Posts tagged Semiconductor

Rehm Thermal Systems Appoints New Sales Director

May 22nd, 2012

Rehm Thermal Systems has appointed Michael Hanke as its new head of worldwide sales. Hanke brings to RTS over 20 years of experience in the electronics and semiconductor production sector. Hanke successfully completed his studies…read more

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Graphene-Graphite “Quilt” Removes and Spreads Heat from Hot Spots

May 22nd, 2012

A group of researchers at the University of California, Riverside Bourns College of Engineering have developed a technique to keep cool a semiconductor material used in everything from traffic lights to electric cars. Gallium Nitride…read more

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Small Bumps in “Semiconductor Billiards” Have Unexpectedly Large Effect

May 22nd, 2012

There’s nothing worse than a pool table with an unseen groove or bump that sends your shot off course: a new study has found that the same goes at the nano-scale, where the “billiard balls”…read more

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SEMI-THERM Honors Contributor to Semiconductor Thermal Management

March 19th, 2012

The THERMI award is intended to recognize a recipient’s history of contributions to crucial thermal issues affecting the performance of semiconductor devices and systems. The voting body of past THERMI winners and the current year…read more

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Cooling Semiconductor with Laser Light

February 7th, 2012

Researchers at the Niels Bohr Institute have discovered a new method for laser cooling semiconductor membranes. Semiconductors are vital components in solar cells, LEDs and many other electronics, and the efficient cooling of components is…read more

Posted in Coolers, LED / Lighting, News, Semiconductor, TECs | 1 Comment »

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Forced Convection Heat Sink Thinner than a Credit Card

May 23rd, 2011

Novel Concepts, Inc. has developed and has patents pending for the world’s thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs…read more

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Connector/Decoupler Integrated in a Heat Sink

April 11th, 2011

United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from…read more

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Groups Develop Thermal Nanotape for Packaging

February 4th, 2011

(a) A nanostructured interface material is used around the module; (b) a nanostructured interface material is used between the thermoelectric material and metal leads. Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed…read more

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LED Lighting Reference Designs with IC Houses

November 9th, 2010

Working closely with various IC manufacturers, Wurth Electronics Midcom released several new transformers and inductors designed for LED lighting applications. These components maximize operational efficiency while maintaining a compact size for small form factor circuit…read more

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Analysis System Ensures Optimal Heat Sink Efficiency

October 25th, 2010

The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and semiconductor. With Tactilus, engineers…read more

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Reinforced TIM Integrates Nylon Mesh Layer

September 28th, 2010

Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. When placed between…read more

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Austrian Company Acquires Electronic Component Producers

September 14th, 2010

Miba, a partner to the international engine and automotive industry, has acquired two Austrian producers of power electronics components such as resistors and cooling systems for power electronics. EBG, based in Styria, Austria, is a…read more

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transient dual interface measurement of the rth-jc of power semiconductor packages

September 13th, 2010

Dirk Schweitzer Infineon Technologies AG Introduction The junction-to-case thermal resistance Rth-JC is an important thermal characteristic especially for power semiconductor devices. Its value is often one of the main criteria for the decision whether a…read more

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IC Package Thermal Characterization Made Easy

April 13th, 2010

FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and…read more

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