Several trends are influencing thermal management in military and aerospace environments, including smaller electronic packages, components that fit into tighter spaces, and more powerful chips and IC packages. Packing more powerful components into smaller air-tight spaces creates major heat dissipation problems, an example of how size, weight, and power (SWaP) constraints exacerbate the thermal management problem for avionics and military electronics designers, developers, and integrators. A recent Avionics Intelligence article reviews some of the many thermal challenges facing the military community and what companies are doing to help combat the problem.
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