A product that is proving useful to the solar industry is LORD Corporation’s TC-501 Thermally Conductive Grease. This solvent-free, silicone thermal interface material (TIM) is designed to replace greases used as TIMs between the heat…read more
Thermally Conductive Grease Used for Solar Industry
May 10th, 2011
Posted in New Products, TIMs | No Comments »
Low Resistance, Zero Pump-Out Thermal Pad
March 18th, 2011
AOS Thermal Compounds’ Microfaze 3 A-4 is a non-silicone thermal pad that exhibits low thermal resistance. It was designed to replace phase change materials and even high performance thermal grease. The pad is composed of…read more
Posted in Materials, Compounds, Adhesives, Substrates | No Comments »
Thermal Grease Provides Thermal Conductivity, Electronic Insulation
October 25th, 2010
Shenzhen Halnziye Electronics Co., Ltd., offers heat sink compounds Thermal Grease Provides Thermal Conductivity, Electronic Insulation, heat sink plaster, heat sink flow and thermal pads. Shenzhen Halnziye’s thermal grease provides high quality thermal conductivity, electronic…read more
Posted in Heat Sinks, Materials, Compounds, Adhesives, Substrates, New Products | 1 Comment »
Thermal Grease Screen Printers
August 23rd, 2010
Surface Mount Techniques (SMT) announces stencil/screen printers specifically designed for thermal grease applications. Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. The demand is seen…read more
Posted in Automotive, Computer, Consumer, Materials, Compounds, Adhesives, Substrates, New Products | No Comments »
Heat Sink Reliability Risks from Thermal Greases
May 25th, 2010
ATS Thermal Labs has published a white paper, “Long term Thermal Grease Reliability.” It considers how long term heat sink reliability is affected by the use of thermal greases as thermal interface materials. The implications…read more
Posted in Applications, Heat Sinks, News, TIMs | No Comments »
Reliability Testing Of Thermal Greases
November 1st, 2007
Introduction Thermal Interface Materials (TIMs) play a key role in the thermal management of electronic systems by providing a path of low thermal resistance between the heat generating devices and the heat spreader/sink. Typical TIM…read more
Posted in Materials, Compounds, Adhesives, Substrates, Test & Measurement, TIMs | No Comments »
Recent Posts
- Apple Releases Software Update to Fix Fan Speed Problem in 2013 Retina MacBook Pro Models
- Asetek Files Patent Infringement Lawsuit Against Cooler Master
- Thermally Conductive Acrylic Interface Pads Provide ‘Excellent Conformability’ and ‘Compressive Stress Relaxation’
- Electronics Cooling Simulation Software Enables ‘Earlier Virtual Prototyping’, ‘Fewer Design Iterations’ in MDA and EDA Domains
- Special Evening Program at SEMI-THERM March 20
- Workshop on Composite Preforms at SEMI-THERM
- Fourth Quarter Financial Results Conference Call
- Heat Transfer at ‘Any Temperature’ Makes Thermal Interface Film Suitable for Cold Plate Applications
Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
Popular Posts
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Seebeck Coefficient 3 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 11 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
