Rehm Thermal Systems has appointed Michael Hanke as its new head of worldwide sales. Hanke brings to RTS over 20 years of experience in the electronics and semiconductor production sector. Hanke successfully completed his studies…read more
Rehm Thermal Systems Appoints New Sales Director
May 22nd, 2012
Posted in News, Semiconductor | No Comments »
Graphene-Graphite “Quilt” Removes and Spreads Heat from Hot Spots
May 22nd, 2012
A group of researchers at the University of California, Riverside Bourns College of Engineering have developed a technique to keep cool a semiconductor material used in everything from traffic lights to electric cars. Gallium Nitride…read more
Posted in News, Semiconductor, TECs | No Comments »
Small Bumps in “Semiconductor Billiards” Have Unexpectedly Large Effect
May 22nd, 2012
There’s nothing worse than a pool table with an unseen groove or bump that sends your shot off course: a new study has found that the same goes at the nano-scale, where the “billiard balls”…read more
Posted in News, Semiconductor, Test & Measurement | No Comments »
SEMI-THERM Honors Contributor to Semiconductor Thermal Management
March 19th, 2012
The THERMI award is intended to recognize a recipient’s history of contributions to crucial thermal issues affecting the performance of semiconductor devices and systems. The voting body of past THERMI winners and the current year…read more
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Cooling Semiconductor with Laser Light
February 7th, 2012
Researchers at the Niels Bohr Institute have discovered a new method for laser cooling semiconductor membranes. Semiconductors are vital components in solar cells, LEDs and many other electronics, and the efficient cooling of components is…read more
Posted in Coolers, LED / Lighting, News, Semiconductor, TECs | 1 Comment »
Forced Convection Heat Sink Thinner than a Credit Card
May 23rd, 2011
Novel Concepts, Inc. has developed and has patents pending for the world’s thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs…read more
Posted in Heat Sinks, New Products | No Comments »
Connector/Decoupler Integrated in a Heat Sink
April 11th, 2011
United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from…read more
Posted in Heat Sinks, News | No Comments »
Groups Develop Thermal Nanotape for Packaging
February 4th, 2011
(a) A nanostructured interface material is used around the module; (b) a nanostructured interface material is used between the thermoelectric material and metal leads. Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed…read more
Posted in News, Semiconductor, TIMs | No Comments »
LED Lighting Reference Designs with IC Houses
November 9th, 2010
Working closely with various IC manufacturers, Wurth Electronics Midcom released several new transformers and inductors designed for LED lighting applications. These components maximize operational efficiency while maintaining a compact size for small form factor circuit…read more
Posted in LED / Lighting, New Products, Semiconductor | No Comments »
Analysis System Ensures Optimal Heat Sink Efficiency
October 25th, 2010
The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and semiconductor. With Tactilus, engineers…read more
Posted in Heat Sinks, New Products, Semiconductor | No Comments »
Reinforced TIM Integrates Nylon Mesh Layer
September 28th, 2010
Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. When placed between…read more
Posted in Heat Sinks, Materials, Compounds, Adhesives, Substrates, New Products, Semiconductor | No Comments »
Austrian Company Acquires Electronic Component Producers
September 14th, 2010
Miba, a partner to the international engine and automotive industry, has acquired two Austrian producers of power electronics components such as resistors and cooling systems for power electronics. EBG, based in Styria, Austria, is a…read more
Posted in Automotive, Industrial, News | No Comments »
transient dual interface measurement of the rth-jc of power semiconductor packages
September 13th, 2010
Dirk Schweitzer Infineon Technologies AG Introduction The junction-to-case thermal resistance Rth-JC is an important thermal characteristic especially for power semiconductor devices. Its value is often one of the main criteria for the decision whether a…read more
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IC Package Thermal Characterization Made Easy
April 13th, 2010
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and…read more
Posted in Applications, New Products, Semiconductor, Software | No Comments »
Recent Posts
- New Business Development Specialist Seeks Position
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- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
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