Introduction Since the development of the first electronic computers in the 1940s, thedevelopment of faster and denser circuit technologies and packages has beenaccompanied by increasing heat fluxes at the chip and package levels. Over theyears,…read more
May 1st, 1996
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- Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense
- Data Center Energy Savings: Total Liquid Cooling versus Indirect Liquid Cooling
- An All-Silicon Field Programmable Thermal Emulator for Integrated Circuits
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