Posts tagged Ball Grid Array

Thermal Vias – A Packaging Engineer’s Best Friend

August 1st, 2004

Introduction In the 1990′s, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the…read more

Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | 1 Comment »

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The Many Flavors of Ball Grid Array Packages

February 1st, 2002

By now, it is a tired truism to say that the consumer electronics industry has consistently delivered on its promise to provide products that are smaller, faster, and more feature-rich at an ever cheaper price.…read more

Posted in Design, Semiconductor, Test & Measurement | Comments Off

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