooled Supercomputer

August 1st, 2009

Introduction: Evolution of Air and Water Cooling for Electronic Systems Since the development of the first electronic digital computers in the 1940s, efficient removal of heat has played a key role in insuring the reliable…read more

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Lowering a Notebook CPU Temperature Using a Dual-Tunnel Blower

August 1st, 2009

Figure 1. Side by side comparison of blower technologies. Introduction Notebook computers on the market today may be classified in three categories. In the first category are the super slim and powerful notebooks such as…read more

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Synthetic jets for forced air cooling of electronics

May 1st, 2007

Introduction As increasing functionality is packaged into ever-shrinking electronics, cooling requirements rise exponentially. While there have been continued advances in high heat flux technologies [1], commercial, consumer-oriented systems continue to focus on aircooling for reasons…read more

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Exploring the Limits of Air Cooling

August 1st, 2006

Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However,…read more

Posted in Blowers / Fans / Filters, Coolers, Design, Heat Sinks, Liquid Cooling, Semiconductor, Test & Measurement | 1 Comment »

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High Powered Chip Cooling — Air and Beyond

August 1st, 2005

Introduction Over the past few years many people in the electronics industry have become concerned with the increases in heat density at both the chip and module level of packaging. This trend is not new…read more

Posted in Blowers / Fans / Filters, Design, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Semiconductor | Comments Off

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Latest Developments In Thermoelectrically Enhanced Heat Sinks

August 1st, 2005

Nomenclature Q Heat load (W) COP Coefficient of Performance I Electrical current (Amps) T Temperature (°C) R Electrical resistance (Ohms) Z TE Figure of Merit (1/K) where Z = α2 / (ρ λ)    …read more

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Estimating Temperatures in an Air-cooled Closed Box Electronics Enclosure

February 1st, 2005

Introduction In the majority of air-cooling applications, openings or vents are provided in the enclosure or box in which the electronic components are housed. The required cooling air is drawn in from outside the box…read more

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