It is well known that the thermal properties of heating or cooling fluids play a major role in the development of energy-efficient heat transfer equipment. However, conventional heat transfer fluids such as water, ethylene glycol…read more
Heat Transfer Enhancement By Using Nanofluids For Cooling Of High Heat Output Microprocessor
November 1st, 2004
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement | No Comments »
Electroosmotic Microchannel Cooling System for Microprocessors
November 1st, 2002
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and…read more
Posted in Coolers, Design, Heat Pipes, Heat Sinks, Liquid Cooling, Semiconductor, Technical Brief | No Comments »
Numerical Modeling and Experimental Verification of High-density Servers
November 1st, 2002
High-density hardware and software are developed as part of an initiative to greatly increase data center compute densities. Concept systems presented here are based on the Intel® Itanium™ processor family and are designed for a…read more
Posted in Blowers / Fans / Filters, Computer, Design, Heat Sinks, IT Products, Power, Semiconductor, Test & Measurement | No Comments »
The history of power dissipation
January 1st, 2000
Figure 1. Transistor counts on Intel processors from inception to present superimposed on Moore’s prediction. In his fascinating book, “Visions,” Michio Kaku [1] predicts a future driven by silicon and quantum computers. Based on the…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
Recent Japanese thermal solutions for portable computers
September 1st, 1998
Introduction Mobile computing is poised to shape the way we live our lives, allowing people to generate, retrieve, and process data anywhere and at any time. The infrastructure for mobile computing is rapidly developing, as…read more
Posted in Blowers / Fans / Filters, Computer, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »
Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example
May 1st, 1998
Fig. 1: Levels in a computer environment. Introduction Increasing demands for higher performance in microprocessors have a direct effect on chip power and heat generation. Increased function and miniaturization of the packages result in thermal…read more
Posted in Blowers / Fans / Filters, Computer, Data Centers, Design, Heat Sinks, IT Products, Semiconductor, Test & Measurement | No Comments »
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