Mentor Graphics is offering a new web-based tool for thermal characterization and design of semiconductor packages. FloTHERM® IC reduces the time spent on thermal characterization and design by providing an automated process that includes pre-verified…read more
Semiconductor Package Thermal Characterization and Design
February 24th, 2010
Posted in New Products | No Comments »
LED Thermal Standardization: A Hot Topic
May 9th, 2009
Introduction The main topic of the article is how to cope with the increasing need for standardization of thermal characterization of LEDs (Light Emitting Diodes) and LED-based products (see Fig.1 showing a typical LED package).…read more
Posted in Aerospace, Applications, Automotive, Communications, Consumer, Defense, Industrial, Industries, IT Products, Medical, Power, Test & Measurement | No Comments »
When Moore Is Less: Exploring the 3rd Dimension in IC Packaging
February 1st, 2009
Introduction As consumers of electronics we have become spoiled. We not only expect our electronic devices to get smaller, faster, more functional, cheaper, more interconnected, and more reliable, we actually demand it. It would not…read more
Posted in Design, Semiconductor | No Comments »
Simplified transient model for IC packages
August 1st, 2002
Previous installments of this column have all dealt with situations in which the die temperature was assumed to be at a constant temperature after the system had achieved the steady state. However, there are many…read more
Posted in Calculation Corner, Design, Test & Measurement | No Comments »
Advanced Techniques for IC Surface Temperature Measurement
February 1st, 2002
Introduction: The Need for IC Surface Measurement Techniques Current trends in microelectronic design generate challenges in both the design and test of integrated circuits (ICs). One area that has been gaining increased relevance with regard…read more
Posted in Design, Test & Measurement | No Comments »
Packaging: designing for thermal performance
May 1st, 1997
Figure 1. Various leadframe and BGA packages Introduction The well-established trend within the electronics industry to provide everincreasing computing power at less cost seems to defy the laws of economics.However, this industry has not been…read more
Posted in Design | No Comments »
How to Select a Heat Sink
June 1st, 1995
With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life…read more
Posted in Design, Heat Sinks, Semiconductor, Test & Measurement | 2 Comments »
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