Toward A Thermal Figure Of Merit For Multi-Chip Packages Bruce M. Guenin, Ph.D., Associate Editor Introduction Last issue’s Calculation Corner dealt with methods for predicting the temperature of each chip in a Multi-Chip Package (MCP)…read more
Toward A Thermal Figure Of Merit For Multi-Chip Packages
November 1st, 2006
Posted in Calculation Corner, Design, Semiconductor, Test & Measurement | 1 Comment »
So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages
August 1st, 2006
Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use…read more
Posted in Calculation Corner, Design, Semiconductor, Test & Measurement | No Comments »
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