Introduction Since the development of the first electronic computers in the 1940s, thedevelopment of faster and denser circuit technologies and packages has beenaccompanied by increasing heat fluxes at the chip and package levels. Over theyears,…read more
Direct liquid immersion cooling for high power density microelectronics
May 1st, 1996
Posted in Computer, Coolers, Design, Liquid Cooling, Test & Measurement | No Comments »
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