Researchers at the Niels Bohr Institute have discovered a new method for laser cooling semiconductor membranes. Semiconductors are vital components in solar cells, LEDs and many other electronics, and the efficient cooling of components is…read more
Cooling Semiconductor with Laser Light
February 7th, 2012
Posted in Coolers, LED / Lighting, News, Semiconductor, TECs | No Comments »
Forced Convection Heat Sink Thinner than a Credit Card
May 23rd, 2011
Novel Concepts, Inc. has developed and has patents pending for the world’s thinnest forced convection (fan cooled) heat sink dubbed ThinSink™. Thinner than a credit card, this low profile ThinSink cools integrated circuits, semiconductors, LEDs…read more
Posted in Heat Sinks, New Products | No Comments »
Connector/Decoupler Integrated in a Heat Sink
April 11th, 2011
United States Patent no. 7,898,078, issued on March 1, was assigned to International Business Machines Corp. Two sets of conductor fins are formed on a topmost surface of stacked semiconductor chips are electrically isolated from…read more
Posted in Heat Sinks, News | No Comments »
Groups Develop Thermal Nanotape for Packaging
February 4th, 2011
(a) A nanostructured interface material is used around the module; (b) a nanostructured interface material is used between the thermoelectric material and metal leads. Semiconductor Research Corporation (SRC) and researchers from Stanford University have developed…read more
Posted in News, Semiconductor, TIMs | No Comments »
LED Lighting Reference Designs with IC Houses
November 9th, 2010
Working closely with various IC manufacturers, Wurth Electronics Midcom released several new transformers and inductors designed for LED lighting applications. These components maximize operational efficiency while maintaining a compact size for small form factor circuit…read more
Posted in LED / Lighting, New Products, Semiconductor | No Comments »
Analysis System Ensures Optimal Heat Sink Efficiency
October 25th, 2010
The new Tactilus® heat-sink analysis system by Sensor Products Inc. enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and semiconductor. With Tactilus, engineers…read more
Posted in Heat Sinks, New Products, Semiconductor | No Comments »
Reinforced TIM Integrates Nylon Mesh Layer
September 28th, 2010
Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. When placed between…read more
Posted in Heat Sinks, Materials, Compounds, Adhesives, Substrates, New Products, Semiconductor | No Comments »
Austrian Company Acquires Electronic Component Producers
September 14th, 2010
Miba, a partner to the international engine and automotive industry, has acquired two Austrian producers of power electronics components such as resistors and cooling systems for power electronics. EBG, based in Styria, Austria, is a…read more
Posted in Automotive, Industrial, News | No Comments »
transient dual interface measurement of the rth-jc of power semiconductor packages
September 13th, 2010
Dirk Schweitzer Infineon Technologies AG Introduction The junction-to-case thermal resistance Rth-JC is an important thermal characteristic especially for power semiconductor devices. Its value is often one of the main criteria for the decision whether a…read more
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IC Package Thermal Characterization Made Easy
April 13th, 2010
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and…read more
Posted in Applications, New Products, Semiconductor, Software | No Comments »
THERMINATOR Project Warms Efforts to Cool Semiconductor Design Solutions
April 12th, 2010
The partners in a new EU-funded research project recently announced details of the multinational/multidisciplinary program: “THERMINATOR: Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future.” This three-year project is designed to…read more
Posted in Applications, News, Semiconductor | No Comments »
Thermal Modeling Approaches Of GaAs Semiconductors
February 1st, 2008
Introduction Predicting gallium arsenide (GaAs) semiconductor temperature is imperative since it affects the performance and reliability of the chip and the design as a whole. In many circumstances, the thermal engineer will be asked to…read more
Posted in Design, Semiconductor, Test & Measurement | No Comments »
Thermal Strain In Semiconductor Packages, Part I
August 1st, 2007
Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low,…read more
Posted in Calculation Corner, Design, Materials, Compounds, Adhesives, Substrates, Test & Measurement | No Comments »
Thermal Challenges In LED Cooling
November 1st, 2006
Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting…read more
Posted in Blowers / Fans / Filters, Coolers, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Semiconductor, TECs, Test & Measurement | 1 Comment »
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