Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Sept. 20-21, Nashville, Tenn.
This event will feature presentations on the latest advancements in thermal management and thermal technology for electronics packaging and cooling, temperature sensing and control, thermal materials, systems design and management for optimizing thermal properties. Topics will include new thermal technology, commercial applications of recent research and development in thermal science, and the latest mar ket trends in thermal materials, products and systems.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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