When a major UK financial institution for retail and commercial banking underwent a major refurbishment program earlier this year, it replaced the IT and computer server systems in one of the two data center’s data…read more
Variable Speed EC Fans Make Data Center Condenser More Efficient
November 22nd, 2011
Posted in Blowers / Fans / Filters, Data Centers, News | 1 Comment »
Miniature Environmental Control Unit for Electronics
April 27th, 2010
Aspen Systems has completed the development and military qualification of ECU-Chill™, a ruggedized refrigeration-based environmental control unit (ECU) for cooling electronics in mobile applications. ECU-Chill™ maintains sealed electronics enclosures at or below ambient temperatures, enabling Commercial-Off-The-Shelf…read more
Posted in Applications, Communications, Coolers, Defense, Industries, New Products | No Comments »
Department of Energy announces $100 million for innovative research projects
March 30th, 2010
At the inaugural ARPA-E Energy Innovation Summit, U.S. Energy Secretary Steven Chu announced $100 million in Recovery Act funding will be made available to accelerate innovation in green technology, increase America’s competitiveness and create new…read more
Posted in Applications, Coolers, News | No Comments »
A Cryocooler In Your Laptop Computer? Maybe…
November 1st, 2008
Introduction A review of the technical and market impediments overcome in the development and eventual acceptance of cryocoolers for space-borne applications may shine light on the prospects for the use of such mechanical refrigeration systems…read more
Posted in Aerospace, Coolers, Defense, Design | No Comments »
A Simple Method To Estimate The Physical Characteristics Of A Thermoelectric Cooler From Vendor Datasheets
August 1st, 2008
Introduction A thermoelectric cooler (TEC) is a solid-state refrigerator that operates on the Peltier effect. The absence of moving parts, compact size, precise temperature control ability and reliability all combine to make the TEC a…read more
Posted in TECs | No Comments »
2U Rack Mountable Vapor Compression Cooling System For High Power Electronics
May 1st, 2008
Vapor compression refrigeration has long been used to cool telecommunications equipment and some high performance computers. On the whole, however, its usage has been confined to high-value, relatively large, and stationary applications. The advantages of…read more
Posted in Coolers, Technical Brief, Test & Measurement | No Comments »
Computer-related thermal packaging at the millenial divide
January 1st, 2000
Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as…read more
Posted in Communications, Computer, Coolers, Data Centers, Design, Heat Sinks, IT Products, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, Power, Semiconductor | No Comments »
Recent Posts
- Measured Thermal Resistance of Microbumps in 3D Chip Stacks
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- New Metal Oxide-Silicone Thermal Compound Offers Thermal Conductivity of 7.5W/mK
- New Customizable Heat Sinks for Use in High Power Environments and Resistors
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