A North Carolina State University researcher has developed a technique that uses a “heat spreader” made of a copper-graphene composite, which is attached to the electronic device using an indium-graphene interface film, both of which…read more
Researcher Finds Cheaper Way To Cool Electronic Devices
April 20th, 2012
Posted in Coolers, News, TECs | No Comments »
Thermally Conductive Grease Used for Solar Industry
May 10th, 2011
A product that is proving useful to the solar industry is LORD Corporation’s TC-501 Thermally Conductive Grease. This solvent-free, silicone thermal interface material (TIM) is designed to replace greases used as TIMs between the heat…read more
Posted in New Products, TIMs | No Comments »
Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management
November 1st, 2008
Introduction Due to the increasing power density in today’s industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and…read more
Posted in Heat Sinks, Technical Brief | No Comments »
Diamonds are a Thermal Designer’s Best Friends
February 1st, 2002
Different forms of carbon, such as processed natural graphite, pyrolytic graphite, diamond-like carbon, and synthetic diamond, offer lots of possibilities for maximizing conductive heat transfer.Synthetic diamond has already found its place as a common solution…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Data, Test & Measurement | No Comments »
The Role of Natural Graphite in Electronics Cooling
August 1st, 2001
Graphite is available as a variety of different material forms, the most useful in the electronics cooling market being pyrolytic graphite, graphite fiber reinforced carbon and polymer matrix composites, graphite foams and, the subject of…read more
Posted in Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief, TIMs | No Comments »
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