Posts tagged Thermal Interface pads

Reinforced TIM Integrates Nylon Mesh Layer

September 28th, 2010

Fujipoly released Sarcon 100GR-FL, a low resistance, durable thermal interface gap filler pad. The gel-like material is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations. When placed between…read more

Posted in Heat Sinks, Materials, Compounds, Adhesives, Substrates, New Products, Semiconductor | Comments Off

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Thermal Gap Fillers Combine High Performance, Low Pricing

August 23rd, 2010

New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are…read more

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