May 30- June 1, 2012, San Diego, Calif.
ITherm 2012 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. In addition to paper and poster presentations and vendor exhibits, ITherm 2012 will include panel discussions, keynote lectures by prominent speakers, and professional short courses.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.





