Previous Technical Data columns have covered thermal properties for many of the materials that are common to electronics packaging. The Technical Data for this issue is broader in scope and addresses common building materials, some…read more
Thermal Properties Of Building Materials
February 1st, 2008
Posted in Materials, Compounds, Adhesives, Substrates, Technical Data | No Comments »
Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks
February 1st, 2006
Introduction With thermal solutions becoming more challenging, there is a push for novel cooling ideas or materials to further mitigate thermal issues facing today’s electronics. In these design situations, the proven method of analytical calculations,…read more
Posted in Aerospace, Design, Heat Sinks, Materials, Compounds, Adhesives, Substrates, Technical Brief, Test & Measurement | No Comments »
Phase Change Material Thermal Properties
May 1st, 2005
Table 1. General Solid-Liquid PCM Characteristics [1] When electronics are operated under transient conditions, increasing the thermal capacitance is a useful technique for limiting temperature increases and/or minimizing the performance requirements of a heat sink.…read more
Posted in Design, Materials, Compounds, Adhesives, Substrates, Technical Data, TIMs | No Comments »
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