Introduction In the 1990′s, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the…read more
Thermal Vias – A Packaging Engineer’s Best Friend
August 1st, 2004
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | 1 Comment »
The Many Flavors of Ball Grid Array Packages
February 1st, 2002
By now, it is a tired truism to say that the consumer electronics industry has consistently delivered on its promise to provide products that are smaller, faster, and more feature-rich at an ever cheaper price.…read more
Posted in Design, Semiconductor, Test & Measurement | No Comments »
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